• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.15 no.10
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• pp.860-869
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• 2003

Design optimization of the heat sink with 7${\times}$7 square pin-fins is performed numerically using the Computational Fluid Dynamics (CFD) and the Computer Aided Optimization (CAO). In the pin-fins heat sink, the optimum design variables for fin height (h), fin width (w), and fan-to-heat sink distance (c) can be achieved when the thermal resistance ($\theta$$_{j}$) at the junction and the overall pressure drop ($\Delta$p) are minimized simultaneously. To complete the optimization, the finite volume method for calculating the objective functions, the BFGS method for solving the unconstrained non-linear optimization problem, and the weighting method for predicting the multi-objective problem are used. The results show that the optimum design variable for the weighting coefficient of 0.5 are as follows: w=4.653 mm, h=59.215 mm, and c=2.667 mm. In this case, the objective functions are predicted as 0.56K/W of thermal resistance and 6.91 Pa of pressure drop. The Pareto optimal solutions are also presented.re also presented.d.

• Clean Technology
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• v.19 no.3
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• pp.243-248
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• 2013

Thermally conductive materials are widely used in various applications where effective heat dissipation is required. Graphene shows high potential for various uses owing to high electrical conductivity, good mechanical strength, and high thermal conductivity. Generally previous works used organic solvents are generally used for the dispersion of graphene in fabrication procedure. In order to achieve clean fabrication it is required to use water media. In this study, we fabricated graphene attached poly(methyl methacrylate) (PMMA) microsphere via microfluidic method. With the aid of surfactant, graphene was well dispersed in water which was used as continuous flow. Thermal conductivity was improved with the small amount of graphene addition and this indicate potential use of this system for thermally conductive composite material.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.3
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• pp.1111-1116
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• 2011

Heat exchangers have been used for the automotive, HVAC systems, and other various industrial facilities, so the market is very wide. In general, high-efficiency heat exchangers with louver fins are used in the dust-free environment while heat exchangers with wavy fins are used for dusty environment such as construction site, etc. In this study, numerical analysis has been performed for typical heat exchangers, used as oil coolers or fuel coolers, with dual cell model that can handle different grids for the air-side and oil-side of heat exchangers. First wind tunnel tests were conducted to obtain one-dimensional thermal performance data of heat exchangers. Then, heat release rates with varying air flows were numerically predicted using the three-dimensional dual-cell model. The model can greatly enhance the accuracy of thermal design since it includes the effects of nonuniformity of air flows across heat exchangers.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2002.11b
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• pp.204-209
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• 2002

A PDP(Plasma Display Panel) module consists of a discharge panel, a SMPS(Switched Mode Power Supply) for power supply, driving boards for panel control, and a logic board. Driving boards supply high voltage pulses to induce glow discharge in the PDP panel. The electrical pulses excite the circuit elements and subsequently generate acoustic noises. The main sources of the noise in the circuit are the transformer of SMPS and the power MOSFET(Metal Oxide Semiconductor Field Effect Transistor) of driving boards, and the heat sinks often amplify the noise level. The reduction of the acoustic noises was achieved by modifying both the structural and circuit elements. The structural method was executed by the improvement of heat sinks. The optimization of SMPS and condensers was carried out for the circuit elements.

• Proceedings of the KAIS Fall Conference
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• 2010.11b
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• pp.944-946
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• 2010

열교환기는 공조 및 기타 산업현장에서 많은 수요가 창출되고 있는데 본 논문에서는 3차원 수치해석을 이용하여 수송기계의 오일쿨러나 연료쿨러에 쓰이는 전형적인 열교환기에 대한 방열 성능을 해석하였다. 열교환기의 핀 타입 중 wavy 및 louver에 대하여 열교환기 성능 실험 데이터를 이용하는 3차원 열교환기 모델을 완성하고 통과 풍량에 따른 열교환량을 예측하였다. 이는 열교환기를 통과하는 풍속이 균일하지 않을 때 열교환량을 예측할 수 있어 설계 정확성 향상에 기여할 수 있다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.433-436
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• 2000

For a new design of a automotive brake system, it appears to be very important to examine the temperature and thermal stresses distribution in the brake drum. In the direct measurement of them, however, a number of difficulties are involved. In this study, simulation on temperature and thermal stress distributions in an A1-MMC brake drum of a commercial vehicle during 15 braking operations was carried out using the finite element analysis(FEA1. The effect of a circumferential fin near open end of the brake drum on the temperature rise and stresses was also examined.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2002.11a
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• pp.326.2-326
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• 2002

A PDP(Plasma Display Panel) module consists of a discharge panel, a SMPS for power supply, driving boards for panel control, and a logic board. Driving boards supply high voltage pulses to induce glow dischargein the PDP panel. The electrical pulses excite the circuit elements and subsequentlyacoustic noises. The main sources of the noise in the circuit are the transformer of SMPS and the power MOSFET of driving boards, and the heat sinks often amplify the noise level. (omitted)

• Journal of the Korean Solar Energy Society
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• v.35 no.3
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• pp.81-91
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• 2015

LED has received intensive research attention due to its long life, high efficacy, fast response and wide colour availability, and has secured extensive application areas. However, LED chips within the modules convert only fraction of electric energy into light, and majority of supplied energy needs to be dissipated as heat, which challenges in the performance and life of the LED modules. IEC 62717 specifies the performance requirements for LED modules together with the test methods and conditions. The present study examined the influence of different design parameters on performance temperature through series of experiments and numerical simulations. The economic means to change the module performance temperature during the measurement of mandatory markings were suggested based on predicted cooling performances.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.1
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• pp.138-143
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• 2018

In general, the operating temperature of electronic equipment is closely related to product life and reliability, and it is recognized that effectively cooling the parts is an important problem. In this paper, an experimental study on the cooling characteristic according to the pin array of the heat sink is conducted. The experiment on the heat sink was based on the natural convection and temperature distribution changes. The experimental results indicate that the pin array of the heat sink has an effect on the thermoelectric module's cooling characteristic.

• Proceedings of the SAREK Conference
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• 2005.06a
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• pp.96-96
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• 2005