• Journal of the Korean Vacuum Society
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• v.22 no.6
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• pp.285-290
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• 2013

Epitaxial graphene on metal substrates provides excellent platforms to study its atomic and electronic structures, and can be grown either by surface segregation of carbon or by chemical vapor deposition. The growth behaviors of the two methods, however, have not been directly compared each other. Here, we studied domain structures of graphene grown by three different methods, surface segregation, post-annealing with adsorbed ethylene, and high-temperature dose of ethylene, using scanning tunneling microscopy. The first two methods resulted in graphene regions with areas of $100nm^2$, whereas the third method showed large area graphene (> $10^4nm^2$) with regular hexagonal Moire patterns, implying that high-temperature dose of ethylene is preferable for further studies on graphene such as additional growth of organic molecules.

• Journal of the Institute of Electronics and Information Engineers
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• v.49 no.11
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• pp.175-182
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• 2012

The scattered radiation always occurs when X-ray strikes the object. To absorb the scattered X-rays, the antiscatter grids are used, however these grids images are superimposed in the projection radiography images. When those images are displayed on the monitor, moir$\acute{e}$ patterns are overlapped over the images and disturb the anatomical informations. Most of the researches performed to date removed the grid noises by calculating or observing those frequencies in one dimensional frequency domain, two dimensional wavelet transform or Fourier transform. Those methods filtered not only the grid noises but also diagnostic informations. In this paper, we proposed the combined wavelet packet-Fourier method to remove the grid artifact in CR images. For the phantom image, the proposed method achieved from 5.2 to 7.4 dB better than others in SNR and for CR images by rejecting the grid noise bands effectively while leaving the remaining bands unchanged, the loss of images could get minimal results.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.17-27
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• 2011

This paper describes an experimental study and finite element analysis (FEA) carried out for investigating thermal deformation behavior of solders, resulting from temperature change in the solder. With such a goal in mind, a shear specimen that was composed of two metal bars having different coefficient of thermal expansion and solder blocks placed between two bars was designed and fabricated. Two different types of solder blocks, eutectic solder (Sn/36Pb/ 2Ag) and lead-free solder (Sn/3.0Ag/0.5Cu) were tested as well. Fringe patterns for several temperature steps were recorded and analyzed for three temperature cycles using a real-time moir$\acute{e}$ setup. The experimental data was verified with FEA and used to evaluate the suitability for numerous solder constitutive models available in literatures. FEA employing Anand material model suggested by Darveaux et al. and Chang et al. were found to be in an excellent agreement with the experimental results for the eutectic solder and the lead-free solder, respectively. In addition, numerical predictions on bending displacement, shear strain and viscoplastic distortion energy are documented and viscoplastic deformation behavior of two types of solder material are compared.