• Title/Summary/Keyword: 리드프레임

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대기압 글로우 플라즈마를 이용한 반도체 리드프레임 도금 전처리 세정 기술

  • 강방권;김경수;진경복;이우영;조중희
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2005.05a
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    • pp.129-133
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    • 2005
  • 대기압 글로우 플라즈마를 이용하여 반도체 리드프레임(Alloy 42) 도금 전처리 습식 공정을 건식으로 대체하였다. 13.56 MHz의 RF 전원을 사용하여 300 W 파워에서 안정적인 대기압 글로우 플라즈마를 발생시켰으며, 금속 리드프레임에 플라즈마가 직접 접촉해도 아크나 스트리머 발생이 없었다. 플라즈마 소스 가스로는 알곤(Ar)을 사용하였으며, 활성가스로 산소($O_2$)를 첨가하였다. 300 W 파워에서 산소를 50 sccm 공급하고 100 mm/sec 속도로 리드프레임을 처리한 결과, 처리 전 접촉각이 $82^{\circ}$에서 처리 후 $10^{\circ}$ 이하로 낮아졌다. 플라즈마 처리 후 리드프레임 표면 거칠기 변화를 AFM으로 측정하였다.

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Measurement of Adhesion Strength between Oxidized Cu-based Leadframe and EMC (산화처리된 구리계 리드프레임과 EMC 사이의 접착력 측정)

  • Lee, Ho-Young;Yu, Jin
    • Korean Journal of Materials Research
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    • v.9 no.10
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    • pp.992-999
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    • 1999
  • Due to the inherently poor adhesion strength of Cu-based leadframe/EMC(Epoxy Molding Compound) interface, popcorn-cracking phenomena of thin plastic packages frequently occur during the solder reflow process. In this study, in order to enhance the adhesion strength of Cu-based leadframe/EMC interface, brown-oxide layer was formed on the leadframe surface by immersing of leadframe sheets in hot alkaline solution, and the adhesion strength of leadframe/EMC interface was measured by using SDCB(Sandwiched Double Cantilever Beam) and SBN(Sandwiched Brazil-Nut) specimens. Results showed that brown oxide treatment of leadframe introduced fine acicular CuO crystals on the leadframe surface and improved the adhesion strength of leadframe/EMC interface. Enhancement of adhesion strength was directly related to the thickening kinetics of oxide layer. This might be due to the mechanical interlocking of fine acicular CuO crystals into EMC.

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Flow Analysis and Process Conditions Optimization in a Cavity during Semiconductor Chip Encapsulation (반도체 칩 캡슐화성형 유동해석 및 성형조건 최적화에 관한 연구)

  • 허용정
    • Journal of the Microelectronics and Packaging Society
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    • v.8 no.4
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    • pp.67-72
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    • 2001
  • An Effort has been made to more accurately analyze the flow in the chip cavity, particularly to model the flow through the openings in the leadframe and correctly treat the thermal boundary condition at the leadframe. The theoretical analysis of the flow has been done by using the Hele-Shaw approximation in each cavity separated by a leadframe. The cross-flow through the openings in the leadframe has been incorporated into the Hele-Shaw formulation as a mass source term. The optimization program based on the complex method integrated with flow analysis program has been successfully used to obtain the optimal filling conditions to avoid short shot.

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Effect of Electropolishing on Surface Quality of Stamped Leadframe (Stamped Leadframe의 표면 품질에 미치는 전해연마 효과)

  • 남형곤;박진구
    • Journal of the Microelectronics and Packaging Society
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    • v.7 no.3
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    • pp.45-54
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    • 2000
  • The effect of electropolishing far stamped leadframe on the removal of the edge burr and residual stress relief was examined. The present study showed that the electropolishing could be used for enhanced surface quality of stamped leadframes. The electropolishing was performed at the condition of 60% phosphoric acid electrolyte, 5 ampere of current and 3 cm electrode gap at $70^{\circ}C$ for 2 minutes for Alloy42 type leadframe, and $50^{\circ}C$ for 1.5 minutes for C-194 type leadframe. The FWHM values from X-ray diffraction showed that residual stress of electropolished leadframe recovered to the level of as-received raw materials and surface roughness measured by using AFM tuned out to be improved by 0.079 $\mu\textrm{m}$ and 0.014 $\mu\textrm{m}$ ($R_{rms}$) far alloy 42 and C-194 type leadframes, respectively. The plated thickness using XRF showed the improved uniformity in thickness variation by 0.4~0.5 $\mu\textrm{m}$ and grain growth, which is favorable for interface adhesion, was also observed from the bake test samples. We could certify dimensional stability of leadframe with inspection by means of 3D-topography and hardness measurements.

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The Design of Zoom Microscope System for Inspecting Wire-Bonding (와이어 본딩 검사용 현미경 광학계의 설계)

  • 류재명;임천석;조재흥;정진호;전영세
    • Proceedings of the Optical Society of Korea Conference
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    • 2003.02a
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    • pp.256-257
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    • 2003
  • 반도체 와이어 본딩(wire-bonding) 조립공정에 사용되는 검사용 현미경 광학계를 설계하였다. 이러한 와이어는 리드프레임에 대해 $\pm$ 1 mm의 단차를 가진다. 이 때 리드프레임은 6배로 관찰하며, 와이어 부분은 2배로 관찰하고자 한다. 그러나 와이어의 단차로 인해 물체거리가 변하게 되며, 일반 광학계로는 배율도 변하게 된다. 물체거리가 변해도 동일한 배율을 가지는 광학계를 설계하기 위해 유한 물점용 3군 줌 광학계를 목적에 맞게 변형시켰다. (중략)

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Paddle Shift Analysis During Semiconductor Encapsulation (반도체 캡슐화 성형 공정에 있어서 패들 변형 해석)

  • Han, Se-Jin;Huh, Yong-Jeong
    • Journal of the Korean Society for Precision Engineering
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    • v.18 no.5
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    • pp.147-156
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    • 2001
  • 본 연구에서는 칩 캡슐화 성형 공정 중의 패들 변형을 해석하기 위한 방법론이 연구되었다. 헬레쇼오 근사 모델에 근거한 유한요소법이 칩 캐비티에서의 유동 해석을 위해 사용되었다. 리드 프레임 상의 구멍을 통한 통과 유동해석을 위한 근사모델이 제안되었다. 본 연구에서 제시된 해석모델에 의해 계산된 값과 실험 값은 잘 일치하였다. 유동해석을 통하여 리드프레임과 패들에 의해 경계를 이루고 있는 상, 하 캐비티간의 압력차가 계산되었다. 최종적으로 패들 변형이 압력차 계산 값을 이용하여 계산되게 된다.

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Adhesive Properties of Epoxy Composite According to the Surface Treatment of Cu Substrate and Adhesion Promoter Content (구리기판의 표면처리 및 접착증진제 함량에 따른 에폭시 컴포지트의 접착특성)

  • Eun-jin Kim;Jung Soo Kim;Young-Wook Chang;Dong Hyun Kim
    • Journal of Adhesion and Interface
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    • v.23 no.4
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    • pp.108-115
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    • 2022
  • In this study, we synthesized poly(itaconic acid-co-acrylamide) (IAcAAM) used as a novel polymer adhesion promoter to improve the adhesion strength of surface-treated Cu lead frames and epoxy composites. IAcAAM comprising itaconic acid, acrylamide was prepared through radical aqueous polymerization. The chemical structure and properties of IAcAAM was analyzed by FT-IR, 1H-NMR, GPC, and DSC. The surface of the copper lead frame was treated with high temperature, alkali, and UV ozone to reduce the water contact angle and increase the surface energy. The adhesive strength of Cu lead frame and epoxy composite increased with the decrease of contact angle. The adhesive strength of Cu lead frame/epoxy composite increased with the addition of IAcAAM in epoxy composite. As silica content increased, the adhesive strength of Cu lead frame and epoxy composite tended to slightly decrease.

A Study on the Microstructure and Adhesion Properties of Sn-3.5Ag/Alloy42 Lead-Frame Solder Joint (Sn-3.5Ag/Alloy42 리드프레임 땜납접합의 미세조직과 접합특성에 관한 연구)

  • Kim, Si-Jung;Bae, Gyu-Sik
    • Korean Journal of Materials Research
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    • v.9 no.9
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    • pp.926-931
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    • 1999
  • The microstructure, wettability, shear strength and aging effect of Sn-3.5Ag/Cu and Alloy42 lead-frame solder joints were measured for comparison. In the case of Sn-3.5Ag/Cu, $Ag_3Sn and Cu_6Sn_5$ phases in the matrix Sn and $1~2\mu\textrm{m}$ thick $Cu_6Sn_5$ phase at the interface of solder/lead-frame were formed. In the case of Sn-3.5Agl Alloy42, only AgJSn phase of low density in the matrix Sn and $0.5~1.5\mu\textrm{m}$ thick $FeSn_2$, phase at the interface of solder/leadframe were formed. Comparing to Cu, Alloy42 showed wider area of spread and smaller contact angle, thus better wet­tability. But shear strength and ductility of Alloy 42 solder joints were only 33% and 75% of those of Cu, respectively After aging at $180^{\circ}C$ for 1 week, $\xi-Cu_3Sn$ layer on $\eta-Cu_6Sn_5$ layer was formed on Cu lead-frame, while coarsened cir­cular $Ag_3Sn$ phase in the matrix and thickened $FeSn_2$, at the interface were formed on Alloy42 lead- frame.

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Analysis of Residual Stresses Induced during Adhesion Process of Chip and Leadframe (칩과 리드페임의 접착과정에서 발생하는 잔류 응력 해석)

  • 이상순
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.13 no.1
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    • pp.97-103
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    • 2000
  • This paper deals with residual stresses induced at the viscoelastic adhesive layer between the semiconductor chip and the leadframe during adhesion process. The adhesive layer has been assumed to be“thermorheologically simple”. The time-domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. Numerical results show that very large stress gradients are present at the interface corner and such singularity might lead to local yielding or edge delamination.

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The Reinforced Design for the Buckling of Semiconductor Lead Frame Punch (반도체 리드프레임 펀치의 좌굴에 관한 보강설계)

  • Lee I.S.;Ko D.C.;Kim B.M.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.10a
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    • pp.1008-1011
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    • 2005
  • It is necessary for the design of lead frame punches in blanking to consider buckling because inner lead pitch of lead frame has been narrowed by miniaturization and high accumulation of semiconductor. In addition, if process variables change in press stamping process, the lift of punches is no longer influenced in wear and punches can be broken suddenly. To prevent the fracture of fine pitch lead frame punches, having considered applying reinforcement to it, this paper verified the design with buckling analysis. This study presents the optimal position and number of reinforcement to be attached to punches. Finally this study presents design rules of attaching reinforcement.

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