• Title/Summary/Keyword: 비필러 강화재

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Structural Analysis and Design of B-pillar Reinforcement using Composite Materials (복합소재를 활용한 B필러 강화재의 구조해석 및 설계)

  • Kang, Ji Heon;Kim, Kun Woo;Jang, Jin Seok;Kim, Ji Wook;Yang, Min Seok;Gu, Yoon Sik;Ahn, Tae Min;Kwon, Sun Deok;Lee, Jae Wook
    • Composites Research
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    • v.34 no.1
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    • pp.35-46
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    • 2021
  • This paper aims to reduce weight by replacing the reinforcements of the B-pillar used in vehicles with CFRP(Carbon Fiber Reinforced Plastics) and GFRP(Glass Fiber Reinforced Plastics) from the existing steel materials. For this, it is necessary to secure structural stability that can replace the existing B-pillar while reducing the weight. Existing B-pillar are composed of steel reinforcements of various shapes, including a steel outer. Among these steel reinforcements, two steel reinforcements are to be replaced with composite materials. Each steel reinforcement is manufactured separately and bonded to the B-pillar outer by welding. However, the composite reinforcements presented in this paper are manufactured at once through compression and injection processes using patch-type CFRP and rib-structured GFRP. CFRP is attached to the high-strength part of the B-pillar to resist side loads, and the GFRP ribs are designed to resist torsion and side loads through a topology optimization technique. Through structural analysis, the designed composite B-pillar was compared with the existing B-pillar, and the weight reduction ratio was calculated.

Development of Curing Process for EMC Encapsulation of Ultra-thin Semiconductor Package (초박형 반도체 패키지의 EMC encapsulation을 위한 경화 공정 개발)

  • Park, Seong Yeon;On, Seung Yoon;Kim, Seong Su
    • Composites Research
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    • v.34 no.1
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    • pp.47-50
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    • 2021
  • In this paper, the Curing process for Epoxy Molding Compound (EMC) Package was developed by comparing the performance of the EMC/Cu Bi-layer package manufactured by the conventional Hot Press process system and Carbon Nanotubes (CNT) Heater process system of the surface heating system. The viscosity of EMC was measured by using a rheometer for the curing cycle of the CNT Heater. In the EMC/Cu Bi-layer Package manufactured through the two process methods by mentioned above, the voids inside the EMC was analyzed using an optical microscope. In addition, the interfacial void and warpage of the EMC/Cu Bi-layer Package were analyzed through C-Scanning Acoustic Microscope and 3D-Digital Image Correlation. According to these experimental results, it was confirmed that there was neither void in the EMC interior nor difference in the warpage at room temperature, the zero-warpage temperature and the change in warpage.

FLUORIDE RELEASE AND MICROHARDNESS OF GIOMER ACCORDING TO TIME (Giomer의 불소 유리 양상 및 미세경도에 관한 연구)

  • Kim, Sang-Min;Park, Ho-Won;Lee, Ju-Hyun;Seo, Hyun-Woo
    • Journal of the korean academy of Pediatric Dentistry
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    • v.37 no.4
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    • pp.429-437
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    • 2010
  • The aim of this study was to evaluate the fluoride release and microhardness of Beautifil II as giomer(Group I), F2000 Compomer as compomer(Group II), GC Fuji II LC Capsule as resin-modified glass ionomer(Group III) and $Filtek^{TM}$ Z350 as composite resin(Group IV) according to time. Forty discs(5 mm diameter and 2 mm height) were prepared for each material. Each disc was immersed in 3 ml of de-ionized water within polyethylene tube and stored at $37^{\circ}C$. Evaluations were performed by pH/ISE meter for analysis of fluoride release and hardness testing machine for analysis of microhardness over 31 days. The results can be summarized as follows : 1. For all groups except group IV, the greatest fluoride release was observed after the first day of the study period and then dramatically diminished over time. On the 7th day of the study period, fluoride release level was stabilized. 2. Group III showed the highest fluoride release among test groups and then group II, group I were followed. Significant difference in cumulative fluoride release over 31 days was found between each groups. Group IV showed no fluoride release during study period. 3. Group IV showed the highest microhardness among test groups and then group I, group II, group III were followed. Significant difference in microhardness was found between each group, except between group I and group II. 4. After 31 days, microhardness was slightly diminished in every group. However, no significant difference was found.