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권대현;최이배;이의택
- Proceedings of the Korean Society of Broadcast Engineers Conference
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- 1999.11b
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- pp.47-52
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- 1999
The visualization of Moire or laser-scanned data has been explored by many researchers and has been an important issue on computer graphics research. In this paper, we present various techniques that handle tremendous amount of 3D range data which are generated by the ETRI- Moire Scanner. The techniques include constructing an efficient data structure, constructing triangle meshes and decimation and registration of multiple-view range images and textures.
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박윤창;김승우
- Transactions of the Korean Society of Mechanical Engineers
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- v.17 no.11
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- pp.2723-2729
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- 1993
Moire principles are applied to the measurement of the spindle radial error motion. As opposed to conventional techniques, no master cylinder or ball is needed in the measurement so that the offset and out-of-roundness errors of the master can be inherently eliminated. Two periodic circular gratings are used, one is made on the spindle and the other is held stationary on the reference frame. When the two gratings are seen superimposed during spindle rotation, an interference fringe pattern is observed from which the information on the eccentricity between the two gratings can be extracted with high precision. The optical design and fringe analysis techniques of a prototype measurement system are described in detail with exemplary measurement results.
https://doi.org/10.22634/KSME.1993.17.11.2723 인용 PDF

Kim, Do-Hyung;Choi, Yong-Seo;Joo, Jin-Won
- Proceedings of the KSME Conference
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- 2003.11a
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- pp.1027-1032
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- 2003
Thermo-mechanical behavior of flip-chip plastic ball grid array (FC-PBGA) packages are characterized by high sensitive $Moir{\acute{e}}$ interferometry. $Moir{\acute{e}}$ fringe patterns are recorded and analyzed for several temperatures. Deformation analysis of bending displacements of the packages and average strains in the solder balls for a single-sided package assembly and a double-sided package assembly are presented. The bending displacement of the double-sided package assembly is smaller than that of the single-sided one. The largest of effective strain occurred in the solder ball located at the edge of the chip and its magnitude of the double-sided package assembly is greater than that of single-sided one.
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