• Journal of the Microelectronics and Packaging Society
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• v.5 no.2
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• pp.27-36
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• 1998

통신시스템의 고발열 전자부품 냉각을 위해 3종류의 써모싸이폰을 각각의 용도에 따라 개 발하였으며 그 각각의 설계변수에 대한 냉각특성을 실험적으로 구하였다. TS-I에서는 증발부 내부 에 금속스크린 메쉬형심지를 삽입함으로써 시간에 따른 온도 변화를 작게 하여 냉각성능 안정성을 확보하였고, TS-II에서는 9W/cm2의 높은 냉각성능을 가진 루프형 써모사이폰을 개발하였으며 TS-III에서는 작동유체의 종류, 파이프개수 와이어 삽입여부등 써모사이폰의 주요 설계변수에 따 른 냉각특성을 구하였다.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1499-1505
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• 2003

Rapid development of electronic technology requires small size, high density packaging and high power of electronic devices. So, in this paper, characteristics on oscillating heat pipe according to operating conditions(environment temperature, charging ratio of working fluid, inclination) based on experimental study was investigated. From the experimental results, $25^{\circ}C$environment temperature), R-141b(working fluid)40%(charging ratio) was best performace at others of inclination angle and The top heating mode of OCHP performed 80% efficiency of the bottom heating mode.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2043-2052
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• 2008

The increasing heat generation rates in CPU of notebook computers motivate a research on cooling technologies with low thermal resistance. This paper develops a closed-loop two-phase cooling system using a micropump to circulate a dielectric liquid(PF5060). The cooling system consists of an evaporator containing a boiling enhancement microstructure connected to a condenser with mini fans providing external forced convection. The cooling system is characterized by a parametric study which determines the effects of volume fill ratio of coolant, existence of a boiling enhancement microstructure and pump flow rates on thermal performance of the closed loop. Experimental data shows the optimal parametric values which can dissipate 33.9W with a film heater maintained at $95^{\circ}C$.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.2
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• pp.61-67
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• 2017

As transistor density increases rapidly, a heat flux from IC device rises at fast rate. Thermal issues raised by high heat flux cause IC's performance and reliability problems. To solve these thermal management problems, the conventional cooling methods of IC devices were reached their thermal limit. As a result, alternative cooling methods such as liquid heat pipe, thermoelectric cooler, thermal Si via and etc. are currently emerging. In this paper microchannel liquid cooling system with TSV was investigated. The effects of 2 coolants (DI water and ethylene glycol 70 wt%) and 3 metal bumps (Ag, Cu, Cr/Au/Cu) on cooling performance were studied, and the total heat flux of various coolant and bump cases were compared. Surface temperature of liquid cooling system was measured by infrared microscopy, and liquid flowing through microchannel was observed by fluorescence microscope. In the case of ethylene glycol 70 wt% at $200^{\circ}C$ heating temperature, the total heat flux was $2.42W/cm^2$ and most of total heat flux was from liquid cooling effect.

• Proceedings of the KSME Conference
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• 2005.11a
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• pp.16.2-16.2
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• 2005

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.27-31
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• 2015

Thermal management becomes a key technology as the power density of high performance and high density devices increases. Conventional heat sink or TIM methods will be limited to resolve thermal problems of next-generation IC devices. Recently, to increase heat flux through high powered IC devices liquid cooling system has been actively studied. In this study a chip-level liquid cooling system with TSV and microchannel was fabricated on Si wafer using DRIE process and analyzed the cooling characteristics. Three different TSV shapes were fabricated and the effect of TSV shapes was analyzed. The shape of liquid flowing through microchannel was observed by fluorescence microscope. The temperature differential of liquid cooling system was measured by IR microscope from RT to $300^{\circ}C$.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.10 no.3
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• pp.53-59
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• 2011

In this study, a two-phase closed loop cooling system is desinged and tested for a laptop computer using a FC-72. The cooling system is characterized by a parametric study which determines the effects of existence of a boiling enhancement microstructure, initial system pressure, volume fill ratio of coolant and inclination angle of condenser on the thermal performance of the closed loop. Experimental data show the optium condition when the volume ratio of working fluid is 70%, the pump flowing is 6ml/min, and the inclination angle of condenser is $0^{\circ}$. This research shows the maximum values which can dissipate 33W of chip power with a chip temperature maintained at $95^{\circ}C$.

• Journal of the Korean Society of Propulsion Engineers
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• v.8 no.2
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• pp.54-61
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• 2004

Miniaturization of subsystems including propulsion systems is recent trends in spacecraft technology. Small space vehicle propulsion is not only a technological challenge of a scaling system down, but also a combination of fundamental flow/combustion constraints. In this paper, physical constraints of micronozzle for cold gas micro-thruster are reviewed and discussed. Method to measure small thrust are also described.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.8 no.4
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• pp.83-89
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• 2009

This study investigates two-phase cooling system of close-loop by using FC-72 and PCM(Phase change material). The cooling system consists of evaporator, cold plate, micro pump, and condenser. The heat input on the performance of evaporator is appreciated by visualizing the boiling on the evaporator. The heat performance of cooling system is investigated to determine the effects of volume fill ratio change at working fluid, pump flow rate change, and volume fill ratio change at PCM in cold plate. Experimental results show the ideal condition when the volume ratio of working fluid, the pump flowing, and the volume ratio of PCM are 60%, 6ml/min, and 60% respectively.

• Proceedings of the SAREK Conference
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• 2005.11a
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• pp.329-334
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• 2005

As more high power wide band gap devices are being utilized. the thermal management issues associated with these devices need to be resolved. High power small devices dissipate excessive heat that must be cooled, but traditional cooling methods are insufficient to provide such a cooling means. This paper will evaluate a micro-capillary pumped loop thermal management system that is incorporated into the shim of the device, taking advantage of phase-change to increase the thermal conductivity of the system. The results of the modeling of the thermal management system will be discussed.