• 발명특허
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• v.18 no.9 s.211
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• pp.18-22
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• 1993

• Journal of the Microelectronics and Packaging Society
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• v.11 no.2 s.31
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• pp.11-16
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• 2004

Electronic devices are getting smaller due to integration of electronic chip, and heat generated in electronic devices can cause loss of performance and/or reliability of the devices. In this research, metals such as gold, nickel and copper are plated onto a porous membrane by electroless plating method to make an efficient micro-heatsinks. Electroless plating includes sensitization and activation steps in pre-treatment steps. A polycarbonate(PC) membrane was sensitizied, activated and deposited in each metal solution for plating. Among manufactured microfibrils, heat transfer and radiation properties of Ni-microfibril with high surface area were more effective than those of $Au^-$ and Cu-microfibril.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.21-27
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• 2007

Nickel bumps for ACF(anisotropic conductive film) flip chip application were fabricated by electroless and electro plating and their mechanical properties and impact reliability were examined through the compressive test, bump shear test and drop test. Stress-displacement curves were obtained from the load-displacement data in the compressive test using nano-indenter. Electroplated nickel bumps showed much lower elastic stress limits (70MPa) and elastic moduli ($7.8{\times}10^{-4}MPa/nm$) than electroless plated nickel bumps ($600-800MPa,\;9.7{\times}10^{-3}MPa/nm$). In the bump shear test, the electroless plated nickel bumps were deformed little by the test blade and bounded off from the pad at a low shear load, whereas the electroplated nickel bumps allowed large amount of plastic deformation and higher shear load. Both electroless and electro plated nickel bumps bonded by ACF flip chip method showed high impact reliability in the drop impact test.

• Polymer(Korea)
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• v.31 no.5
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• pp.410-416
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• 2007

Monodisperse polymer particles were prepared via one- step seeded polymerization using PMMA as seed particles, and HDDA, triEGDMA or EGDMA as crosslinking monomer. For the study, the effects of 1) the ratio of the absorbed monomer to the seed polymer particles (swelling ratio), 2) the characteristics of crosslinking monomer, 3) electroless Ni plating, and 4) electroless Au Plating on the variation of mechanical properties of polymer particles, such as recovery rate, K-values, breaking strength and breaking displacement were investigated by using MCT (micro compression test). It was observed that swelling ratio of polymer particles influenced only on breaking strength of polymer Particles, while electroless plating did on recovery rate, K-values ($K_{10}\;and\;K_{20}$) and breaking strength of electroless plated polymer particles. However, breaking displacement and K-values ($K_{30}{\sim}K_{50}$) were more or less insensitive to electroless plating.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.204.1-204.1
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• 2014

스마트폰과 같은 통신기기 및 각종 전자제품에 있어 크기의 축소와 간소화 추세에 따라 인쇄회로기판(PCB)의 초미세회로설계 기술이 요구됨에 따라, 인쇄회로기판과 첨단 전자부품 사이의 접합 신뢰성을 향상시키기 위해 무전해 니켈 도금이 널리 사용되고 있다. 일반적으로, 무전해 Ni도금은 강산, 강염기성 용액을 이용하여 수행되고 있다. 따라서, 공정과정 중에 기판의 손상을 초래하기도 할뿐만 아니라, 환경적으로도 문제시 되고 있다. 본 연구에서는 친환경적 도금공정의 개발을 위해 중성에서 N-(B)무전해 도금을 시행하였다. 중성의 무전해 도금공정은 어떠한 기판을 사용하여도 기판의 손상없이 도금이 가능하다는 장점을 가지고 있고, Boron(B)은 Ni을 비정질화 시키는 물질로 알려져 있다. B가 첨가된 무전해 Ni도금 박막에 있어 B의 영향을 알아보기 위하여 중성조건에서 B를 포함한 DMAB의 첨가량을 조절하였다. Ni-(B) 무전해 도금 시 도금조의 온도는 $40^{\circ}C$로 하였고, 무전해 도금액의 pH는 7(중성)로 유지하였다. Cu Foil기판을 사용하여 DMAB의 양에 따라 성장된 Ni-B무전해 도금 박막의 특성을 분석하기 위해 X-ray Diffraction (XRD), Field Emission Scanning Electron Microscope (FE-SEM), Optical microscope (OM), X-ray Photoelectron Spectroscopy (XPS), X-ray Absorption Spectroscopy (XAS)을 이용하였다.

• 한국전기화학회:학술대회논문집
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• 1999.04a
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• pp.45-45
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• 1999

• The Optical Journal
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• s.96
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• pp.49-54
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• 2005

프로젝션 TV, 비디오 카메라나 CD 등과 같은 전자 광학((Electro-optics) 제품 시장이 확대되고 있다. 이들 제품의 광학 부품을 소형경량화·고성능화·저가격화 하기 위해 각 제조업체에서 독자적인 비구면 가공 기술을 개발하고 있으며, 종전의 유리 렌즈에서 좀더 가벼운 플라스틱 렌즈로 이동하고 있다. 이 광학 부품들의 요구 정밀도는 형상 정밀도, 면 거칠기 모두 요구값이 높아지고 있으며 초정밀 비구면 경면 절삭 기술이 이용되고 있다. 본 고에서는 프로젝션 TV 및 비디오 카메라의 비구면 플라스틱용 금형을 대상으로 무전해 니켈 도금막의 초정밀 경면 절삭 기술에 대해 소개한다.

• Applied Chemistry for Engineering
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• v.27 no.2
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• pp.210-216
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• 2016

In this paper, the electrical and resistance heating properties of carbon fiber heating elements with different electroless Ni-P plating times for car seat were studied. The specific resistance and specific heat of the carbon fibers were determined using 4-point probe method and differential scanning calorimetry (DSC), respectively. The surface morphology and temperature of carbon fibers were measured by scanning electron microscope (SEM) and thermo-graphic camera, respectively. From experimental results, the nickel layer thickness and surface temperature of carbon fibers increased with increasing the plating time. However, the specific heat and specific resistance decreased with respect to the increased plating time. In conclusion, the electroless Ni-P plating could improve the resistance heating and electrical properties of carbon fiber heating elements for car seat.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.3
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• pp.27-33
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• 2008

With increasing use of portable appliances such as PDA and cellular phone, changing environment of applications requires higher solder joint reliability. The ENIG (Electroless Nickel Immersion Gold) process has been widely used for fine pitch SMT (Surface Mount Technology) and BGA (Ball Grid Array) packaged devices due to its benefits including excellent solderability, high uniformity and substantial legibility throughout the packaging process. Its brittle fracture of solder, however, has received increasingly attentions. It was Down that fracture brittleness is mainly related with black pad resulting from galvanic nickel corrosion and P-enriched layer formation between the IMC (Intermetallic Compounds) and electroless nickel layer. Theoretically, smooth electroless Ni layer was blown to have a advantages in minimizing the black pad phenomenon by uniform solution exchange during immersion gold plating. Nevertheless, how to control the surface morphology of electroless Ni layer has been hardly blown. This study investigates an effect of surface morphology of Cu underlayer on surface morphology of electroless Ni layer. To obtain various kinds of surface morphology of Cu layer, two types of Cu etching chemical and a number of Cu etching treatment were applied.

• The Monthly Technology and Standards
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• s.25
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• pp.34-36
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• 2004