• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.8
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• pp.1266-1272
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• 2003

This paper presents a new class of magnetic microsensors based on the Hall effect in AC microplasma. In the theoretical study, we develop a simple model of the plasma Hall sensor and express the plasma Hall voltage as a function of magnetic field, plasma discharge field, pressure, and electrode geometry. On this basis, we have designed and fabricated magnetic microsensors using AC neon plasma. In the experiment, we have measured the Hall voltage output of the plasma microsensors for varying five different conditions, including the frequency and the magnitude of magnetic field, the frequency and the magnitude of plasma discharge voltage, and the neon pressure. The fabricated magnetic microsensors show a magnetic field sensitivity of 8.87${\pm}$0.18㎷/G with 4.48% nonlinearity.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.41 no.4
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• pp.313-319
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• 2017

Fiber optics sensors that have been mainly applied to aerospace areas are now finding applicability in other areas, such as transportation, including railways. Among the sensors, the fiber Bragg grating (FBG) sensors have led to a steep increase due to their properties of absolute measurement and multiplexing capability. Generally, the FBG sensors adhere to structures and sensing modules using adhesives such as an epoxy. However, the measurement errors that occurred when the FBG sensors were used in a long-term application, where they were exposed to environmental thermal load, required calibration. For this reason, the thermal curing of adhesives needs to be investigated to enhance the reliability of the FBG sensor system. This can be done at room temperature through cyclic thermal load tests using four types of specimens. From the test results, it is confirmed that residual compressive strain occurs to the FBG sensors due to an initial cyclic thermal load. In conclusion, signals of the FBG sensors need to be stabilized for applying them to a long-term SHM.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.4 s.33
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• pp.13-22
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• 2004

In MEMS devices, packaging induced stress or stress induced structure deformation become increasing concerns since it directly affects the performance of the device. In this paper, deformation behavior of MEMS gyroscope package subjected to temperature change is investigated using high-sensitivity moire interferometry. Using the real-time moire setup, fringe patterns are recorded and analyzed at several temperatures. Temperature dependent analyses of warpages and extensions/contractions of the package are presented. Linear elastic behavior is documented in the temperature region of room temperature to $125^{\circ}C$. Analysis of the package reveals that global bending occurs due to the mismatch of thermal expansion coefficient between the chip, the molding compound and the PCB. Detailed global and local deformations of the package by temperature change are investigated, concerning the variation of natural frequency of MEMS gyro chip.