• Transactions of the Korean Society of Mechanical Engineers B
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• v.35 no.6
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• pp.569-575
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• 2011

Since the high heat generation of LED chips can cause a reduction in lifetime, degradation of luminous efficiency, and variation of color temperature, studies have been carried out on the optimization of LED packaging and heat sinks. Recently, LED packages have been applied to high-power lights such as car headlamps or street lights, and it is known that cooling using only free convection is not at all efficient. Thus, in this study, a heat pipe with forced convection was examined for the optimization of the cooling performance in high-power LED lights. In addition, optimal on-off control of a fan was adopted to increase the fan lifetime, since the lifetime of the fan is generally shorter than that of the LEDs.

• Solar Energy
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• v.14 no.2
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• pp.91-101
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• 1994

Heat release characteristics of a CaO packed bed reactor which is used for a chemical heat storage device has been studied. We employed Cu-plate fins to release the heat of reaction of the CaO packed bed inside the reactor fast and effectively. Two-dimensional analysis of unsteady state heat flow inside the bed was performed as a function of time and under various conditions of the Cu-plates. It is noted that the time required to release the heat of reaction with Cu fins is reduced more than twice fast compared to that without Cu fins. That was largely dependent upon the number of Cu-plate, as well.

• Journal of IKEEE
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• v.25 no.3
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• pp.528-533
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• 2021

This paper presents the PCB heat dissipation characteristics of high density DC-DC converter for electric vehicles. This paper also analyzes the heat dissipation structure of the high density DC-DC converter and optimizes the PCB heat dissipation design of the high density power system through thermal analysis simulation. Based on heat transfer theory, the thermal path of general electronic devices is analyzed and the thermal resistance equivalent circuit is modeled in this paper. Additionally, the thermal resistance equivalent circuit of the 500W synchronous buck converter, which is addressed in this paper, is modeled to present a structural heat dissipation path for better thermal performance. The validity of the proposed scheme is verified through the thermal analysis simulation results and experiments applying multi-surface heat dissipation structure to a 500[W](12[V], 41.67[A]) synchronous buck converter prototype with an input voltage 72[V].

• Journal of the Korea Academia-Industrial cooperation Society
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• v.22 no.5
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• pp.530-536
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• 2021

This paper presents the performance measurement results of a hybrid sheet with both shielding and heat dissipation functions developed by laminating copper mesh sheets and natural graphite sheets, which are used widely as electromagnetic shielding and heat-dissipating materials in electronic devices, without a pressure-sensitive adhesive (PSA). The results were compared by measuring the vertical and horizontal thermal conductivity with two other products to confirm the heat dissipation performance. A radiation emission test confirmed the electromagnetic shielding performance using a 3m electromagnetic anechoic chamber according to the CISPR 11 standard. In the case of vertical thermal conductivity, the proposed hybrid sheet was approximately 8.63 times higher than that of an aluminum sheet with heat dissipation coating and 18.7 times higher than that of a copper sheet laminated with artificial graphite with PSA. The proposed hybrid sheet was approximately 0.64 times that of the sheet, and approximately 1.76 times that of the heat-dissipated aluminum sheet in case of horizontal thermal conductivity. Measurements after applying each sheet in the same heat source revealed the proposed hybrid sheet to have the best heat dissipation performance. The radiation emission test showed that significantly radiation noise had been removed.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.26 no.7
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• pp.301-307
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• 2014

This paper presents a numerical study on the constrained melting of a phase change material inside various capsule containers, using water and HDPE (High Density Polyethylene) as a PCM and a capsule material, respectively. The computations are based on an iterative, finite-volume numerical procedure that incorporates a single-domain enthalpy formulation for simulation of the phase change phenomenon. Using the enthalpy method, various capsule configurations, such as a capsule from E company, an isochoric cylinder capsule, an equivalent diameter sphere capsule, and an isochoric sphere capsule, are used to investigate the effect of capsule configurations on the charging and discharging performance. A transient three-dimensional model is used for each case. The simulation results show that the capsule from E company results in a higher melting and solidification rate of the PCM, than the other capsule configurations considered in this research.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.3
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• pp.1027-1032
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• 2013

LED is standing in the limelight as a light part of the low-carbon green energy. While LEDs are eco-friendly, efficient and durable, extreme heat rises can cause their durability to decrease, with 80% of the power supply being turned into heat energy. Heat radiation systems are important because rising temperatures affect the lifetime of LED elements. Therefore, in this paper, thermal analysis was performed for the shape of heat sink to the LED bulb. Also, it is applied the temperature control systems to our products for optimal performance.

• Proceedings of the KIPE Conference
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• 2010.11a
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• pp.343-344
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• 2010

화석연료의 고갈로 인하여 친환경 자동차에 대한 연구와 상용화가 급속도로 진행되면서 점점 대형 차종으로 그 범위가 넓어지고 있다. 대형 차종에 적용되는 전기동력 시스템의 MCU(Motor Control Unit), GCU(Generator Control Unit), DC/DC 컨버터 등과 같은 전장품도 그 용량이 커지면서 상용화를 위해 효율적인 측면도 많이 부각되지만 스위칭 소자, 변압기, 초크, 다이오드 등에서 동작으로 인해 열이 발생하고 제품의 구조상 밀폐된 공간에 장착이 되기 때문에 발열로 인한 동작의 신뢰성과 제품의 내구성에 큰 영향을 미치게 된다. 그중 가장 발열이 심한 IGBT(Insulated Gate Bipolar Transistor) 등과 같은 스위칭 소자에서 발생하는 열을 효과적으로 냉각시키기 위해 수냉구조가 필수적이며 동일한 조건의 수압, 유량에 보다 높은 방열특성을 가지기 위해 냉각구조에 대한 해석이 제품을 개발 전에 선행되어야 한다. 본 논문에서는 유로의 냉각핀 형상과 유로 구조에 따라 방열특성이 어떠한 차이가 있는지 시뮬레이션 프로그램을 통하여 비교하고, 모사발열체를 이용한 방열부의 냉각 성능 시험과 다이나모 환경의 최대 출력 시험을 통하여 방열 특성을 확인하였다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.2
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• pp.523-528
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• 2013

In this experiment, we investigated the performance of two types of heat sink, swaged- and extruded-type, used in the inverter of industrial electricity generator. The swaged-type heat sink has 62 fins, and the extruded-type has 38 fins having the same dimension as that of the swaged-type. But the extruded-type heat sink maintains the same heat transfer area by the laterally waved surface which has 1 mm in radius. As a result, the swaged- and extruded-type heat sinks released 70.7% and 63.8% of the heat incoming to the heat sink, respectively. The other incoming heat were naturally convected and radiated to the ambient. In spite of 40% decrease in number of fins, the heat release performance of the extruded-type heat sink was lowered only 6.9% than that of the swaged-type. We believe that, this shows the increment of effective heat transfer area by the laterally waved surface of fins and the better heat transfer property of the extruded-type heat sink.

• Journal of Energy Engineering
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• v.26 no.2
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• pp.64-72
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• 2017

The performance analysis of the 70 W class LED lighting system suitable for the Middle East environment was performed using the lumped parameter model. The LED light is composed of a heating substrate, a heat pipe, and a heat sink. We divided the LED lights into four objects and applied energy equilibrium to each of them to establish four lumped nonlinear differential equations. The solution of the simultaneous equations was obtained by the Runge-Kutta method. Convective heat transfer coefficients of the lumped model were obtained by multidimensional CFD analysis. As a result of comparison with experiment, it was found that the heating substrate had an error of $1.5^{\circ}C$ and the upper heat sink had an error of $1.8^{\circ}C$ and the relative error was about 0.6 %. Using this model, temperature distribution analysis was performed for normal operating conditions with an ambient temperature of $55^{\circ}C$, with sunlight only, with abnormal operating conditions with sunlight, and without an upper heat sink.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.40 no.2
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• pp.157-164
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• 2012

The design strategy of the multi-functional structure is that the electrical components and the circuits are directly put on their supporting structural panel in which the radiation shields and the thermal control functions are integrated. Applying the multi-functional structure reduces the total mass and size of the space system and makes it possible to lower launch cost. In present study the performance of thermal radiation for six types of multi-functional structure are investigated by the numerical method. The effect of the rib configuration on heat transfer for the multi-functional-structure is not important alone but is meaningful considering with the structural stiffness, difficulty of manufacturing and mass increase. In heat spreading point of view, the thickness of the outer conductive layer is important rather than the rib configuration and the trade-off study with the mass and thickness is required for optimum design.