• Title/Summary/Keyword: 메인 본딩

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A Study on the Bonding Performance of COG Bonding Process (COG 본딩의 접합 특성에 관한 연구)

  • Choi, Young-Jae;Nam, Sung-Ho;Kim, Kyeong-Tae;Yang, Keun-Hyuk;Lee, Seok-Woo
    • Journal of the Korean Society for Precision Engineering
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    • v.27 no.7
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    • pp.28-35
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    • 2010
  • In the display industry, COG bonding method is being applied to production of LCD panels that are used for mobile phones and monitors, and is one of the mounting methods optimized to compete with the trend of ultra small, ultra thin and low cost of display. In COG bonding process, electrical characteristics such as contact resistance, insulation property, etc and mechanical characteristics such as bonding strength, etc depend on properties of conductive particles and epoxy resin along with ACF materials used for COG by manufacturers. As the properties of such materials have close relation to optimization of bonding conditions such as temperature, pressure, time, etc in COG bonding process, it is requested to carry out an in-depth study on characteristics of COG bonding, based on which development of bonding process equipment shall be processed. In this study were analyzed the characteristics of COG bonding process, performed the analysis and reliability evaluation on electrical and mechanical characteristics of COG bonding using ACF to find optimum bonding conditions for ACF, and performed the experiment on bonding characteristics regarding fine pitch to understand the affection on finer pitch in COG bonding. It was found that it is difficult to find optimum conditions because it is more difficult to perform alignment as the pitch becomes finer, but only if alignment has been made, it becomes similar to optimum conditions in general COG bonding regardless of pitch intervals.

Utilizing Channel Bonding-based M-n and Interval Cache on a Distributed VOD Server (효율적인 분산 VOD 서버를 위한 Channel Bonding 기반 M-VIA 및 인터벌 캐쉬의 활용)

  • Chung, Sang-Hwa;Oh, Soo-Cheol;Yoon, Won-Ju;kim, Hyun-Pil;Choi, Young-In
    • The KIPS Transactions:PartA
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    • v.12A no.7 s.97
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    • pp.627-636
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    • 2005
  • This paper presents a PC cluster-based distributed video on demand (VOD) server that minimizes the load of the interconnection network by adopting channel bonding-based MVIA and the interval cache algorithm Video data is distributed to the disks of each server node of the distributed VOD server and each server node receives the data through the interconnection network and sends it to clients. The load of the interconnection network increases because of the large volume of video data transferred. We adopt two techniques to reduce the load of the interconnection network. First, an Msupporting channel bonding technique is adopted for the interconnection network. n which is a user-level communication protocol that reduces the overhead of the TCP/IP protocol in cluster systems, minimizes the time spent in communicating. We increase the bandwidth of the interconnection network using the channel bonding technique with MThe channel bonding technique expands the bandwidth by sending data concurrently through multiple network cards. Second, the interval cache reduces traffic on the interconnection network by caching the video data transferred from the remote disks in main memory Experiments using the distributed VOD server of this paper showed a maximum performance improvement of $30\%$ compared with a distributed VOD server without channel bonding-based MVIA and the interval cache, when used with a four-node PC cluster.