• Title/Summary/Keyword: 마이크로 가공

Search Result 690, Processing Time 0.024 seconds

Analyses of Temperature Behaviours at Fabrication Processes for Microaccelerometer Sensors (마이크로가속도계 센서의 제작공정에서 온도거동 해석)

  • Kim, O.S.
    • Journal of Power System Engineering
    • /
    • v.5 no.1
    • /
    • pp.73-79
    • /
    • 2001
  • 정전기력을 이용하는 마이크로가속도계 센서는 단결성 실리콘 SOI(Silicon On Insulator) 웨이퍼의 기판에 절전재료 적층과 등방성 및 이방성 부식공정으로 제작한다. 마이크로가속도 센서 개발에는 3차원 미소구조체의 제작공정에서 가열 및 냉각공정의 온도구배로 야기되는 포핑업과 같은 열변형 해석이 최적 형상설계에 중요한 요건이다. 본 연구에서는 양자역학적 현상인 턴널링전류 원리로 승용차 에어백의 검침부 역할을 하는 마이크로가속도 센서의 제조공정에서 소착현상을 방지하는 부가 비임과 턴널갭의 FIB 절단가공과 백금 적층공정의 열적 거동을 해석한다. 마이크로머시닝 공정에서 온도의존성을 고려하여 연성해석하고 유한요소법의 상용코드인 MARC K6.1로 분석한 결과를 단결정 실리콘 웨이퍼로 가공하는 마이크로가속도 센서의 최적공정 및 형상설계를 위한 기초자료로 활용될 수 있을 것으로 기대된다.

  • PDF

Fabrication of Micro-optical Components and Actuators using Surface Micromachining (표면 미세가공기술을 이용한 마이크로 광학소자 및 구동기의 제작)

  • Kim, K.N.;Park, K.B.;Jung, S.W.;Lee, B.N.;Kim, I.H.;Moon, H.C.;Park, H.D.;Shin, S.M.
    • Proceedings of the KIEE Conference
    • /
    • 1999.11d
    • /
    • pp.1151-1153
    • /
    • 1999
  • 3-layer polysilicon 표면미세가공공정을 이용하여 micro zone plate 렌즈와 미러 및 이를 구동하기 위한 구동기를 일체화시킨 마이크로 구동형 광학소자를 설계, 제작하였다. 650nm의 파장대역에서 초점거리가 $500{\mu}m$가 되도록 마이크로 zone plate 렌즈를 설계하였으며, 렌즈의 광학축은 실리콘 기판 상에서 $121{\mu}m$거리에 위치하도록 제작하였다. 마이크로 hinge와 스프링 latch 및 측면지지 plate를 이용하여 마이크로 렌즈와 미러가 실리콘 기판상에서 out-of-plane동작이 가능하도록 하였다. 마이크로렌즈 초점거리의 가변을 위하여 6개의 SDA(Scratch Drive Actuator)어레이를 설계, 제작하였다. 또한 빔 반사를 위한 마이크로 미러를 설계하고 $45^{\circ}$ self-assembly를 위하여 마이크로 hinge와 SDA array를 제작하였다.

  • PDF

Study of Effects of the Boundary Layer of Micro-Supersonic Jets on the Flow Impingments in Laser Machining (마이크로 초음속 제트 경계층이 레이저가공에서 나타나는 충돌유동에 미치는 영향에 관한 연구)

  • Yu, Dong-Ok;Lee, Yeol
    • Proceedings of the Korean Society of Propulsion Engineers Conference
    • /
    • 2007.11a
    • /
    • pp.285-288
    • /
    • 2007
  • Numerical study of the influence of the boundary layer of micro-supersonic jet impinging on a flat plate with a hole was performed, to investigate the role of gas jet to eject melted materials from the cut zone in the laser machining. The detailed shock structures and the information of the mass flow rate through the hole were compared to the results of the previous study, in which the effects of boundary layer inside nozzle was not accounted. It was found that the boundary layer inside the micro- nozzle introduced stronger Mach disc over the machining zone, and thus that the mass flow rate through the hole decreased.

  • PDF

Fabrication of Micro-electrodes using Liner Block Moving Electrical Discharge Grinding and Characteristics of Micro-hole Machining of Graphene Nanoplatelet-reinforced Al2O3Composites (블록직선이송 방전연삭에 의한 미세전극 가공 및 그래핀 강화 알루미나 복합소재의 마이크로 홀 가공특성)

  • Jeong, Hyeon-A;Lee, Chang Hoon;Kang, Myung Chang
    • Journal of the Korean Society of Manufacturing Process Engineers
    • /
    • v.16 no.1
    • /
    • pp.149-156
    • /
    • 2017
  • Graphene nanoplatelet (GNP)-reinforced alumina ($Al_2O_3$) is a promising material for micro-partapplications, particularly micro-nozzle shapes, because of its excellent wearresistance. In this study, a $Al_2O_3$/GNPcomposite with 15 vol% graphene nanoplatelets (GNP) was highly densified and fabricated via spark plasma sintering for micro-electrical discharge drilling (Micro-ED drilling) and the wear resistance property of the composite is evaluated via the ball-on-disk method. In addition, the diameter and shape of the micro-electrodes machined by wire electrical discharge grinding (WEDG), block electrical discharge grinding (BEDG), and new linear block moving electrical discharge grinding (LBMEDG) methods are systematically compared and analyzed to observe the micro-hole machining in the micro-ED drilling of the $Al_2O_3$/15vol% GNP composite.

Micro-hole Machining Technology for using Micro-tool (마이크로 공구를 이용한 미세 구멍 가공기술)

  • 허남환;이석우;최헌종
    • Proceedings of the Korean Society of Precision Engineering Conference
    • /
    • 2003.06a
    • /
    • pp.1897-1901
    • /
    • 2003
  • Recently, with the development of semiconductor technology the miniaturization of products as well as parts and the products with high precision are being required. In addition as a national competitive power is increasingly effected by micro part development through micro machining and the secure of micro machining technology, the study of micro machining technology is being conducted in many countries. The goal of this study is to fabricate micro tool under the size of 30$\mu\textrm{m}$ and machine micro holes through micro tool fabrication by grinding, the application of ELID to grinding wheel and the measurement of surface roughness for micro tool.

  • PDF

Micro-hole Machining Technology for using Micro-tool (마이크로 공구를 이용한 미세구멍가공기술)

  • Heo, N.H.;Lee, S.W.;Choi, H.Z.
    • Proceedings of the KSME Conference
    • /
    • 2003.11a
    • /
    • pp.1787-1792
    • /
    • 2003
  • Recently with the development of semiconductor technology, the miniaturization of parts and products as well as their high precision is required. In addition, as the national competitiveness is increasingly affected by the development of the micro parts through micro machining technology, the study of the micro machining technology is being conducted in many countries. The goal of this study is to fabricate micro tools under the size of $20{\mu}m$ and to machine micro holes using them. The fabrication is done by grinding and the application of ELID to the grinding wheel. The surface roughness of the micro tools is measured to evaluate the study.

  • PDF