• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.5
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• pp.87-92
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• 2019

This study is the analysis of causes of printed circuit board (PCB) in collective protection equipment failure and quality improvement. The equipment is a component of the weapon system currently in operation and serves to defend against enemy chemical and biological attack as well as heating and cooling functions. However, during operation in the military, fans of condensate assembly failed to operate. The cause of the failure is the burning of PCB. It was found that the parts were heated according to the continuous cooling operation under the high temperature environmental conditions. Accordingly, the electronic components exposed to high temperature were deteriorated and destroyed. To solve this problem, PCB apply to heatsink. The performance test of improved PCB has been completed. Futhermore system compatibility, positive pressure maintenance and noise test were performed. This improvement confirmed that no faults have occurred in PCB so far. Therefore, the quality of the equipment has improved.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.12 no.12
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• pp.1073-1080
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• 2000

Thermal diode is a device which allows heat to be transferred in one direction by convection due to density difference of fluid ,and blocks heat flow in the opposite direction. It is simple in construction and low in cost. And so, it is used as heat collection system of solar energy. In order to acquire a basic design data, thermal diode heat collection system has been studied experimentally for flux Rayleigh numbers from $2\times10^8\;to\;8\times10^8$. The heat transfer rate of this system is shown 10~47% higher than that of other earlier research results. He correlation obtained in this study is Nu=0.0037(Ra^*)^{0.429}(d^*)^{0.05}\frac{(Lr)}{H}^{0.415}$.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.44 no.10
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• pp.887-894
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• 2016

The thermal control device using solid-liquid phase change material (PCM) is designed, manufactured, and experimented in thermal environment chamber. The n-Hexadecane is selected as a PCM and its melting point is placed within the component working temperature range. The PCM container is made of Al6061 and has the thermal spreading fins inside. To simulate the working condition for on-orbit satellite the heat pipes are used to connect the heater and radiator and the PCM thermal control device (PCMTD) is installed at the middle portion of heat pipes. The thermal buffer mass (TBM), which is same configuration and volume with PCMTD, is also manufactured to compare the thermal control performance. As a result, the PCMTD is not only more efficient than TBM in their temperature control features but both mass and power of compensation heater are reduced.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.10a
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• pp.115-115
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• 2003

최근 회전기계에 대한 세계적인 기술추세를 볼 때 해를 거듭할수록 더욱 정밀해지고 고속화에 대한 요구가 한층 증대되고 있으며 이러한 측면에서 여러 분야에 우수한 장점을 지니고 있는 능동적 자기베어링의 회전축계 활용에 대한 연구가 활발히 진행되고 있다. 특히 프랑스를 중심으로 한 미국, 일본 등이 이에 대한 연구를 활발하게 수행하여 고속 공작기계 스핀들을 비롯한 고진공 펌프 및 각종 터어빈, 압축기 등에 실용화시키는 단계에 있다. 그러나 국내 관련기술에 대한 연구는 연구소, 학계를 중심으로 실험실적인 기초연구로서 부분적으로 수행하는 단계에 있으며 관련분야 활용을 위한 본격적인 연구는 수행되지 못하고 있는 실정이고 이를 실용화시키기 위한 일환으로 능동적 자기 베어링의 회전 축계를 구성하고 있는 요소기술 중 하나인 전력 증폭기의 개발이 이뤄져야 할 필요성이 있는데 본 논문에서는 네트웍 기반 전력 증폭기 개발을 시도하였다. 전력 증폭기는 크게 리니어 앰프와 스위칭 앰프로 구분된다. 리니어 앰프의 경우 회로가 간단하고 노이즈가 비교적 작다는 장점이 있지만 전력손실 및 발열이 크기 때문에 에너지 측면에서 저 효율이라는 점과 따로 방열판을 부착해야 한다는 단점을 가지고 있고, 스위칭 앰프의 경우 전력손실이 작은 반면, 회로가 비교적 복잡하고 노이즈의 발생 가능성이 높다는 단점이 있다. 본 논문에선 위 두 가지 방식을 혼합한 혼합형 전력 증폭기로 설계하였다. 또한 기존에 전력증폭기의 경우 상위 주제어기로부터 제어량을 아날로그 신호로 통신하기 때문에 발생할 수 있는 EMI 노이즈신호에 대한 대책을 세워야 하는데 본 연구를 통해 개발된 전력증폭기는 따로 보조제어기(TMS320LF2406A)를 두어 상위 주제어기에 전력증폭기의 상태값을 궤환할 수 있도록 명령 신호체계를 전체 시스템의 샘플링 시간을 고려하여 비교적 전송 속도가 빠른 CAN(Controller Area Network)으로 구축하여 주제어기와 전력 증폭기간에 양방향 통신이 가능하도록 하였다. 이로써 전력증폭기의 상태정보를 알 수 있다. 따라서 본 논문에서는 칩 설계기술의 발전으로 가격대 성능비가 우수한 DSP(TMS320LF2406A)를 이용하여 과거의 아날로그 방식의 명령신호체계를 디지털 신호체계로 바꿈으로써 네트웍을 통해 전력증폭기의 상태진단 가능성을 검증한다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.3
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• pp.66-72
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• 2016

An LED lighting control system was developed to combine information technology and LED lights for efficient management and energy savings. The system can monitor and control the status of an LED luminaire using Bluetooth wireless communication, sensor technology, and smart phones. An LED lighting control circuit was designed using a temperature sensor, illumination sensor, and Bluetooth module with a fuzzy constant-current control circuit. We extended the lifetime and prevented damage to the LED by optimizing the supply current of the LED luminaire based on the heat-generation temperature of $70^{\circ}C$ of an LED heat sink. We also automatically adjusted the ON/OFF time depending on the ambient illumination of the LED luminaire. By allowing easy control of the LED luminaires on a smartphone, we improved the efficiency and achieved energy savings. The control system was validated through experiments for normal operation.

• Journal of the Korea Convergence Society
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• v.8 no.11
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• pp.313-319
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• 2017

In this paper, we present a design technique that miniaturises the DC-DC converter, a key component in the electric vehicle system, using the advanced material (Ga-N HEMT) in the LLC resonant converter and freely changes the resonant frequency. This design is also proposed to improve the efficiency and temperature characteristics by adding SR Topology in the secondary side output during the operation of power supply. In this experiment, as a consequence of the constructed circuit with the operation of high switching frequency of 200 kHz, the size of LLC and PFC was able to be minimised by 40[%]. Thus, the characteristics of operating temperature demonstrated $60-65^{\circ}C$ without a heat sink, when the temperature was measured at 250W (12V/20A). The features were all due to the advantages of the change of switching frequency, switching circuits implementation, and the maximisation of switching frequency. Based on these design results, we would like to implement more than 1 [kW].

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.4
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• pp.2966-2970
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• 2015

Recently, solar light power generation is widely extended by support policy to regeneration energy. However generation efficiency is decreased when solar module maintain higher than certain point temperature. Therefore, it is need to maintenance under certain point temperature. An method of solving this problem, this paper is developed geothermal exchanger for efficiency improvement of solar cell module. Geothermal exchanger consisted of heat absorber of solar cell module and heat conductor and radiator. Heat of solar cell module is radiated in the earth by geothermal exchanger. An a result, geothermal exchanger is increased generation amount of solar cell module and experiment result showed costs to about 36% increment of generation power.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.44 no.4
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• pp.373-379
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• 2016

The thermal control device for the periodic working component combined solid-liquid phase change material (PCM) with heat pipes is designed and numerically studied. Due to high latent heat and retaining constant temperature during melting process the component peak temperature, not withstanding small radiator size, is reduced. The warm-up heater power consumption to keep the minimum allowed temperature is also cut down since the accumulated thermal energy is released through the solidification. The thermal buffer mass (TBM) made of Al can give the similar effect but the mass and power consumption of warm-up heater should increase compared to PCM. The amount of PCM can be optimized depending on the component heat dissipation and on/off duty time.

• Transactions of Materials Processing
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• v.13 no.5
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• pp.422-428
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• 2004

At present, the design of extrusion dies and operation in extrusion companies are primarily based on trial and error. The experience of the die designer, the press operator and the die corrector determine the performance of the extrusion die and the efficiency of the process. In order to produce defect-free products of desirable quality in terms of strength, surface quality and geometrical dimensions, it is important to obtain more knowledge of the processes that occur during extrusion. Recently, to reduce the costs of designing and manufacturing of extrusion dies, and to ensure the quality of the extruded products, numerical simulation for extrusion processes such as FEM (finite element method) is applied increasingly and becomes a very important tool for the design and development of new products. However, most of the studies about FE simulation have been accomplished for simple geometry and low extrusion ratio in the filed of steady metal flow conditions. The extruded products of AI alloy in industrial practice involve complicated sectional geometry. This study was designed to reduce the time of die design and manufacturing in the extrusion process using FEM simulation. FEM simulations of extrusion process were performed in non-steady states conditions by changing weld plate included in extrusion die set. Product which was employed in this study is heat sink that has been used in the parts of heat exchanger of electric circuits. It is generally applied for aluminum or its alloys due to heat efficiency and easy production of complicated shapes, and manufactured by extrusion process. The simulated results showed that weld plate shape in extrusion dies influences meta] flow and dimensional accuracy of products.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.11
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• pp.5117-5122
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• 2011

In this paper, thermal analysis simulation program by taking advantage of COMSOL Multiphysics, LED Module for the production of the most preferred package type, omitting the COH Type COB Type and board simulation of the thermal analysis is in progress. LED Module that passes through the Heat-sink of the simulation results, depending on the location of the COB Type Max. Approximately $78^{\circ}C$ ~ Min. Approximately $62^{\circ}C$, COH Type the Max. Approximately $88^{\circ}C$ ~ Min. Approximately $67^{\circ}C$ has been confirmed that the temperature stability. Compared with COB Type Max. AIthough temperature difference is about $10^{\circ}C$, Min. At a temperature of about $5^{\circ}C$ confirmed to be enough to reduce the gap, LED Point confirming the results of the temperature curves for COB Type Max. Approximately $100^{\circ}C$ ~ Min. Approximately $77^{\circ}C$, COH Type the Max. Approximately $100^{\circ}C$ ~ Min. Approximately $86^{\circ}C$ temperature stability was confirmed that, COB Type COH Type, compared to approximately $10^{\circ}C$ temperature was higher.