• Tribology and Lubricants
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• v.38 no.3
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• pp.93-100
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• 2022

Micro-light emitting diode (micro-LED) displays offer numerous advantages such as high brightness, fast response, and low power consumption. Hence, they are spotlighted as the next-generation display. However, defective LEDs may be created due to non-uniform contact loads or LED alignment errors. Therefore, a repair process involving the replacement of defective LEDs with favorable ones is necessitated. The general repair process involves the removal of defective micro-LEDs, interconnection material transfer, as well as new micro-LED transfer and bonding. However, micro-LEDs are difficult to repair since their size decreases to a few tens of micron in width and less than 10 ㎛ in thickness. The conventional nozzle-type dispenser for fluxes and the conventional vacuum chuck for LEDs are not applicable to the micro-LED repair process. In this study, transfer conditions are determined using a micro stamp for repairing micro-LEDs. Results show that the aging time should be set to within 60 min, based on measuring the aging time of the flux. Additionally, the micro-LEDs are subjected to a compression test, and the result shows that they should be transferred under 18.4 MPa. Finally, the I-V curves of micro-LEDs processed by the laser and hot plate reflows are measured to compare the electrical properties of the micro-LEDs based on the reflow methods. It was confirmed that the micro-LEDs processed by the laser reflow show similar electrical performance with that processed by the hot plate reflow. The results can provide guidance for the repair of micro-LEDs using micro stamps.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.14 no.12
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• pp.1347-1353
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• 2004

With respect to the researches of the optical flying head(OFH) , the head-gimbal assembly should be analyzed to guarantee the stable fabrication and the characteristics of shock resistance. The suitable design is proved through the Probabilistic analysis of the design parameters and material properties of the model. Probabilistic analysis is a technique that be used to assess the effect of uncertain input parameters and assumptions on your analysis model. Using a probabilistic analysis you can find out how much the results of a finite elements analysis are affected by uncertainties in the model. Another factor is analysis of the dynamic shock analysis. For the mobile application, one of the important requirements is durability under severe environmental condition, especially, resistance to mechanical shock. An important challenge in the disk recording is to improve disk drive robustness in shock environments. If the system comes in contact with outer shock disturbance. the system gets critical damage in head-gimbal assembly or disk. This paper describes probabilistic and dynamic shock analysis of head-gimbal assembly in micro MO drives using OFH slider.