• Journal of KIISE:Computer Systems and Theory
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• v.27 no.6
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• pp.583-591
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• 2000

Caching mechanisms have been studied extensively to buffer the speed gap of hierarchical storages in the context of cache memory, paging system, and buffer management system. As the wide-area distributed environments such as the WWW extend broadly, caching of remote objects becomes more and more important. In the wide-area distributed environments, the cost and the benefit of caching an object is not uniform due to the location of the object; which should be considered in the cache replacement algorithms. For online operation, the time complexity of the replacement algorithm should not be excessive. To date, most replacement algorithms for the wide-area distributed environments do not meet both the non-uniformity of objects and the time complexity constraint. This paper proposes a replacement algorithm which considers the non-uniformity of objects properly; it also allows for an efficient implementation. Trace-driven simulations show that proposed algorithm outperforms existing replacement algorithms.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.1
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• pp.37-42
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• 2012

LIFT (laser-induced forward transfer) is an advanced laser processing method used for selectively transferring micron-sized objects. In our study, this process was applied in order to deposit solder balls in microsystem packaging processes for electronics. Locally melted solder paste could be transferred to a rigid substrate using laser pulses. A thin glass plate with a solder cream layer was used as a donor film, and an IR laser pulse (wavelength = 1070 nm) was used to transfer a micron-sized solder ball to the receptor. Mass balance and energy balance were applied to analyze the shape and temperature profiles of the solder paste drops. The transferred solder bumps had measured diameters of 30-40 ${\mu}m$ and thicknesses of 50 ${\mu}m$ in our experiment. The limits and applications of this method are also presented.