• The Transactions of the Korean Institute of Electrical Engineers C
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• v.52 no.12
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• pp.579-585
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• 2003

Recently the utilization of the ozone dissolved de-ionized water(DI-O3 water) in semiconductor wet cleaning process to replace the conventional RCA methods has been studied. In this paper, we propose the water-electrode type ozone generator which has the ozone gas characteristics of the high concentration and high purity to produce the high concentration DI-O3 water for the silicon wafer surface cleaning process. The ozone generator has the dual dielectric tube structure of silent discharge type and the water is both used to electrode and cooling water. We investigate the performance of the proposed ozone generator which has the design goal of the concentration of 7[wt%] and ozone generation quantity of 6[g/hr] at flow rate of 1[$\ell$/min). The experiment results show that the water electrode type ozone generator has the characteristics of 8.48[wt%] of concentration, 8.08[g/hr] of generation quantity and 76.2[g/kWh] of yield and it's possible to use the proposed ozone generator for the DI-O3 water cleaning process of silicon wafer surface.

• Journal of Korean Society of Environmental Engineers
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• v.38 no.6
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• pp.309-316
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• 2016

In this study, sewage was fed with up flow direction into a reactor equipped with a screw to circulate media that had lower specific gravity than water. It was observed that the media in the reactor could be circulated by a screw with reverse flow of the sewage feeding from the top to the bottom direction. Under these conditions, concentrations of inflow and outflow pollutants were measured at the filtration unit. Experimental results revealed stable circulation of the media with a screw in the reactor. Circulation of the media in the reactor showed more efficiency in removing the pollutants (particulate matters and organics) than no circulation. The maximum removal efficiencies of suspended solid (SS), chemical oxygen demand (CODmn), and total phosphorus (T-P) were 96%, 72% and 65%, respectively. Improvements for SS, CODmn and T-P removals with circulation of media were 52.38%, 43.14% and 118.12% respectively, compared to those without circulation.

• Analytical Science and Technology
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• v.6 no.5
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• pp.521-530
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• 1993

According to the Montreal Protocol, CFC 113, one of the ozone-depleting substances, will be prohibited to use as a cleaning solvent essentially in the electronic industry. Therefore, the development of the alternative cleaning solvents to CFC 113 is being accelerated. A number of the alternative cleaning solvents are avialable on the market. The alternatives of Axarel 32(DuPont), Cleanthru 750H(KAO Chemical), and EC-Ultra(Petroferm) are chosen for the comparison of cleaning performance with CFC 113. The test methods for measuring the cleaning performance were composed of the measurement of the physical properties, the experiments on the material compatibility with cleaning solvents, the measurement of the evaporation rate, and finally the experiments of the removal efficiency. Normally the basic physical properties of the alternatives had higher boiling points, viscosity and surface tension, which were quite different to those of CFC 113. In terms of solubility of rosin-based flux, the solubilities of abietic acid (nonpolar organic) were similar, but those of the activator (polar organic) in the alternatives were better than CFC 113. The evaporation of the alternatives was very slow, compared to CFC 113, which had much lower boiling point. All the cleaning solvents showed the good material compatibility with FR4 and Cu-coated PCB. The better removal efficiencies of abietic acid were obtained when using the ultrasonic mechanical energy over the dipping method. The experiments also indicated the very slow-eavaporating solvent was not desirable with the dipping cleaning method, and the differences in the removal efficiency of the alternatives with the ultrasonic cleaning method were negligible. Among the alternatives, the overall cleaning performances were obsorved as almost similar. Before selecting the ultimate cleaning solvent, the application of cleaning machine, environmental issues, and economics are simultaneously considered with the cleaning performance.

• Journal of Auto-vehicle Safety Association
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• v.9 no.3
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• pp.39-45
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• 2017

Two-wheeled motorcycles rarely use windscreen wipers in general. However, if two or more wheeled motorcycles with upper body employ windscreen wiper systems, clear visibility should be ensured regardless of weather conditions. The windscreen wiper systems include washers, defrosting, and demisting. As demands for the personal mobility are rapidly increased, the related global safety standards for motorcycles with upper body have been revised accordingly. Currently only EU regulations issue the provisions of windscreen wiper systems for L-category vehicles, which characterize two or more wheeled motorcycles. Therefore, in order to agree with international safety standards, it is necessary to revise KMVSS (Korea Motor Vehicle Safety Standards) for motorcycles. Here, KMVSS regarding windscreen wiper systems for motorcycles are studied considering the EU regulations. It is expected that the findings in this study are useful for future amendment of KMVSS.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.364-365
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• 2006

Transverse some wave was generated by T type waveguide for single wafer cleaning application T type megasonic waveguide was analyzed by acoustic pressure measurements and particle removal efficiency. Compared to conventional longitudinal waves, not like longitudinal waves, transverse waves showed changes of direction and phase which increased the cleaning efficiency.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2004.05a
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• pp.123-128
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• 2004

Semiconductor Wet Station has a very important place in semiconductor process. It is important that to discharge chemical with fit concentration and temperature using chemical supply system for clean process. The chemical supply system which is used currently is not only difficult to make a fit mixing rate of chemical which is need in clean process, but also difficult to make fit concentration and temperature. Moreover, it has high stability but it is inefficient spatially because its volume is great. We propose In-line System to improve system with implement analysis of fluid and thermal transfer on chemical supply system and understand problem of system.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.201.1-201.1
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• 2013

자기애자는 전차선로 설비에서 가장 중요한 전기절연재료이지만, 내충격에 결함이 있고 파괴되기 쉽고, 무거워 취급에 어려움이 따른다. 이러한 자기애자의 단점을 해결하기 위하여 고분자 애자의 개발이 진행되어지고 있다. 그러나 고분자 애자의 경우 재질 특성상 자기 애자보다 분진의 부착이 쉽고 부착된 분진의 세척이 어려운 단점이 있어, 장기 사용 시 특성 변화가 우려된다. 본 연구에서는 TiO2 세라믹 타겟이 부착된 비대칭 마그네트론 스퍼터링 장치를 이용하여 TiO2 박막을 증착하였으며 증착되어진 TiO2 박막의 광촉매 특성과 트라이볼로지 특성을 고찰하였다. 광촉매 특성으로는 표면 접촉각 분석을 통하여 고찰하였으며, 트라이볼로지 특성으로는 경도, 잔류응력, 마찰계수, 표면 거칠기 등을 평가하였다. 또한 XRD, FESEM 분석 등 구조분석을 통하여 광촉매 특성과 트라이볼로지 특성등과의 연관성을 규명하였다.

• Clean Technology
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• v.17 no.4
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• pp.306-313
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• 2011

Flux or solder is used in soldering process for manufacturing electronic parts such as printed circuit boards (PCB). After soldering process, residual flux and solder paste on the parts should be removed since their residuals could cause performance degradation or failure of parts due to their corrosion and electric leakage. Ozone depletion substances such as 1,1,1- trichloroethane (TCE) and HCFC-141b have widely been using for removal of residual flux and solder paste after soldering process In manufacturing of electronic parts until now. In this study, non-aqueous cleaning agents without flash point were developed and applied to industrial field for replacement of cleaning agents with ozone depletion. In order to develop non-aqueous cleaning agents without ethers, esters, fluoride- type solvents. And their physical properties and cleaning abilities were evaluated, and they were applied to industrial fields for cleaning of flux and solder on the PCB. And vacuum distillation apparatus were operated to determine their operating conditions and recycling yields for recycling of used cleaning agents formulated in this study. As a result of physical properties measurement of our formulated cleaning agents, they were expected to have good wetting and penetrating power since their surface tensions were relatively low as 18.0~20.4 dyne/$cm^2$ and their wetting indices are relatively large. And some cleaning agents holding fluoride-type solvents as their components did not have any flash point and they seemed to be safe in their handling and storage. The cleaning experimental results showed that some cleaning agents were better in their cleaning of flux and solder paste than 1,1,1-TCE and HCFC-141b. And industrial application results of the formulated cleaning agents for cleaning PCB indicated that they can be applicable to industry due to their good cleaning capability in comparison with HCFC-141b. The recycling experiments of the used formulated cleaning agents through a vacuum distillation apparatus also showed that their 91.9~97.5% could be recycled with its proper operating conditions.

• Applied Chemistry for Engineering
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• v.7 no.4
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• pp.653-660
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• 1996

For oxygen PSA process development, adsorbed amount of oxygen and nitrogen on various adsorbents were measured corresponding Langmuir isotherm parameters were measured. A reasonable adsorbent for oxygen process was selected based on the effective adsorbed amount. The PSA process consists of adsorption, desorption, pressurization, purging and pressure equilization steps. Adsorption pressure was about 2 atm and desorption pressure was between 120 torr to 400torr. Cycle time of 2-bed PSA process was 80 seconds and that of 3-bed oxygen PSA process was 180 seconds. In order to compare and analyze operation characteristics and economic feasibilities of 2-bed and 3-bed oxygen PSA processes, productivity, oxygen concentration and recovery were compared and the effect of purge and pressurization steps on the performance of PSA processes were analyzed. For the commercial scale oxygen PSA process, capital and electricity cost were estimated. In the range of $O_2$ production less than $700Nm^3/hr$, the 2-bed process is conformed more feasible in economic view point.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.7 no.3
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• pp.153-160
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• 2009

Vertical electrokintic-flushing remediation equipment was developed for the remediation of a radioactive soil near nuclear facilities. An optimum reagent was selected to decontaminate the radioactive soil near nuclear facilities with the developed vertical electrokintic-flushing remediation equipment, and the optimum remediation conditions were established to obtain a higher remediation efficiency. Namely, acetic acid was selected as an optimum reagent due to its higher remediation efficiency. When the electrokinetic remediation and the electrokinetic-flushing remediation results were compared, the removal efficiency of 4.6% and the soil waste solution volume of 1.5 times were increased in the electrokinetic remediation. When the potential gradient within an electrokinetic soil cell was increased by two times (4.0 V/cm), the removal efficiencies of $Co^{2+}$ and $Cs^+$ were increased by about 4.3%($Co^{2+}$ : 98.9%, $Cs^+$ : 96.7%). Also, when the reagent concentration was increased from 0.01M to 0.05M, the removal efficiency of $Co^{2+}$ was increased but that of $Cs^+$ was decreased. Therefore, the optimum remediation conditions were that the acetic concentration was $0.01M{\sim}0.05M$, the potential gredient was 4 V/cm, the injection of reagent 2.4ml/g, and the remediation period was 20days.