• Proceedings of the KWS Conference
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• 2009.11a
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• pp.56-56
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• 2009

AISI 316L 스테인리스강에 새롭게 디자인한 서로 다른 3가지 응고모드를 가진 와이어로 FCAW(Flux Cored Arc Welding)을 하였다. 각각의 3가지 와이어는 Pseudobinary phase diagram에 따라 AF, FA, F모드를 가졌다. 미세조직은 $Cr_{eq}/Ni_{eq}$이 증가할수록 델타 페라이트 함량이 증가하였으며, 초정 상의 경우 초정 오스테나이트에서 초정 페라이트로 변태하였고, 연성저하균열의 민감도가 감소하였다. 연성저하균열은 이동결정립계의 형상에 따라 좌우되며, 미량의 페라이트를 함유한 오스테나이트에서는 페라이트가 핀(Pin) 역할을 제대로 하지 못하여 직선형태의 이동 결정립계 따라 입계 미끄러짐의 메커니즘을 통해 전파되었으며, 곡선형태의 이동 결정립계에서는 델타 페라이트가 핀 역할을 하여 역할을 하여 구속 상태에서 응력집중을 막고 응력을 분산시켜 균열이 전파되는 것을 방해하여 균열이 발생되지 않았다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.12
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• pp.1655-1662
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• 2011

We have conducted a study on stainless steel laser-welding materials by using a laser beam for the evaluation. Stainless steel used in a rust and excellent thermal deformation has a variety of application. In this study, to improve the mechanical properties of stainless steel, a 50 W laser thermal source is used and magnetic fields are applied, on the basis of suggestions. The mechanical properties and performance are evaluated by performing a numerical analysis, tensile test, and shape, microstructure, and hardness test. The results show that the mechanical properties of improve increased speed the melting pool, tensile strength of 16 kPa rise, run into the melting zone and hardness 7 Hv.

• Korean Journal of Materials Research
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• v.2 no.2
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• pp.85-94
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• 1992

The size, morphology and distribution of pores which affect on the physical properties of thermal barrier coatings were investigated to find the relationship with spraying parameters. The plasma-sprayed zirconia coatings contained numerous micropores as well as macropores which were appeared as spherical and irregular pores, and cracks. The pore formation process and its characteristics were varied with spraying distance. Porosity itself was varied with spraying parameters such as spray gun current, gas flow rate and the gas used(Ar or $N_2). The Porosity of coatings was ranged from 10 to 18% with the variation of spraying conditions. The relative hardness measured by the scratch test, showed strong dependence on the porosity of coatings rather than spraying parameters.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.77-77
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• 2018

Panel level packaging (PLP) 공정은 차세대 반도체 패키징 기술로써 wafer level packaging 대비 net die 면적이 넓어 생산 단가 절감에 유리하다. PLP 공정에 적용되는 구리 재배선 층 (RDL, redistribution layer)은 두께 불균일도에 의해 전기 저항의 유동이 민감하게 변화하기 때문에 RDL의 두께를 균일하게 형성하는 것은 신뢰성 측면에서 매우 중요하다. 구리 RDL은 주로 도금 공정을 통해 형성되며, 균일한 도금막 형성을 위해 도금조에 평탄제를 첨가하여 도금 속도를 균일하게 한다. 도금막에 대한 흡착은 주로 평탄제의 imine 작용기에 포함된 질소 원자가 관여하며, imine 작용기의 4차화에 의한 평탄제의 흡착 정도를 제어하여 평탄제 성능을 개선할 수 있다. 본 연구에서는 도금 평탄제에 포함된 imine 작용기의 질소 원자를 4차화하여 구리 RDL의 도금 두께 불균일도를 제어하고자 하였다. 유기첨가제와 4차화 반응을 위해 알킬화제로써 dimethyl sulfate의 비율을 조절하여 각각 0, 50, 100 %로 4차화 반응을 진행하였다. 평탄제의 4차화 여부를 확인하기 위해 gel permeation chromatography (GPC) 분석을 실시하였다. 도금은 20 ~ 200 um의 다양한 배선 폭을 갖는 구리 RDL 미세패턴에서 진행하였으며, 4차화 평탄제를 첨가하여 광학 현미경과 공초점 레이저 현미경을 통해 도금막 표면과 두께에 대한 분석을 실시하였다. GPC 분석을 통해 4차화 반응 후 알킬화제에 의해 나타나는 GPC peak이 감소한 것을 확인하였다. 광학 현미경 및 공초점 레이저 현미경 분석 결과, 4차화된 질소 원자가 존재하지 않는 평탄제의 경우, 도금 시 도금막의 두께가 불균일하였으며 단면 분석 시 dome 형태가 관찰되었다. 또한 100 % 4차화를 실시한 평탄제를 첨가하여 도금 한 경우 마찬가지로 두께가 불균일한 dish 형태의 도금막이 형성되었다. 반면, 50 % 4차화를 적용한 평탄제를 첨가한 경우, 도금막 단면의 형태는 평평한 모습을 보였으며 매우 양호한 균일도를 가지는 것으로 확인되었다. 이로 인해 imine 작용기를 포함한 평탄제의 4차화 반응을 통해 구리 RDL의 단면 형상 및 불균일도가 제어되는 것을 확인하였으며, 4차화된 imine 작용기의 비율을 조절하여 높은 균일도를 갖는 구리 RDL 도금이 가능한 것으로 판단되었다.

• Journal of the Korea institute for structural maintenance and inspection
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• v.18 no.1
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• pp.84-92
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• 2014

The purpose of study is to analyze mechanism with early high portland cement and hardening accelerator. As the result, it was concluded that hardening accelerator makes accelerates appearance of $Ca(OH)_2$ through experiment using TG-DTA when it hydrates with cement. On the result of compressive strength, as increasing the amount of hardening accelerator used, early compressive strength was improved. Also, as a result of hydration heat, hardening accelerator accelerates hydration of $C_3S$ that is cement's component. On the result of XRD's analyzation, hydration product for each age could be check and it was shown that as increasing the amount of hardening accelerator used, peak point of hydration product was recorded high. As the result of SEM, appearance of C-S-H was shown as the amount of $Ca(OH)_2$'s appearance and each age according to additive contents of hardening accelerator. Therefore hardening accelerator used on this study is effective on getting early compressive strength.

• Korean Journal of Materials Research
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• v.11 no.5
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• pp.413-418
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• 2001

We investigated change of crystal structure, surface morphology and crystal orientation of the electrodeposited film from dispersed $SiO_2$ suspensions (colloidal silica) copper sulfate bath and arse corrosion potentials and physical specific properties. As addition of colloidal silica in copper electrolytic hath, the crystal Particles on filial was fined-down, made uniform and account of particles were increased. Hardness of copper electrodeposited film ascended about 15% and (111), (200) and (311) plane of X-ray diffraction patterns were almost swept away, so preferred orientation chanced from (111) to (110) plane. Also, corrosion potential of electrodeposited copper film was noble with colloidal silica addition.

• Elastomers and Composites
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• v.44 no.4
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• pp.384-390
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• 2009

Roll-to-roll forming process is one of important metal processing technology because the process is simple and economical. These days, with these merits, roll-to-roll forming process is tried to be employed in manufacturing the circuit board, barrier ribs and solar cell plate. The solar cell plate may have millions of patterns, and the analysis of forming considering all the patterns is impossible due to the computational costs. In this study, analyses are carried out for various numbers of patterns and the results are compared. It is shown that the analyses results with four row patterns and twelve row patterns are same. So, it is considered that the analysis can be carried out for only four rows of pattern for the design of incremental roll-to-roll forming process. Also formability is analysed for various number of mesh, protrusion shapes and forming temperature.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.1
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• pp.55-60
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• 2007

The codeposition behavior of submicron sized diamond with nickel from nickel electrolytes has been investigated. Electroplating of diamond dispersed nickel composites was carried out on a rotating disk electrode (RDE). The effects of current type and current density on the electrodeposited Ni-diamond composite coating were investigated. The effects of surfactants on the composite coating were also investigated. The hardness of coating was measured with varying electroplating conditions using Micro Vickers. As diamond was incorporated into the coating, the hardness of coating as well as the wear resistance was improved. The hardness of the coating was increased as much as 100% and the wear resistance was improved as much as 27%. The hardness of composite coating layer increased slightly at the diamond content of above 20 gpl.

• Journal of the Korean Institute of Telematics and Electronics T
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• v.35T no.1
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• pp.7-13
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• 1998

The VLSI devices of submicron level trend to have a lowering of reliability because of hot carriers by two dimensional influences which are caused by short channel effects and which are not generated in a long channel devices. In order to minimize the two dimensional influences, much research has been made into various types of source/drain structures. MOS typed tunnel transistor with Schottky barrier junctions at source/drain, which has the advantages in fabrication process, downsizing and response speed, has been proposed. The experimental device was fabricated with p type silicon, and manifested the transistor action, showing the unsaturated output characteristics and the high transconductance comparing with that in field effect mode. The results of trial indicate for better performance as follows; high doped channel layer to lower the driving voltage, high resistivity substrate to reduce the leakage current from the substrate to drain.

• Journal of the Korean Electrochemical Society
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• v.3 no.3
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• pp.157-161
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• 2000

In order to investigate the substrate effect on the electrochemical properties of thin-film electrode, $LiCoO_2$ was deposited onto the alumina, chemically etched-Si and flat-Si substrates. After annealing at $800^{\circ}C$ in $O_2$ for 30min, the film deposited on the alumina consisted of large particles with several cracks, whereas the film deposited on the flat-Si substrate was composed of very small and uniform particles. The films deposited on the flat-Si showed improved electrochemical properties such as peak potential divergence and rate-capability, over those deposited on the alumina and chemically etched-Si substrate, which can be attributed to the differences of the particle size surface morphology, and the electrical resistance of the current collector.