A Study on Ultra Precision Grinding of Aspheric SIC Molding Core for Camera Phone Module (카메라폰 모듈용 비구면 Glass렌즈 성형용 Silicon Carbide(SiC) 코어 초정밀 연삭가공에 관한 연구)
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- Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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- 2007.11a
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- pp.428-428
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- 2007