• 한국신재생에너지학회:학술대회논문집
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• 2010.11a
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• pp.164.1-164.1
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• 2010

최근 에너지 절감과 환경 문제에 대한 관심이 커지면서 친환경적이고 에너지 효율이 높은 LED에 대한 관심이 대두되고 있으며, 국가 저탄소 녹색성장에 맞는 신성장동력산업의 하나로 LED가 선정되어 적극적으로 육성되고 있다. LED를 활용한 조명등은 현재까지 활발한 연구개발이 진행되었으며 백열전구를 능가하는 조명 효율을 확보하여 조명 광원으로서 이용되고 있다. 그런데 선박용 조명등의 경우에는 아직 관련 기술개발이 초기단계에 머물러있어 대부분의 선박들이 기존의 백열등 및 형광등과 같은 조명등을 사용하고 있다. 이러한 유리 조명등은 고소비전력과 제한된 수명에 따른 높은 유지비 및 제품 누수나 파손 등과 같은 안전성의 문제가 있다. 이에 따라 장기적인 관점에서 선박용 LED 조명 등에 대한 기술 개발이 필요할 것으로 보이며 기술 개발을 저해하는 요소인 방열, 가격 등에 대한 추가적인 기술개발이 뒷받침 되어야 할 것으로 보인다. 한국생산기술연구원에서는 부산광역시 지원사업의 일환으로 선박용 LED 조명등을 개발하고 있으며, 체계적인 연구를 위하여 선박용 LED 조명등의 요소기술에 대한 연구동향과 기술특성을 분석하고 있다. 본 논문에서는 선박용 LED 조명등 개발에서 요구되는 요소기술에 대한 기술개발동향을 살펴보고자 한다. 고효율의 선박용 LED 조명등 개발에 필요한 요소기술로는 방열, SMPS, 광학, 제품 내진동, 제품 방수 등의 설계 및 제작기술이 있다. 이러한 요소기술을 알아보고 선박용 LED 조명등 개발의 방향을 제시하고자 한다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.9
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• pp.594-599
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• 2014

The heat dissipation conditions of high-power 5 watt LEDs-based searchlight modules were optimized with varying LED bar'shape, materials, and ambient temperature. The LED junction temperature was estimated by using Computational Fluid Dynamics simulation. The optimal heat dissipation conditions were found as follows; LED bar' shape: L=80 mm, W=4 mm, t=10 mm, copper material, LED junction temperature of $116.6^{\circ}C$, ambient temperature of $50^{\circ}C$, total mass of 184 g, and shadowing area of $320mm^2$. The difference between the junction temperatures of our fabricated and simulated LEDs-based searchlight modules is about $3^{\circ}C$, which confirms the validity of our thermal simulation results.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.3
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• pp.208-212
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• 2015

This study will design the structural optimization of 21 W LED heat sink using the thermal conductive plastic materials. The thermal conductive plastic heat sink is inferior to aluminum heat sinks in thermal properties. This study will solve this problem using formability of thermal conductive plastic heat sink. A heat sink was optimized in terms of the number, and the thickness of fins and the base thickness of the heat sink, using the Heatsinkdesigner software. Also by using SolidWorks Flow simulation and thermal analysis software, the thermal characteristics of the heat sink were analyzed. As the result, the optimized heat sink has 17 fins, which are 1.5 mm thick and a 3.7 mm-thick base. The highest and the lowest temperature were $51.65^{\circ}C$ and $46.24^{\circ}C$ respectively. Based on these results, The thermal conductive plastic heat sink is considered possible to overcome heating problem when designing in complex structure.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.19-19
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• 2010

현재 산업에서 높은 정밀성과 설치의 간편함으로 이용량이 증가하고 있는 초음파 유량계는 압전진동자를 사용하여 측정을 한다. 일반적으로 초음파 유량계에서 초음파를 발생하고 수신하는 압전 세라믹 진동자의 경우 대부분 $200^{\circ}C$ 이상의 고온에서는 사용이 불가능하다. 따라서 고온에서의 이용을 위한 사용가능 온도의 영역을 개선하기 위한 조성이나 구조적인 변화가 필요하였고, 조성변화에 있어서는 한계가 있기 때문에 구조 측면에서 접근하고자 하였다. 초음파 유량계의 구조에 있어 외접형 도파관 방식을 선택하였으며, 도파관의 길이, 방열판의 개수, 재질 등의 변수에 대하여 시뮬레이션을 하였다. 시뮬레이션 결과를 바탕으로 얻어진 결과에 대하여 샘플을 제작하였으며, 압전 진동자에 도달되는 온도를 평가 하였을 시 방열판에 대한 온도감소효과를 얻을 수 있었다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.2
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• pp.158-163
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• 2013

In this paper, thermal analysis of heatsink for 30 W class Chip-on-Board (COB) LED light source is performed by using SolidWorks Flow Simulation package. In order to increase the convection heat transfer, number of fin and shape of the heatsink is optimized. Furthermore, a copper spread is applied between the COB LED light source and the heatsink to mitigate the heat concentration on the heatsink. With the copper spread, the junction temperature between the COB LED light source and the heatsink is $50.9^{\circ}C$, which is $5.4^{\circ}C$ lower than the heatsink without the copper spread. Due to the improvement of the junction temperature, the light output is improved by 5.8% when the LED light source is stabilized. The temperature difference between the simulation and measured result of the heatsink with the copper spread is within $2^{\circ}C$, which verifies the validity of the thermal design method using a simulation package.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.25 no.1
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• pp.117-123
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• 2001

In present study a methodology has been developed and applied for the optimum design and performance evaluation of microchannel heat sinks. The optimum design parameters include channel number and fin thickness. For a trial model of 127mm in length, 52.5mm in width, 16mm in height and 2.5mm in base thickness, the optimum channel number and the fin thinckness have been determined to be of 194 and 0.08359mm, respectively in laminar flow region. Performance of the optimally designed microchannel heat sinks has been compared with those having 50% and 150% of the number of channels. The results showed that the 50% and 150% designs increased the pumping power by 200% and 150%, respectively.

• Solar Energy
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• v.17 no.3
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• pp.67-73
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• 1997

In order to development of a new wall structure type thermal diode for energy saving, the numerical studies have been performed for natural convection across an rectangular enclosure with the various lengthes of the heat source and sink plate. The governing equations for the two-dimensional, laminar, natural convection process in an enclosure are discretized by the control volume approach which insures the conservative characteristics to be satisfied in the calculation domain, and solved by a elliptic SIMPLE algorithm. The momentum and energy equations are coupled through the buoyancy term.

• Composites Research
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• v.28 no.5
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• pp.322-326
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• 2015

We developed the high-power LED beacon and investigated the applicability of composite materials for the light-weight design of LED beacon. By means of the application of composite materials, the vertical deformation could be reduced by 17% and the total weight of LED beacon 8.9 kg comparable to 20% light-weighting against aluminum beacon. In thermal radiation test, the maximum temperature of LED package was measured to $63.5^{\circ}C$ under ambient temperature ($20^{\circ}C$), which is acceptable considering both performance and lifespan of LED packages. In this study, the applicability of composite materials was demonstrated for light-weight design of high-power LED beacon.

• Journal of the Korea Safety Management & Science
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• v.15 no.2
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• pp.129-134
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• 2013

In this study, the heat flow analysis compatible commercial code CFX 11 was used to develop the structure inside PCB circuit board devices, which could stable radiant heat as well as the cooling device within it. In case of modifying the arrangement of electronic parts on the PCB inside the multi channel temperature measurement board devices, radiant heat effects did not show a rising tendency, whereas the overall temperature went down in case of installing the vents in the outer case of PCB circuit board devices. In terms of installation location, it was the most appropriate to install it on the electronic parts with no heat. Besides, in case of mounting the fan as a cooling device by considering various user environments for multi channel temperature measurement board devices, the radiant heat effects were shown higher than in case of installing the vents, and the middle sections were the most appropriate to its installation location. In case of changing the wind quantity of the fan from its selected installation location, the best radiant heat effects were shown at high speed as expected.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.10
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• pp.673-677
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• 2014

In this paper, thermal analysis of HDU (Heat Dissipation Unit) for infrared CCTV is performed by using SolidWorks Simulation (Thermal analysis) package, in order to change the part materials and HDU shape is optimized. Furthermore, HDU disperses the aggregated heat around the LED inside the housing. The junction temperature of infrared LED checked by HDU check was $65.83^{\circ}C$, $42.02^{\circ}C$, respectively. In addition, the Thermoelement by changing the shape of the HDU was possibly designed and equipped with. Comparison with simulation and prototype measurement results, without HDU model was $65.83^{\circ}C$, $61.99^{\circ}C$, respectively. In addition to with HDU model was $42.02^{\circ}C$, $39.01^{\circ}C$, respectively. Only HDU mounted into infrared CCTV is usable in the ordinary house or outdoors. Also HDU with thermal element, fan mounted into infrared CCTV is usable in a blast furnace workplace or high temperature workplace.