• Aerospace Engineering and Technology
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• v.6 no.2
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• pp.157-163
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• 2007

The purpose of this study is to design and simulate Reed Solomon encoder(255,223) in PCM/FM communication system in order to transmit the KSLV-I onboard video data. Especially in the compressed video data transmission applications, the communication system is required to have a very low BER performance because of interframe or interframe compression techniques. We have used the primitive polynomial of CCSDS standard and calculated the various coefficients and then the encoder have been simulated as a part of RF interface FPGA hardware in a video compression unit.

• KOREAN POULTRY JOURNAL
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• v.6 no.5 s.55
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• pp.40-42
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• 1974

화란의 유리브리드 회장 헨드릭스씨와 육종전문가 I.R랑게씨의 한국 방문을 계기로 한국유리브리드협의회(회장:이계조)는 협회회원과 축산관계 잡지 기자들을 초청하여 지난 4월 1일 도뀨호텔에서 간담회를 가졌다. 다음은 간담회에서 토의된 내용을 요약한 것이다.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.760_761
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• 2009

초전도 시스템에서 전류를 공급하는 역할을 하는 전류리드는 없어서는 안 될 핵심 부품이다. Powder-in-tube(PIT) 법으로 제작한 1세대(1G) 고온초전도 선재보다 열전달특성이 나쁜 2세대(2G) 고온초전도 선재를 이용하여 고온초전도 전류리드를 제작하였다. 사용한 선재는 미국 AMSC사 선재이다. 초전도 자석으로의 열침입을 최소화하기 위해 지지구조물은 GFRP를 사용하였고 금속연결부는 무산소동을 사용하였다. 2G 선재 6가닥을 사용하여 제작한 전류리드는 액체질소 온도에서 I-V 특성을 평가한 결과 약 400 A급 전류리드도 사용 가능하다고 판단되었으며, 열전달 특성을 측정하기 위해 무냉매형 특성평가장치를 사용하였는데, 77 K과 7 K 사이에서 약 50 mW정도 였다. 본 논문에선 2G 고온초전도 선재를 사용하여 제작한 전류리드의 전기적 열적 특성에 대해 논의하고자 한다.

• Journal of the korean veterinary medical association
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• v.41 no.1
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• pp.71-79
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• 2005

• Journal of the Institute of Electronics Engineers of Korea CI
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• v.49 no.1
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• pp.1-7
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• 2012

In general, currently developed ECG(electrocardiogram) based biometrics approaches are not suitable for real market applications since they require high cost ECG monitoring device and their measurement methods showed poor usability. In this paper, we developed lead I signal based biometrics system using special purpose ECG measurement hardware. To guarantee signal quality for biometrics from various signal measurement environment in our ordinary life, several filters are applied. In addition, to enhance usability, only two skin on electrodes without reference point are used for measurement. Lead I signals of seventeen candidates are measured from developed hardware and features are extracted. Extracted features are applied to support vector machine (SVM) pattern classifier for biometrics, and the experimental results showed 98.59% of sensitivity (SN) and 97.21% of accuracy (ACC). Compare to conventional ECG biometrics approaches, proposed system showed enhanced usability with low-cost measurement hardware.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.1008-1011
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• 2005

It is necessary for the design of lead frame punches in blanking to consider buckling because inner lead pitch of lead frame has been narrowed by miniaturization and high accumulation of semiconductor. In addition, if process variables change in press stamping process, the lift of punches is no longer influenced in wear and punches can be broken suddenly. To prevent the fracture of fine pitch lead frame punches, having considered applying reinforcement to it, this paper verified the design with buckling analysis. This study presents the optimal position and number of reinforcement to be attached to punches. Finally this study presents design rules of attaching reinforcement.

• Korean Journal of Materials Research
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• v.10 no.8
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• pp.551-557
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• 2000

Cu-based leadframe sheets were oxidized ic a hot alkaline solution to black-oxide layer on the surface and molded with epoxy molding compound(EMC), and finally machined to form sandwiched double-cantilever beam(SDCB) and sandwiched Brazil-nut(SBN)specimers to measure the adhesion strength of leadframe-EMC interface. The SDCB and the SBN specimens were designed to measure the adhesion strength in terms fracture toughness under puasi-mode I and mixed mode loadinf, respectively. After the tests, fracture surfaces were analyzed paths were observed in the SDCB-tested speciments, failure paths varied with crack speed and loading conditions.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.19 no.1
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• pp.120-130
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• 1994

The leadwire cutting machine that has been used recently cuts leadwires by putting one-side force with the same priciple as a saw, and applies a stress at soldered part of PCB. Because the stress becomes one cause of contact-defect, a leadwire cutting robot that cuts leadwire-site with nipper and does not apply stress is considered, In this paper a technique of detecting leadwire-site is studied for the purpose of using on automatic leadwire cutting robots. A technique deriving 2-dimensional site-information with many I-dimensional binary data of perspective front-view of PCB taken from various direction was proposed. Simulation and experiments were done under the same condition each other and a small universal PCB was choosen as an experimental object. As a result of simulations and experiments, the proposed technique turns out to be very useful for automatic leadwire cutting robots.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.6
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• pp.123-132
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• 1999

This paper describes a research work of developing computer-aided design of lead frame, semiconductor, with blanking operation which is very precise for progressive working. Approach to the system is based on the knowledge-based rules. Knowledge for the system is formulated from pasticity theories, experimental results and the empirical knowledge of field experts. This system has been written in AutoLISP on the AutoCAD using a personal computer and in I-DEAS Drafting Programming Language on the I-DEAS Master Series Drafting with Workstation, HP9000/715(64). Transference of data between AutoCAD and I-DEAS Master Series Drafting is accomplished by DXF(drawing exchange format) and IGES(initial graphics exchange specification) methods. This system is composed of five modules, which are input and shape treatment, production feasibility check, strip-layout, data-conversion and die-layout modules. The process planning and Die design system is designed by considering several factors, such as complexities of blank geometry, punch profiles, and the availability of a press equipment and standard parts. This system provides its efficiecy for strip-layout, and die design for lead frame, semiconductor.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1994.10a
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• pp.689-694
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• 1994

In this paper, to develop a smart CAD/CAM system for systematically performing from the 3-D solid shape design of products to the CNC cutting operation of products by a machining center, a B-Rep solid modeler is realized based on the half edge data structure. Because the B-Rep solid modeler has the various capabilities related to the solid definition functions such as the creation operation of primitives and the translational and rotational sweep operation, the solid manipulation functions such as the split operation and the Boolean set operation, and the solid inversion function for effectively using the data structure, the 3-D solid shape of products can be easily designed and constructed. Also, besides the automatic generation of CNC code, the B-Rep solid modeler can be used as a powerful tool for realizing the automatic generation of finite elements, the interference check between solids, the structural design of machine tools and robots and so on.