• Journal of Welding and Joining
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• v.14 no.1
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• pp.38-46
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• 1996

High temperature low cycle fatigue crack growth behavior is investigated over a range of two temperatures and various frequencies in SUS 304 stainless steel. It is found that low frequency and temperature can enhance time-dependent crack growth. With high temperature, low frequency and long crack length, ${\Delta}J_c/{\Delta}J_ f$, the ratio of creep J integral range to fatigue J integral range is increased and time-dependent crack growth is accelerated. Interaction between ${\Delta}J_f$ and ${\Delta}J_c$ is occured at high frequency and low temparature and ${\Delta}J_c$, creep J integral range is fracture mechanical parameter on transition from cycle-dependent to time dependent crack growth in creep temperature region.

• Transactions of the Korean Society of Mechanical Engineers
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• v.9 no.5
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• pp.539-547
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• 1985

The low-cycle fatigue crack growth behavior of SUS 304 Stainless steel was investigated at 650.deg. C by the nonlinear fracture mechanics. Crack Propagation can be separated in to cycle-dependent and time-dependent, the former is correlated with .DELTA. $J_{f}$ , J-intergral range and the latter is correlated with J', modified J integral. Transition from cycle-dependent to time-dependent crack growth was successfully predicted using the .betha. hypothesis, which was proposed by the authors on the basis of an analysis on the interaction of elastic and creep strain. To investigate the reliability of .betha.-hypothesis, experimenting by the change of stress-level, stress rate and frequency, following conclusions were obtained. (1) High temperature fatigue crack propagation was separated into cycle-dependent and time-dependent. (2) Transition of crack propagation was predicted by .DELTA. $J_{c}$/.DELTA.$_{f}$ or .betha. (3) Lower limit in cycle-dependent crack propagation was obtained..

• Journal of Welding and Joining
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• v.13 no.4
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• pp.7-13
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• 1995

마이크로솔더링에 의한 전자기기는, 사회기능의 중추가 되는 컴퓨터, 통신 기기, 항공기 인공위성 등의 제어계를 구성하므로, 그 접속부에 대한 높은 신뢰성의 요구는 그 무엇보다 중요하다. 전자기기에 있어서의 솔더 접속부는 집과 기판의 전기 적.기계적 접속의 역할을 하고 있으며, 따라서 개개의 접속부의 파단은 전체의 불량 으로 연결된다. 실제 전자콤포넌트와 그 시스템의 단선 등의 사고에 있어서 자주 발생 하는 사고중의 하나가 솔더접속부의 단선에 의한 것이며, 그 단선중에서도 가장 보편 적이며 또한 대단히 심각한 문제로서 주목을 받고 있는 것이 솔더접속부의 열피로파단 이다. 전자기기를 사용할 때, 스위치의 on-off에 의한 power cycle과 환경의 온도변화 에 기인하는 반복열 사이클은 솔더접속부의 피로를 일으키게 되고, 결국에는 사용중에 파단을 초래하게 된다. 이러한 온도변화의 범위는 약 -55.deg. - 150.deg.C로 예상할 수 있으며, 여기서 최고온도인 150.deg.C는 Pb-Sn 공정합금의 경우 0.9Tm.p.이상의 고온에 해당한다. 이 피로는 등온적으로 또는 열사이클중에 발생하기도 한다. 솔더접 속부의 열피로수명은 대부분의 공업재료에서 나타나는 저사이클피로거동과 유사하게 발생하며, 솔더 접속부에 인가되는 열변형/응력(thermal strain/stress)의 크기에 크게 의존하는 것으로 알려져 있다. 솔더는 서로 다른 열팽창계수를 갖는 칩과 회로 기관의 두종류의 재료를 접속하기 때문에, 상기한 바와 같은 반복열사이클에 의하여 발생하는 열변형/응력이 접속부의 피로.파단을 야기시킨다. 이러한 솔더접속부에 대한 주기적인 응력/변형의 인가는 접속부에 내.외적으로 현저한 변화를 야기시키게 되고, 열피로로 연결되며 결국에는 시스템의 전기적 단선을 초래하게 된다. 또한 열피로파단 현상는 변형/응력의 크기 뿐 만아니라 솔더합금자체의 야금학적인 물성에도 크게 의존 하며, 내적.외적인 열변화에 의한 야금학적인 특성변화도 크게 영향을 미친다. 솔더 접속부의 신뢰성에 대한 연구는, 그 중요성에 비추어 볼 때, 지금까지 수많은 연구가 행하여져 왔다. 그러나 신뢰성과 관련된 열피로파단현상에 대한 야금학적인 면에서의 연구는 비교적 적은 편이다. 따라서 본 해설에서는 전자기기의 마이크로 솔더접속부 에서 발생하는 열피로파단현상에 대한 야금학적인 면에 중점을 두어 서술하고자 한다.

• Journal of Ocean Engineering and Technology
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• v.9 no.2
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• pp.98-111
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• 1995

High temperature low cycle fatigue shows that cycle-dependent crack growth owing to cyclic plastic deformation occurred simultaneosly with time-dependent crack growth owing to intergranular deformation. Consequently, to estimate crack growth rate uniquely, many to investigators have proposed various kinds of parameters and theories but these could not produce satisfactory results. Therefore the goal of this study is focused on prediction of crack growth rate using predominant damage rule, linear cumulative damage rule and transitional parameter ${\Delta}J_c/{\Delta}J_f$. On the basis of these sinusoidal loading waveform at 600$^{\circ}C$ and 700$^{\circ}C$.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.9
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• pp.4197-4203
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• 2013

In order to investigate the heating performance of multi-heat pump applying an inverter compressor, the experiment on heat pump with 3 indoor units was performed under the heating standard and heating low-temperature conditions. The performance data of heat pump with 3 indoor units were measured by the multi-psychrometric calorimeter. The operation characteristics and the behavior of the refrigerant cycle of the heat pump with 3 indoor units were understood from the heating capacity, heating COP, and P-h diagram by indoor-unit combination. The present experimental results show that the operating load and performance of the multi-heat pump depends on the indoor-unit combination. The heating capacity and heating COP of the low temperature condition were smaller than those of the standard one. Also the refrigerant cycles on indoor-unit combination were analyzed by using P-h diagram.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.3
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• pp.548-554
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• 1994

The high temperature fatigue crack growth behavior of SUS 304 stainless steel at $550^{\circ}C$ and $650^{\circ}C$ was investigated under various kinds of stress ratio and frequency in sinusoidal waveform on the basis of the non-linear fracture mechanics. The result arranging crack growth rate by modified J-integral J' showed influence of stress ratio and frequency. All the data obtained under the test at $550^{\circ}C$ were plotted within data band of da/dN-${\triangle}J_f$ relationship for cycle-dependent crack growth. On the basis of static creep and cycle-dependent data band; both time- and cycle-dependent crack growth behavior was observed under loading conditions at $650^{\circ}C$, but cycle-dependent crack growth behavior predominantly appeared and time-dependent crack growth behaviour was little observed under loading conditions at $550^{\circ}C$. Fractographic examinations for fracture surface indicated that the fracture mode was generally transgranular. The stripes were found on fracture surface and each stripe was accompanied by a crack tip blunting and an abrupt increase in the load-point displacement. The $J'_{an}$ had a validity in case of $650^{\circ}C, but scarcely had it in case of $550^{\circ}C$.

• Transactions of the Korean Society of Mechanical Engineers
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• v.14 no.3
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• pp.694-701
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• 1990

The cycle of heat engine which produces the maximum power output is constructed when heat sources are finitely constant, and the maximum power as a thermodynamic limit of the engine, is obtained. The characteristics of the maximum power cycle are as follows, which represent the operation conditions and design conditions of the heat engine to produce the maximum power output. In heat exchangers, the temperature profiles of the heat source and the working fluid have the same functional formula and the ratio of the working fluid temperature to the heat source temperature is constant. When heat capacity flow rates(product of the specific heat and the mass flow rate) of the working fluid as well as the heat source are constant, the values of those of working fluid exist between those of two heat sources. The relation of the temperature and the heat capacity flow rate is established without the states of the heat sources and the capacities of heat exchangers, which is ( $T_{h}$/ $T_{H}$)( $C_{h}$/ $C_{H}$)=( $T_{1}$/ $T_{L}$)( $c_{1}$/ $c_{L}$)=1. The capacity of the heat exchanger of hot side is equal to that of cold side regardless of the states of the heat sources and the total capacities of heat exchangers.hangers.ers.

• Korean Journal of Materials Research
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• v.11 no.5
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• pp.339-344
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• 2001

An all solid-state thin film supercapacitor (TFSC) with Co$_3$O$_4$/LiPON/Co$_3$O$_4$ structure was fabricated on Pt/Ti/Si substrate using Co$_3$O$_4$ thin film electrode. Each Co$_3$O$_4$ film was grown by reactive dc reactive magnetron sputtering with increasing $O_2$/[Ar+O$_2$] ratio. Amorphous LiPON electrolyte film was deposited on Co$_3$O$_4$/Pt/Ti/Si in pure nitrogen ambient by using reactive rf magnetron sputtering. The electrochemical behavior of the Co$_3$O$_4$/LiPON/Co$_3$O$_4$ multi-layer structures exhibits a behavior of a bulk-type supercapacitor, even though much lower capacity (from 5 to 25 mF/$\textrm{cm}^2$-$\mu\textrm{m}$) than that of the bulk one. It was found that the TFSC showed a fairly constant discharge capacity with a constant current of 50 $\mu\textrm{A}/\textrm{cm}^2$ at the cut-off voltage 0-2V during 400 cycles. It is shown that the electrochemical behavior of the Co$_3$O$_4$/LiPON/Co$_3$O$_4$ TFSC is dependent upon the sputtering gas ratio. The capacity dependency of electrode films on different gas ratios was explained by different structural, electrical, and surfacical properties.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.27 no.12C
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• pp.1288-1298
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• 2002

To implement elliptic curve cryptosystem in GF(2$\^$m/) at high speed, a fast divider is required. Although bit-parallel architecture is well suited for high speed division operations, elliptic curve cryptosystem requires large m(at least 163) to support a sufficient security. In other words, since the bit-parallel architecture has an area complexity of 0(m$\^$m/), it is not suited for this application. In this paper, we propose a new serial-in serial-out systolic array for computing division operations in GF(2$\^$m/) using the standard basis representation. Based on a modified version of tile binary extended greatest common divisor algorithm, we obtain a new data dependence graph and design an efficient bit-serial systolic divider. The proposed divider has 0(m) time complexity and 0(m) area complexity. If input data come in continuously, the proposed divider can produce division results at a rate of one per m clock cycles, after an initial delay of 5m-2 cycles. Analysis shows that the proposed divider provides a significant reduction in both chip area and computational delay time compared to previously proposed systolic dividers with the same I/O format. Since the proposed divider can perform division operations at high speed with the reduced chip area, it is well suited for division circuit of elliptic curve cryptosystem. Furthermore, since the proposed architecture does not restrict the choice of irreducible polynomial, and has a unidirectional data flow and regularity, it provides a high flexibility and scalability with respect to the field size m.