• Journal of the Society of Naval Architects of Korea
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• v.40 no.1
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• pp.28-35
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• 2003

Fatigue tests of transverse fillet weldment were performed under out-of-plane bending loads. Significant increase of the fatigue strength was observed under out-of-plane bending loads, compared to the one under in-plane loads (axial loads). Applicability of the crack propagation analysis using LEFM for the surface crack of fillet weldment were investigated as well, in parallel with the fatigue tests. For the rational assessment of the fatigue strength of welded ship structures where combined stresses of the in-plane axial stress and the out-of-plane bending stress are induced simultaneously due to complexity of applied load and structural geometry, further investigation is recommended for the effect of the out-of-plane bending stress on the fatigue strength of weldment.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1836-1841
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• 2007

Based on three-dimensional (3-D) FE limit analyses, this paper provides plastic limit and TES(Twice-Elastic-Slope) loads for pipe bends under combined pressure and out-of-plane bending. The plastic limit loads are determined from FE limit analyses based on elastic-perfectly-plastic materials using the small geometry change option, and the FE limit analyses using the large geometry change option provide TES plastic loads. A wide range of parameters related to the bend geometry is considered. Based on the FE results, closed-form approximations of plastic limit and TES plastic load solutions for pipe bends under out-of-plane bending are proposed.

• Journal of the Society of Naval Architects of Korea
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• v.47 no.4
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• pp.580-588
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• 2010

OPB(out-of-plane bending)-induced failure of mooring chain was firstly addressed by CALM (catenary anchor leg mooring)-type offloading buoy, located approximately one mile away from the bow of the Girassol FPSO which was installed offshore area of Angola in September 2001. This study deals with verifying the load transfer mechanism between the first free chain link and connected two chain links inside the chain hawse. OPB moment to angle variation relationships are proposed by extensive parametric study where the used design variables are static friction coefficients, proof test loads, nominal tension forces, chain link diameters, chain link grades and chain link types. The stress ranges due to OPB moments are obtained using nonlinear FEAs (finite element analyses). Final stress ranges are derived considering ones from IPT (in-plane tension) forces. Also a formula for OPB fatigue assessment is briefly introduced.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2009.04a
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• pp.488-491
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• 2009

본 논문에서는 응력함수와 Kantorovich method를 이용하여 기저판(substrate)에 인장과 굽힘이 작용할 때 복합재 패치의 3차원 응력을 해석하였다. 면내 방향과 면외 방향의 두 응력함수에 가상 공액일의 법칙(Complementary virtual work principle)을 적용하였으며 복합재 패치의 자유 경계조건과 바닥의 기저판으로부터 전달되는 전단 수직 응력 조건을 부여하였다. 이를 통해서 패치 구조물의 지배방정식을 연립 미분 방정식 형태의 고유치 문제로 변환하여 응력함수를 구하였다. 위 방법의 타당성과 효용성을 검증하기 위한 수치 예제로 cross-ply, angle-ply, quasi-isotropic의 패치 적층 배열을 고려하였으며, 층간 응력함수 값이 자유 경계에서 최고치를 나타내고 패치 중심부로 갈수록 급격히 감소하는 모습을 확인하였다. 제안된 기법은 기저판에 인장하중이 작용하는 경우뿐만 아니라 굽힘 하중이 작용하는 경우에도 정확한 예측이 가능하여, 패치 구조물의 층간 응력을 포함한 3차원 응력을 해석하는데 있어서 효율적인 해석 도구로서 사용할 수 있을 것이라 사료된다.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.57-65
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• 2017

The electronic components in mobile device are composed of electronic chips and various other materials. These components become extremely thin and the constituent materials have different coefficient of thermal expansion, so that considerable warpages occurs easily due to temperature change or external load. Shadow $moir{\acute{e}}$ is non-contact, whole field technique for measuring out-of-plane displacement, but the measurement sensitivity is not less than $50{\mu}m/fringe$, which is not suitable for measuring the warpage of the electronic components. In this paper, we implemented a measurement method with enhanced sensitivity of $25{\mu}m/fringe$ by investigating and optimizing various experimental conditions of the shadow $moir{\acute{e}}$. In addition, four $moir{\acute{e}}$ fringe patterns recorded by the phase shift are processes to obtain a $moir{\acute{e}}$ fringe patterns with a sensitivity four times higher. The measurement technique is applied to small electronic components of a smart phone for measuring warpage with a high sensitivity of $5{\mu}m/fringe$ at room temperature and at the temperature of $100^{\circ}C$.