• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.10
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• pp.3058-3067
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• 1996

With increasing use of ceramics/metal bonded joints, It is required to analyze the residual stress distribution and stress singularity at an interface edge for its bonded joints. In this paper, the residual stress distribution and stress singularity index of the ceramics/metal bonded joints were analyzed by using 2-dimensional elastic boundary element method. The variations of residual stress distribution and stress singularity index are studied with changes for the combinations of ceramics/metal bodned joints.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.5 no.4
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• pp.53-62
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• 1996

Recently, ceramic / metal bonded joints have led to inccreasing use of structural materials such as automobile, heat engine in various industries. In this paper, a method to analyze an interface crack under both residual stresses and applied loading was proposed. and some results of boundary element method(BEM) analysis Were presented, Fracture thoughness tests of ceramic/metals bonded joints with an interface crack Were carried out, and the stress intensity factors of these joints Ware analyzed by BEM. Also crack propagtion direction was simulated numerically by using BEM. Crack propagation angle was able to easily determine based on the maximum stress concept. The prediction of fracture strength by the fracture thoughness of the ceramics/metals bonded joints was proposed.

• Journal of the Korean Ceramic Society
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• v.30 no.11
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• pp.949-954
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• 1993

Microstructural development at the ZrO2/NiTi bonding interface and reaction products were examined and identified with SEM and AEM. Ti-oxide, Ti2Ni and Ni2Ti layer were observed whose thickness depends on bonding temperature typically. The development of Ti-oxide layer is related with oxygen ion in ZrO2 and liquid phase Ti2Ni. It is considered that compositional deviation from homogeneity and residual stress caused by thermal expansion mismatch are closely related with the formation of the Ti2Ni phase.

• Journal of Welding and Joining
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• v.7 no.2
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• pp.25-34
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• 1989

The purpose of this work is to coat ZrO$_{2}$ - 8Y$_{2}$O$_{3}$ ceramic on the Al cast alloy(AC-8A) by using the plasma spray method. Two types of coatings which were composed of two and three layer coating were examined. Each coating powder was analyzed for shape and size distribution and X-ray diffraction pattern. For the coated layers, microstructural analysis and performance estimation which was composed of static thermal test, thermal cyclic test and thermal shock test were conducted.

• Proceedings of the KWS Conference
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• v.43
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• pp.109-111
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• 2004

20 vol.$\%$ SiC를 포함한 두 층간의 $Si_{3}N_{4}/SiC$ 나노 복합재료는$\alpha$ $-Si_3N_4$,13 nm 크기의 나노탄소 분말 그리고 $5\;wt$\%\;Y_2O_3$의 분말로 두 단계 소결을 통하여 제작된다. $Si_3N_4$ 입계 사이의 결합은 소결 후 변하지 않고 남은 compact와 $51\~62\%$의 기공으로 얻어진 표면적 사이의 반응에 의해 생성된다. 이 연구에서는 Ti 합금을 SiC 층에 브레이징을 이용하여 제작하고 기계적 특성을 연구하였다. 다양한 변형율과 결합물의 강도, 변형율 증가에 따른 층간 변화를 연구하였다. 층간 파괴 형태는 금속과 브레이징 합금 사이의 파괴, 세라믹과 브레이징 합금 사이의 파괴, 그리고 세라믹 내부에서의 파괴를 보였다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2007.11a
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• pp.121.2-121.2
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• 2007

• Ceramist
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• v.12 no.3
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• pp.85-97
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• 2009

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.15 no.2
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• pp.189-194
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• 2015

In this study, the heat radiation performance of COB LED according to the structure of thermoelectric device were compared. Thermoelectric device of the sheet copper structure and ceramic structure were used for bonding with the heating part of the COB LED. The temperature distribution in the bonding part of the thermoelectric device of COB LED was measured with a contact-type thermometer. The temperature variation of the thermoelectric device was measured by inputting the currents of 0.1A, 0.3A, 0.5A, and 0.7A. When 0.7A was applied, the temperature of the bonding part where there was a heat aggregation phenomenon of the COB LED was $59^{\circ}C$ for thermoelectric device of the sheet copper structure and $67^{\circ}C$ for the thermoelectric device of the ceramic structure. Therefore, the sheet copper thermoelectric device whose temperature was lower by $9^{\circ}C$ showed better heat radiation performance than those of the ceramic structure.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.8 no.2
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• pp.76-82
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• 2009

In this papers, Study on the Bonding property and Strength Evaluation in Bonding interface Joints of Dissimilar material using DOE. We found optimal condition that uses experimental design method (Response Surface Analysis, DOE) used temperature, pressure, time on experiment factor. And we could get bonding condition and strength that break and crack do not happen in mechanical processing about united dissimilar material. And progress 3 point bending tests and verified result.

• Journal of the Korean Ceramic Society
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• v.31 no.10
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• pp.1197-1201
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• 1994

The fracture strength and fracture modes were studied in 3Y-TZP/NiNi bonding which change their interfacial structure with bonding condition. Average 4-point bending strength of 200 MPa to 400 MPa were achieved. The formation of Ti-oxide phase at the interface critically influenced the bonding strength and fracture mode. The fracture surface of Ti-oxide free interface contained multiphase in some case including ZrO2. From the result it was confirmed that in order to maximize the bonding strength crack deflection from interface to ceramic was required.