• Title/Summary/Keyword: 방열 설계

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Structural Design of 3D Printer Nozzle with Superior Heat Dissipation Characteristics for Deposition of Materials with High Melting Point (고 용융점 소재의 압출적층성형을 위한 우수한 방열특성을 갖는 3차원 프린터 nozzle부 기구설계)

  • Kim, Wan-Chin;Lee, Sang-Wook
    • The Journal of the Korea institute of electronic communication sciences
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    • v.15 no.2
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    • pp.313-318
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    • 2020
  • Since the engineering plastics having a melting point of higher than 300 degrees have a high mechanical rigidity, chemical resistance, friction and abrasion performance, those are being highlighted as metal replacement materials in various industries. In this study, 3D printer nozzle with excellent heat dissipation characteristics are designed and analytically verified to form engineering plastics with high melting points in 3D printers based on the melt-lamination modeling method. In order to insulate between the heat block heated to a melting point of filament material and the upper part of the nozzle where the filament is transferred, the heat brake part with low thermal conductivity was designed to have two separate parts, and a cooling fin structure is further applied to the heat brake part to lower steady-state temperature by air convection. Optimized structural design on FDM nozzle part reduces the temperature at the heat sink and at the end part of heat brake by 50% and 14% respectively, compared to the conventional BCnozzle structure.

On-Board Black Body Thermal Design and On-Orbit Thermal Analysis for Non-Uniformity Correction of Space Imagers (영상센서의 비균일 출력특성 교정용 흑체의 열설계 및 궤도 열해석)

  • Oh, Hyun-Ung;Shin, So-Min;Hong, Ju-Sung;Lee, Min-Kyu
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.38 no.10
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    • pp.1020-1025
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    • 2010
  • On-board black body is used for radiation temperature calibration of spaceborne radiometers and imaging systems. The thermal design of black body proposed in this study is basically composed of heaters to heat-up the black body from low to high temperature during the calibration, heat pipe to transfer residual heat on the black body just after calibration to radiator on the S/C and heaters on the radiator to keep the certain temperature range of the black body during non-calibration. In the present work, the effectiveness of thermal design of on-board black body has been investigated by on-orbit thermal analysis.

Analysis on Heat Dissipation Characteristics of a Tile-Type Digital Transmitter/Receiver Module (적층형 디지털송수신모듈의 방열특성 분석)

  • Yoon, Kichul;Kim, Sangwoon;Heo, Jaehun;Kwak, Nojin;Kim, Chan Hong
    • Journal of the Korea Institute of Military Science and Technology
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    • v.22 no.2
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    • pp.249-254
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    • 2019
  • A Digital Transmitter/Receiver Module(DTRM), which is an essential part in active phased-array radar systems, generates a high heat density, and needs to be properly cooled for stable operation. A tile-type DTRM that is a stacking structure of multi-layer components was modeled with simplification and heat dissipation characteristics of the DTRM model were studied using computational fluid dynamics(CFD) simulations. Most of the heat was dissipated by the heat conduction through the cold plate, but the heat transfer by the forced convection on top of the DTRM also was found to play an important role in the thermal management. Under the given conjugated heat transfer environment, the DTRM was confirmed to secure a stable operating temperature range.

Heater Design of a Cooling Unit for a Satellite Electro-Optical Payload using a Thermal Analysis (열해석을 이용한 위성 광학탑재체 냉각 장치의 히터설계)

  • Kim, Hui-Kyung;Chang, Su-Young;Choi, Seok-Weon
    • Aerospace Engineering and Technology
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    • v.10 no.2
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    • pp.20-28
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    • 2011
  • The electro-optical payload of a low-earth orbit satellite is thermally decoupled with the bus, which supports a payload for a mission operation. The payload has a cooling unit of FPA(Focal Plane Assembly) which has a thermal behavior increasing its temperature instantly during an operation in order to dissipate a waste heat into the space. The FPA cooling unit should include a radiator and heatpipes with a sufficient performance in worst hot condition, and a heater design to maintain its temperature above a minimum allowable temperature in the worst cold condition. In this paper, we analyzed the thermal requirements and the heater design constraints from the thermal analysis results for the current thermal design of the FPA cooling unit and the design elements of the better heater design were found.

Study on Thermal Design of a 3W MR16 Light with Single High-Power LED (단일 LED를 사용한 3W MR16 조명등 방열 설계에 관한 연구)

  • Lee, Young-Lim;Hwang, Soon-Ho
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.11 no.4
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    • pp.1203-1209
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    • 2010
  • LED lights as a newly-growing industry are highly energy-efficient and have drawn lots of attention due to higher illuminance and longer life compared to other light sources. In this study, MR16 lights with one high-power LED were considered for the replacement of the previous halogen lights or LED lamps with many LEDs. Thus, fundamental experiments of LED on a MCPCB, 3-dimensional numerical analysis for heatsink design and performance tests of the prototype lights have been done and the MR16 LED lights have been successfully developed.

Development of 20W LED bulb for miniaturization (소형화를 위한 20W LED 전구 개발)

  • Kim, Jin-Hong;Song, Sang-Bin;Kim, Gi-Hoon;Moon, Il
    • Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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    • 2007.05a
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    • pp.64-69
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    • 2007
  • 실내조명의 조도 기준을 만족하는 LED Bulb를 개발하기 위하여 LED 개수를 선정하고, 실내 전반 조명에 적합한 배광을 실현하기 위한 렌즈설계를 하였다. 그리고 LED로부터 발산되는 열을 최적화하기 위한 방열설계를 행하여 주위온도 $50^{circ}C$ 이내에서 동작 가능하도록 하였다. 또한 시제품의 외함에 내장되어 질 수 있는 소형의 20[W]급 전원회로를 설계하고, 시제품을 직접 제작하였다. 시제품의 전기적, 광학적 성능은 CFL의 성능과 거의 동일하다.

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Design of the High Frequency Power Amplifier by the Impedence Matching (임피던스매칭을 이용한 고주파 전력증폭기의 설계)

  • 김인철;조영수;이상설
    • Proceedings of the Korea Society for Industrial Systems Conference
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    • 1997.11a
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    • pp.221-233
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    • 1997
  • 무선통신 분야에서 다량의 정보전송과 CDMA, PCS 등의 상업화에 의해 광대역 고출력 증폭기의 요구가 증가하고 있다. 제품화된 파워 모듈에 비해 트랜지스터로 구성한 전력증폭기는 비용의 감소와 효율증대, 생산성 향상의 이점이 있다. 3단의 증폭기를 사용하여 VHF(148∼174㎒),UHF(440㎒∼470㎒)대역에서 5W이상의 전력과 45%이상의 효율을 얻었으며, 적정한 바이어스회로와 임피던스 정합회로망을 설계하여 제작, 실험함으로서 기존의 파워 모듈과 동일한 크기, 성능을 나타냈으며, 발진, 방열, 하모닉제거등 전력증폭기에서 요구하는 사항을 만족하였다. 또한 UHF트랜지스터를 사용하여 VHF의 증폭기를 임피던스 매칭을 이용하여 설계할 수 있음을 실험에 의하여 입증하였다.

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A Study on the Thermal Characteristics of COB LED using Thermoelectric Element (열전소자를 이용한 COB LED의 열적 특성 분석에 관한 연구)

  • Kim, Hyo-Jun;Kim, Tae-Hyung;Kim, Yong-Kab;Hoang, Geun-Chang
    • The Journal of the Korea institute of electronic communication sciences
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    • v.9 no.12
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    • pp.1435-1440
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    • 2014
  • This paper was designed to analyze thermal properties using thermoelectric element for air-cooling heat dissipation of 13.2W-class COB LED. For comparative analysis with generally used air cooling methods, the heat sink was designed and produced, and this experiment was conducted to measure the temperature distribution using a contact thermometer while the COB LED was operating for 100 minutes. One result was about $75^{\circ}C$ for the general cooling method, and the other was $57^{\circ}C$ while the thermoelectric element was operating with applying the current of 0.8A to the thermoelectric element. This results confirmed that the method of applying thermoelectric element was much better in the dissipation of thermal condense on the COB LED than that of the general air cooling one. The temperature on the contact points of COB LED using thermoelectric element was decreased about 31% compared with the air cooling method from $75^{\circ}C$ to $57^{\circ}C$.

Investigation of Natural Convective Heat Flow Characteristics of Heat Sink (히트싱크의 자연대류 열유동 특성 분석)

  • Jung, Tae Sung;Kang, Hwan Kook
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.37 no.1
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    • pp.27-33
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    • 2013
  • To ensure proper functioning of electrical and mechanical systems, cooling devices are of great importance. A heat sink is the most common cooling device used in many industries such as the semiconductor, electronic instrument, LED lighting, and automotive industries. To design an optimal heat sink, the required surface area for heat radiation should be calculated based on an accurate expectation of the heat flow rate in the target environment. In this study, the convective heat flow characteristics were numerically investigated for a vertically installed typical heat sink and a horizontally installed one in free convection using ANSYS CFX. Comparative experiments were carried out to reveal the quantitative effect of the installation direction on the cooling performance. Moreover, the result was analyzed using the dimensionless correlation with the Nusselt number and Rayleigh number and compared with well-known theories. Finally, it was observed that the cooling performance of the vertically installed heat sink is approximately 10~15% better than that of the one in natural convection.