• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.4
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• pp.639-647
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• 2019

Recently, as the semiconductor integration technology due to miniaturization and high density of electronic equipment have developed, it is importantly recognized the application of thermal control system in order to release inner heat generated from chips, modules, In this study, we considered the heat transfer and pressure drop characteristics in a horizontal channel with four blocks using k-${\omega}$ SST turbulence model During CFD (Computational Fluid Dynamics) analysis, the parameters applied block width, block height, heat source and turbulence generator placement etc. As the boundary conditions of analysis, the channel inlet temperature and flow velocity were respectively 300 K and 3.84 m/s, the heat flux was $358W/m^2$. As a result, the heat transfer performance was decreased as the block width ratio (w/h) was increased, while it was increased as the block height ratio (h/w) was increased. In addition, as the arrangement of heat source size was increased to high heat flux from low heat flux, it was influenced by heat source size and the heat transfer coefficient showed a tendency to increase, When the turbulence generator was installed in the upper part of block No. 1 position the closely to the channel entrance, the heat transfer characteristics was greatly influenced on the whole of four heating blocks. and in oder to consider the pressure drop characteristics, we are able to select the most appropriate turbulence generator's position.

• Applied Chemistry for Engineering
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• v.22 no.1
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• pp.104-108
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• 2011

In the non-conductive adhesives (NCAs) for adhesion of micro electro mechanical system (MEMS), there are some problems such as delamination and cracking resulting from the large differences of coefficients of thermal expansion (CTE) between NCAs and substrates. So, the addition of inorganic particles such as silica and nano clay to the CTEs composit have been applied to reduce the CTEs of the adhesives. Additions of the flexibilizers such as siloxanes have also been performed to improve the flexibility of epoxy composite. Amino modified siloxane (AMSs) were used to improve compatibility between epoxy and siloxane. In this study, glass transition temperatures (Tg) and moduli of those composites were measured to confirm the effects of AMS with two different equivalents on thermal/mechanical properties of AMS/epoxy composites. Tg of KF-8010/epoxy composites decreased from 148 to $122^{\circ}C$ and those of X-22-161A/epoxy composites decreased from 148 to $121^{\circ}C$. Moduli of KF-8010/epoxy composites decreased from 2648 to 2143 MPa by adding KF-8010 and moduli of X-22-161A/epoxy composites decreased from 2648 to 2014 MPa. In short, using long Si-O chain AMS leads to a greater decrease in moduli. However, haven't showed significant differences in Tg's.

• Asia-pacific Journal of Multimedia Services Convergent with Art, Humanities, and Sociology
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• v.7 no.1
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• pp.219-227
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• 2017

Current military command information system uses electronic equipment a lot on which semiconductor chip is attached. It seems its' importance will increase more with latest information communication technology developing. Electronic equipment which uses electricity contains regular tolerance to high output electric signal. And EMC specification is the standardized of this electronic equipment's tolerance. On the other hand, the Institute of Atomic Energy Research has ever declared that high output electromagnetic pulse(EMP) will be broken out within the radius of 170Km when 10kt nuclear explosion occurs at an altitude of 40Km above Seoul. Then, the region suffer from the damage of most electronic equipments. Therefore, the norm to protect the influences in that case is defined by EMP protection specification. Most common electronic equipments meet the EMC norm, but there is no way to check whether they meet the EMP norm or not. That is because it is difficult to check whether they meet EMP protection norm and is on the matter of cost. Except inevitable cases, there is no review of checking whether they meet the norm or not. Considering the above, in this research, we speculate about the measures to improve military EMP protection ability by analyzing the EMC-EMP correlation and checking the EMP protection ability of general electronic equipment through the analysis.