• 기계저널
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• 제42권6호
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• pp.36-41
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• 2002

• 한국공작기계학회논문집
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• 제13권3호
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• pp.61-67
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• 2004

In micro hole punching process the burr occurs inevitably, but the burr must be minimized in order to improve the quality and accuracy of the product. In this study, magnetic field-assisted polishing technique is applied to remove the burr which exists in nozzles for ink-jet printer head and proved to be a feasible for deburring by experiment. The deburring characteristics of sheet metals was investigated changing with polishing time and magnetic abrasive size. After the deburring, the burr size has remarkably reduced and roundness of the hole also has improved.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2003년도 추계학술대회
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• pp.329-333
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• 2003

In micro hole punching process the burr occurs inevitably, but the burr must be minimized in order to improve the quality and accuracy of the product. In this study, magnetic field assisted polishing technique is applied to remove the burr which exists in nozzles for ink-jet printer head and proved to be a feasible for deburring by experiment. The deburring characteristics of sheet metals was investigated changing with polishing time. After the deburring, the burr size has remarkably reduced and roundness of the hole also has improved.

• 한국정밀공학회지
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• 제21권7호
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• pp.70-75
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• 2004

The shearing process for the sheet metal is normally used in the precision elements such as a lead frame of IC chips. In these precision elements, the burr formation brings a bad effect on the system assembly and demands the additional deburring process. In this paper, we developed the small size precision punching system to investigate burr formation mechanism and to present kinematically punch-die aligning methodology between the rectangular shaped punch and die. The punch is driven by an air cylinder and the sheet metal is moving on the X-Y table system which is driven by two stepping motors. The whole system is controlled by microprocessor and is communicated with each other by RS232C serial communication protocol. Punching results are measured manually using the SEM photographs and are compared aligning result with miss aligning one.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 추계학술대회 논문집
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• pp.1084-1087
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• 1997

In this paper, we developed the micro NCT system for punching the thin plates, which is driven is driven by the standalone type microprocessor. In order to adjust the alignment between the punch and die in-situ punching procedures, the non-contact type laser sensor for measuring the burr and micro-driving system for punching die with using the differential screw are developed. The height of burr in four directions in the punched hole of test specimen are measured, and the measured data are transferred to the personal computer by RS232C serial communication technology. In the personal computer, by using the graphic user interface type monitoring program and data handling procedures which includes the filtering algorithms, the direction and length of movement of the die position is decided and these data are transferred back to the microprocessor. The microprocessor drives the micro positioning stage based on these data. Even if this method is not a perfect solution for the in-situ alignment in micro punching, but this alignment methodology is accomplished in the same stage just after the punching that we hope to solve the alignment problem in the punching system based on this technology.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2007년도 춘계학술대회 논문집
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• pp.71-74
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• 2007

Substitution of the stacked antenna for the normally pressed antenna in the mobile phone was tried for the purpose of decreasing its size. However, reduced size resulted in the difficulties obtaining the targeted characteristics with the bandwidth over 70MHz. The cross-section of the vias in the low temperature co-firing ceramics process was studied to find out effects on the bandwidth characteristics. Circular and rectangular cross-section of the via beneath different types of antenna patterns were simulated. Better bandwidth characteristics were acquired for the larger diameter of the circular section and for the rectangular section as the cross-section area increased. From the viewpoint of the shape of the cross-section, rectangular area showed better characteristics than the circular area with the same longest length in the cross-section.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 추계학술대회논문집
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• pp.101-106
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• 2003

Recent electronic equipment becomes smaller, more functional, and more complex. According to these trends, LTCC(low temperature co-fired ceramic) has been emerged as a promising technology in packaging industry. It consists of multi-layer ceramic sheet, and the circuit has 3D structure. In this technology via hole formation plays an important role because it provides an electric path for the packaging interconnection network. Therefore via hole quality is very important for ensuring performance of LTCC product. Via holes are formed on the green sheet that consists of ceramic(before sintering) layer and PET(polyethylene Terephthalate) one. In this paper we found the correlation between hole quality and process condition such as ceramic thickness, and tool size. The shear behavior of double layer sheet by micro hole punching which is different from that of single layer one was also discussed.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2001년도 춘계학술대회 논문집
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• pp.213-216
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• 2001

A micro hole punching system was developed and micro holes of 100m in diameter were successfully made on brass sheets of loom in thickness. A micro punch made of tungsten carbide was designed to withstand the punch load, considering the buckling and the bending moment due to possible misalignment error. The punch was fabricated by the grinding process with diamond wheel. The die was designed considering the punch load and fabricated by micro electrodischarge machining process. In this system the stripper is designed to guide punch tip to minimize the possible misalignment. The punch was installed on a vertical stepper and the die was mounted on an X-Y translation unit. The precision motion controller controlled all motions of the micro hole punching system. In this study technical difficulties and solutions in the micro hole punching process were also discussed.

• 소성∙가공
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• 제14권3호
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• pp.277-281
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• 2005

LTCC(Low temperature co-fired ceramic) is being recognized as a significant packaging material of electrical devices for the advantages such as relatively low temperature being needed for process, low conductor resistance and high printing resolution. In the process of LTCC electrical devices, the punched via-hole quality is one of the most important factors on the performance of the device. However, its mechanism is very complicated and optimization of the process seems difficult. In this paper, to clarify the process, via-hole punching experiments were carried out and the punched holes were examined in terms of their burr formation. The effects of thickness of PET sheet, ceramic sheet and punch-to- die clearance on via-hole quality were also discussed. Optimum process conditions are proposed and a factor $\kappa$ is introduced to express effect of the process variables.

• 소성∙가공
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• 제13권1호
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• pp.65-71
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• 2004

Recent electronic equipment becomes smaller, more functional, and more complex. According to these trends, LTCC(low temperature co-fired ceramic) has been emerged as a promising technology in packaging industry. It consists of multi-layer ceramic sheet, and the circuit has 3D structure. In this technology via hole formation plays an important role because it provides an electric path for the packaging interconnection network. Therefore via hole qualify is very important for ensuring performance of LTCC product. Via holes are formed on the green sheet that consists of ceramic(before sintering) layer and PET(polyethylene terephthalate) one. In this paper we found the correlation between hole quality and process condition such as PET thickness and ceramic thickness. The shear behavior of double layer sheet by micro hole punching which is different from that of single layer one was also discussed.