• Title/Summary/Keyword: 세라믹 접합

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A DBC Process on Ceramic IC Sbstrate (세라믹 IC기판에서의 DBC공정)

  • 박기섭
    • Journal of the Microelectronics and Packaging Society
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    • v.5 no.1
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    • pp.39-44
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    • 1998

  • 절연체기판으로서는 아루미나 세라믹 기판을 사용하고 전극으로서는 copper를 사용 하여 DBC공정으로 접합하여 제조하였다. 접합재료는 전처리과정을 거친다음 불활성기체 분 위기 하에서 1065~1083$^{\circ}C$의 온도로 1~60분 동안 유지시켜 접합하였다. 본 실험에서 접합 된 세라믹기판과 Cu의 계면의 SEM 관찰 결과 안정된 접합면이 생성되었으며 접합강도는 약 116MPa로 양호한 값을 얻었다. 또한 Al2O3/Copper 접합계면을 ESCA를 통하여 분석한 결과 CuAlO2의 화합물의 생성을 확인하였다. 이 DBC공정은 제조공정의 단순화를 실현시켜 대량생산에 적합함으로 전자부품 모듈생산에 유용하게 적용될 수있을것이다.

Fabrication and Adhesion Strength Evaluation of Glass Sealants for Ceramic to Ceramic Component Joining (세라믹-세라믹 컴포넌트 접합용 글라스 실란트의 제조 및 접합력 평가)

  • Heo, Yu Jin;Kim, Hyo Tae
    • Journal of the Microelectronics and Packaging Society
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    • v.26 no.4
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    • pp.89-94
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    • 2019

  • Glass base sealant is required as a ceramic-ceramic joining material between α-alumina insulation cap and β-alumina electrolyte tube in the development of NaS battery cell package for electrical energy storage system. The fabrication of glass frit by thermal quenching method, phase analysis, particle size analysis, coefficient of thermal expansion and surface roughness according to the glass compositions were analyzed for the fabrication of glass sealing paste for ceramic-ceramic joining. Also, a new evaluation method of the adhesion strength of glass sealant at the small area in ceramic-ceramic joining component was proposed using conventional Dage bond tester that was used to measure the adhesion of solder ball joint.

  • https://doi.org/10.6117/kmeps.2019.26.4.089 인용 PDF KSCI

Analysis of Residual Stress of Ceramic/Metal Joint (세라믹/금속 접합재의 잔류응력 해석)

  • Park, Young-Chul;Hue, Sun-Chul;Kim, Kwang-Young
    • Journal of the Korean Society for Nondestructive Testing
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    • v.14 no.1
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    • pp.7-15
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    • 1994

  • The two-dimensional elastoplastic analysis was peformed to reveal a detail residual stress distribution of ceramic/metal joint specimen using finite element method and X-ray method. The highest tensile residual stress, ${\sigma}_x$ perpendicular to the interface appeared at the edge of the ceramic near the interface. In the vicinity of the interface, the high stress concentration occurs and residual stress distributes three-dimensionally. Therefore, the measured stress distribution differed remarkably from the result of the two-dimensional finite-element analysis. Especially at the center of the specimen near the interface, the residual stress, ox obtained from the finite element analysis was compressive, whereas X-ray measurement yielded tensile ${\sigma}_x$. Therefore, it is also attempted to investigate the finite element model for the prediction of residual stress ${\sigma}_x$ distributed nearly the interface of joint.

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