• 한국재료학회지
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• 제18권9호
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• pp.486-491
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• 2008

The effect of annealing treatment conditions on the interfacial adhesion energy between electrolessplated Ni film and polyimide substrate was evaluated using a $180^{\circ}$ peel test. Measured peel strength values are $26.9{\pm}0.8,\;22.4{\pm}0.8,\;21.9{\pm}1.5,\;23.1{\pm}1.3,\;16.1{\pm}2.0\;and\;14.3{\pm}1.3g/mm$ for annealing treatment times during 0, 1, 3, 5, 10, and 20 hours, respectively, at $200^{\circ}C$ in ambient environment. XPS and AES analysis results on peeled surfaces clearly reveal that the peeling occurs cohesively inside polyimide. This implies a degradation of polyimide structure due to oxygen diffusion through interface between Ni and polyimide, which is also closely related to the decrease in the interfacial adhesion energy due to thermal treatment in ambient conditions.

• Tribology and Lubricants
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• 제26권1호
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• pp.68-72
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• 2010

A ceramic coating is a surface treatment method that is being used widely in the industrial field, recently. Ni-P plating is also being used widely because of its corrosion resistance and low cost. An anodizing method is applicable to aluminum alloy. An anodizing method generates a thick oxide layer on the surface and then, that heightens hardness and protects the surface. These surface treatments are applied to various mechanical components and treated surfaces relatively move one another. In this study, tribological characteristics of Ni-P plating and TiAlN coating on anodized Al alloy are compared. The counterpart, anodized Al alloy, is worn out abrasively by Ni-P plating and TiAlN coating that have higher hardness. Abrasively worn debris accumulated on the surfaces of Ni-P plating and TiAlN coating, and then transferred layer is formed. This transferred layer affects the amplitude of variation of friction coefficient, which is related to noise and vibration. The amplitude of variation of friction coefficient of Ni-P plating is lower than those of TiAlN coating during the tests.

• 한국분말재료학회지
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• 제22권2호
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• pp.134-137
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• 2015

The monolayer engineering diamond particles are aligned on the oxygen free Cu plates with electroless Ni plating layer. The mean diamond particle sizes of 15, 23 and $50{\mu}m$ are used as thermal conductivity pathway for fabricating metal/carbon multi-layer composite material systems. Interconnected void structure of irregular shaped diamond particles allow dense electroless Ni plating layer on Cu plate and fixing them with 37-43% Ni thickness of their mean diameter. The thermal conductivity decrease with increasing measurement temperature up to $150^{\circ}C$ in all diamond size conditions. When the diamond particle size is increased from $15{\mu}m$ to $50{\mu}m$ (Max. 304 W/mK at room temperature) tended to increase thermal conductivity, because the volume fraction of diamond is increased inside plating layer.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 추계학술대회 논문집 학회본부 C
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• pp.909-911
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• 1999

Metalization technology of the fine patterns by electroless plating is required in place of electrodeposition as high-density printed circuit boards (PCB) become indispensable with the miniaturization of electronic components. Electroless nickel plating is a suitable diffusion barrier between conductor metals, such as Al and Cu, and solder is essetional in electronic packaging in order to sustain a long period of service. Moreover, Electroless nickel has particular characteristics including non-magnetic property, amorphous structure, wear resistance, corrosion protection and thermal stability. In this study fundamental aspects of electroless nickel deposition were studied with effect of complexeing agents of different kinds. Then, the property of electroless deposit are controlled by the composition of the deposition solution, the deposition condition such as temperature and pH value and so on. the characteristics of the deposits has been carried out.

• 한국표면공학회지
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• 제41권6호
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• pp.312-324
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• 2008

In this study, the functional property as a super abrasive material was secured for CBN powder by the electroless Ni-P plating on the surface of the particle. The plating solution has been prepared to control the surface morphology by regulating surfactants and process conditions. The effects of processing parameters on the surface morphology of CBN powder was discussed. The results are summarized as follows; A stable plating tendency was achieved from 1 hour after quantitatively dropping reducing agent. It was observed that more than 50% of the weight gain was obtained by Ni-P coating on the surface of CBN super abrasive powder. The morphology of the Ni-P coating layer is consisted of botryoidal and spiky type and it could be controlled by regulating processing parameters. Superior characteristic in terms of surface morphology was found in the nonionic surfactant XL-80N. It was found that XL-80N considerably decreased surface tension of CBN powder and Ni-P alloy surface then enhance wettability as well as plating rate. Metal coated CBN powder as a raw material of resin bond wheel has been developed through this investigation.

• 한국염색가공학회지
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• 제22권1호
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• pp.77-82
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• 2010

Highly conductive yarn was successfully obtained using electroless nickel plating method with palladium activation. In the presence of palladium seed on surface of fibers as a catalyst, continuos nickel layer produced on surface of fibers by reducing $Ni${2+}$ ion in the electroless plating bath to $Ni^0$. It was found that the Pd-activation using $SnCl_2$ and $PdCl_2$ to deposit palladium seeds on the surface of fibers plays a key role in the subsequent electroless plating of nickel. It also found that electroless nickel plating on the fibers can induce the nickel-plated $ELEX^{(R)}$ fibers to improve the electrical conductivity of the fibers. The thickness of nickel coating layer on the Pd-activated $ELEX^{(R)}$ fibers and specific conductivity of the fiber were increased through electroless plating time. The temperature of nickel plating bath was very effective to enhance the nickel deposition rate.

• 한국표면공학회지
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• 제19권2호
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• pp.31-43
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• 1986

The properties of the electroless nickel deposit mainly depends on the pH of the bath, the plating temperature, and the molar ratio of nickel to hypophosphite but they are also affected by its formulation and concentration of complexing and buffering agents. According to changeing the concentration of triethanolamine and boric acid, phosphorous contents, microsturcture, crystalline, hardness and wear resistance of deposits obtained from ammoniacal alkaline bath were investigated by EPMA, differential thermal analyser, X-ray diffractometer and wear tester. The results are as follows; (1) Increasing concentration of triethanolamine in the bath, the deposits is slightly inclined to increase its phosphorous content(3.7% P). (2) In the as-plated state, the deposits are not crystallized state but they are thermally unstable phase, and they are crystallized with precipitating $Ni_3P$ at 400$^{\circ}C$. (3) The deposit containing 2.3% P has higher hardness value in the as plated and heat treated state at below 300$^{\circ}C$ than those of 3.7% phosphorous deposit (1090Hk). But in the case of heat treating at 400$^{\circ}C$, the former has lower hardness value (1000Hk) than the latter and has remarkably Ni(III) orientation by heat treatment. (4) The 3.7% phosphorous deposit heat treated at 400$^{\circ}C$ has better wear resistance than hard chromium plating.

• Journal of Welding and Joining
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• 제35권3호
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• pp.1-6
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• 2017

The effect of metal turnover (MTO) of electroless Ni plating bath on the brittle fracture behavior of electroless nickel electroless palladium immersion gold (ENEPIG)/Sn-3.0wt%Ag-0.5wt%Cu(SAC305) solder joint was evaluated in this study. The MTOs of the electroless Ni for the ENEPIG surface finish were 0 and 3. As the MTO increased, the interfacial IMC thickness increased. The brittle fracture behavior of the ENEPIG/SAC305 solder joint was evaluated with high speed shear (HSS) test. The HSS strength decreased with increasing the MTO of the electroless Ni bath. The brittle fracture increased with increasing the shear speed of the HSS test. The percentage of the brittle fracture for the 3 MTO sample was much higher than that for the 0 MTO sample.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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• pp.708-711
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• 1999

The Cu/Ni/Au lamellar structure is extensively used as an under bump metallization on silicon file, and on printed circuit board(PCB) pads. Ni is plated Cu by either electroless Ni plating, or electrolytic Ni plating. Unlike the electrolytic Ni plating, the electroless Ni plating does not deposit pure Ni, but a mixture of Ni and phosphorous, because hypophosphite Is used in the chemical reaction for reducing Ni ions. The fracture crack extended at the interface between solder balls of plastic ball grid (PBGA) package and conducting pads of PCB. The fracture is duets to segregation at the interface between Ni$_3$Sn$_4$intermetallic and Ni-P layer. The XPS diffraction results of Cu/Ni/Au results of CU/Ni/AU finishs showed that the Ni was amorphous with supersaturated P. The XPS and EDXA results of the fracture surface indicated that both of the fracture occurred on the transition lesion where Sn, P and Ni concentrations changed.

• 대한금속재료학회지
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• 제48권1호
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• pp.90-100
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• 2010

Micro-conductive patterns were microfabricated on an insulating substrate ($SiO_2$) surface by a selective electroless nickel plating process in order to investigate the formation of seed layers. To fabricate micro-conductive patterns, a thin layer of metal (Cu.Cr) was deposited in the desired micropattern using laser-induced forward transfer (LIFT). and above this layer, a second layer was plated by selective electroless plating. The LIFT process. which was carried out in multi-scan mode, was used to fabricate micro-conductive patterns via electroless nickel plating. This method helps to improve the deposition process for forming seed patterns on the insulating substrate surface and the electrical conductivity of the resulting patterns. This study analyzes the effect of seed pattern formation by LIFT and key parameters in electroless nickel plating during micro-conductive pattern fabrication. The effects of the process variables on the cross-sectional shape and surface quality of the deposited patterns are examined using field emission scanning electron microscopy (FE-SEM) and an optical microscope.