• Journal of the Korean Society for Precision Engineering
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• v.22 no.5 s.170
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• pp.21-27
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• 2005

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.565-568
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• 2005

We describe a new scheme of dispersive white-light interferometer that is capable of measuring the thickness profile of thin-film layers, for which not only the top surface height profile but also the film thickness of the target surface should be measured at the same time. The interferometer is found useful particularly for in-situ inspection of micro-engineered surfaces such as liquid crystal displays, which requires for high-speed implementation of 3-D surface metrology.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.23-24
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• 2006

We present a dispersive scheme of white-light interferometry that enables not only to perform tomographical measurements of thin-film layers but also to measure a refractive index without mechanical depth scanning. The interferometry is found useful particularly for in-situ 3-D inspection of micro-engineered surfaces such as liquid crystal displays, semi-conductor and MEMS structure, which requires for high-speed implementation of 3-D surface metrology.

• Proceedings of the Optical Society of Korea Conference
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• 2005.07a
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• pp.24-25
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• 2005

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.86-87
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• 2007

The dispersive method of white-light interferometry is proper for in-line 3-D inspection of dielectric thin-film thickness to be used in the semiconductor and flat-panel display industry. This research is the measurement application of CMP patterned wafer. The results describe 3-D and 2-D profile of the step height during polishing time.