• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.149-154
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• 2018

This paper describes the fabrication and heat transfer property of 50 watts rated LED array module where multiple chips are mounted on chip-on-board type ceramic-metal hybrid substrate with high heat dissipation property for high power street and anti-explosive lighting system. The high heat transfer ceramic-metal hybrid substrate was fabricated by conformal coating of thick film glass-ceramic and silver pastes to form insulation and conductor layers, using thick film screen printing method on top of the high thermal conductivity aluminum alloy heat-spreading panel, then co-fired at $515^{\circ}C$. A comparative LED array module with the same configuration using epoxy resin based FR-4 PCB with thermalvia type was also fabricated, then the thermal properties were measured with multichannel temperature sensors and thermal resistance measuring system. As a result, the thermal resistance of the ceramic-metal hybrid substrate in the $4{\times}9$ type LEDs array module exhibited about one third to the value as that of FR-4 substrate, implying that at least triple performance of heat transfer property as that of FR-4 substrate was realized.

• KIPE Magazine
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• v.25 no.4
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• pp.28-34
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• 2020

• Proceedings of the KIPE Conference
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• 2019.07a
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• pp.271-272
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• 2019

본 논문은 친환경 전기차용에 적용되는 있는 고밀도 LDC(Low-Voltage DC-DC Converter) 전력변환장치의 PCB구조와 스위칭소자에 따른 PCB의 발열특성을 해석한다. 전력변환장치 PCB사이에 알루미늄 플레이트를 적용하여 다면 방열경로를 통한 PCB방열특성을 비교하고, 또한 기존 Si-FET와 낮은 온 상태 도통저항을 가지는 GaN-FET 반도체디바이스를 적용한 전력변환장치의 PCB 방열특성을 시뮬레이션을 통해 비교 및 검토하였다.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.38 no.11
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• pp.1087-1093
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• 2010

The satellite thermal control H/W composed of two parallel channels working for heat pipe (HP) and phase change material (PCM) is suggested for the high heat dissipating component which works intermittently with short duty. In a limited point of view, the HP-PCM device is a kind of off-the-shelf component that requires no dedicated configuration and thermal designs to PCM. Therefore, it can be used with less impact on the program cost and schedule different from most of the PCM applications. In present study the typical honeycomb structure radiator applying the HP-PCM device is designed and the detail thermal math model is developed for numerical analyses. The result comparison between without and with PCM shows that the HP-PCM device redistributes the peak heat around the whole mission period through the alternate melting and freezing of PCM, and, as a result, the maximum and minimum temperatures are effectively alleviated. The drawback of PCM application due to low thermal conductivity can be successfully resolved by means of parallel arrangement of HP channel.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.6
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• pp.129-135
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• 2015

This paper shows significant methods that improve the lifespan of LED modules as well as efficiently using an aluminum heat-sink for LED module in high power. It proposes a method that raises stability and lifespan to protect LED modules and the power unit when the LED module has been used for a long hours at high temperatures. During the research, we applied a method of pulse-width modulation (PWM) in order to prevent the phenomenon that the entire power of a system is turned off and the lifespan is reduced when the LED nodule reacts to the high temperatures. To protect the LED module and SMPS based on high efficiency, a temperature sensor is attached underneath the circuit board and the sensor measures the temperature of circuit board when the LED module is powered on. The electrical power connected to SMPS is controlled by PWM when the temperature of the LED module reaches a particular temperature.

• Proceedings of the Korean Institute of Navigation and Port Research Conference
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• 2011.06a
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• pp.275-277
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• 2011

근래 항만의 배후광이 증가함에 따라 고광도 및 고휘도 등명기의 필요성이 대두되고 있으며 고휘도 Power LED의 급속한 발달에 따라 선진국의 주요 해상용등명기 Major 업체 제품성능 또한 지속적으로 Upgrade 되고 있다. 이에 선진국 제품 대비 동등 혹은 그 이상의 에너지소비효율을 갖춘 해상용등명기 개발을 완료하여 기존의 전구식 등명기를 대체하고자 하며 렌즈의 설계 및 제작기술과 LED모듈의 방열기술 등을 축적하여 국내 해상용등명기의 제작기술을 한층 더 높이고자 한다.

• Journal of the Korea Convergence Society
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• v.2 no.3
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• pp.45-50
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• 2011

High performance heat transfer channel is necessary to discharge operating heat of computer and high integrated circuit, refrigerator and air conditioning system. Nano-Tube is useful module witch is able to cope with heat transfer problems. The purpose of this study is to develop the process and manufacturing system for Nano-Tube. Since the Nano-Tube which is used in our country is imported, this study will contribute the development of Nano-Tube technique and economic profits with import substitute effect. This study show the procedure of process and manufacturing system development.

• 한국신재생에너지학회:학술대회논문집
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• 2009.06a
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• pp.114-117
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• 2009

The performance of PV module applying the photovoltaic effects of the semiconductor is affected by temperature. Until now, most of PV module show that the power and efficiency falls at a rate of ${\sim}0.5%/^{\circ}C$ and ${\sim}0.05%/^{\circ}C$ respectively as increase of ambient temperature. In this study, the effect of fins attached to the backside of PV module was investigated through a thermal analysis program and simulation model. The result shows that the inner temperature of PV module with fin falls about $10^{\circ}C$ compare to that of ordinary PV module.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.350-350
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• 2010

에너지 효율이 높은 LED조명을 사용하면 에너지 절감, 이산화탄소, 환경오염물질 배출 감소의 효과를 얻을 수 있다. 그러나 LED조명에서 발생하는 열은 LED조명의 수명과 에너지 효율을 감소시킨다. 따라서 LED조명을 상용화하기 위해서는 LED조명에서 발생되는 열을 효율적으로 제거하는 것이 필수적이며 LED조명 방열판의 생산단가 또한 낮아야 한다. 이러한 조건을 충족하는 LED조명용 방열판은 Al 6063이 주로 사용되고 있다. Al 6063은 열전도 특성이 우수하고 생산단가가 저렴하다. 그러나 100 W급 이상의 고출력 LED조명에 Al 6063을 사용하기 위해서는 Al 6063의 열 방출 특성을 향상시킬 필요가 있다. 금속의 열 방출 특성을 향상시키기 위해서 주로 이용되는 방법은 표면적을 극대화 시키는 것이다. 금속에 국부적인 깊이 부식을 일이키는 Pitting corrosion을 이용하면 저렴한 비용으로 Al 6063의 표면적을 극대화하여 방열판의 열 방출 특성을 향상시킬 수 있다. 실험에 사용한 기본적인 구조의 Al 6063 방열판의 크기는 $50{\times}50{\times}30(mm)$ 이며 1M HCl + 0.05M $H_2SO_4$에서 $I_a$ = +40 mA, $t_a$ = 60 ms, $I_c$ = -40 mA, $t_c$ =20 ms로 50, 100, 200 cycle AC 에칭 하였다. Pitting corrosion된 방열판은 $3W{\times}3$개의 LED모듈에서 1시간 발광 시킨 후, 열화상 카메라를 이용하여 표면온도를 측정하였다. 실험결과 AC에칭 cycle이 증가할수록 발열특성이 우수하였으며, Pitting corrosion을 이용하지 않은 방열판에 비해 최대 $5^{\circ}C$의 표면온도 감소가 이루어졌다. 본 연구를 통해, 저렴하면서도 열 방출 특성이 높은 방열판을 설계하면, 고출력 LED조명의 상용화를 앞당길 수 있을 것이다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.899-900
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• 2010