• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.16 no.9
• /
• pp.5748-5755
• /
• 2015

Scribing is cutting process to determine production amount and characteristic of LED chip. So it is an important process for fabrication of LED chip. Mechanical process and conventional scribing process with laser source has several problems such as thermal deformation, decreasing of material strength and limitation of cutting region. To solve these problems, internal laser scribing process that generates void in wafer and derives self-crack has been researched. However, studies of sapphire wafer cutting by internal laser scribing process for fabrication of LED chip are still insufficient. In this paper, cutting parameters were determined to apply internal laser scribing process for sapphire wafer for fabrication of LED chip. Then, foundation of cutting condition was established to set up internal laser scribing system through investigation of cutting characteristics by several experiments.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.14 no.6
• /
• pp.104-110
• /
• 2015

LED has added value as a lighting source in the illuminating industry because of its high efficiency and low power consumption. In LED production processes, the chip cutting process, which mainly uses a scribing process with a laser has an effect on quality and productivity of LED. This scribing process causes problems like heat deformation, decreasing strength. The inner laser method, which makes a void in wafer and induces self-cracking, can overcome these problems. In this paper, cutting sapphire wafer for fabricating LED chip using the inner laser scribing process is proposed and evaluated. The aim is to settle basic experiment conditions, determine parameters of cutting, and analyze the characteristics of cutting by means of experimentation.

• Journal of the Korean Society for Precision Engineering
• /
• v.17 no.7
• /
• pp.27-35
• /
• 2000

재료가공분야에의 레이저의 적용은 1960년대 후반부터 시작되었으며, 고출력 CO$_2$ 와 Nd:YAG 레이저가 많은 산업분야에서 보편화될 정도로 발전하여 왔다. 재료가공에서의 레이저의 적용분야는 금속의 절단, 용접 및 드릴링, 세라익의 스크라이빙, 플라스틱과 복합재의 절단 및 여러 가지 재료의 마킹 등을 포함한다. 이와 같은 모든 응용에서 공통적인 것이 레이저 조사에 의해 재료를 용융, 증발시키는 열적 메카니즘이다.(중략)

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2010.05a
• /
• pp.267-268
• /
• 2010

• Journal of the Korean Magnetics Society
• /
• v.15 no.6
• /
• pp.320-324
• /
• 2005

The core loss of $3\%$ SiFe is strongly dependent on silicon content, impurities, permeability, and domain structure of the SiFe. Domain refining has been proved to be very good method for reduction of core loss in high permeability grain oriented SiFe, and laser scribing is well-blown as an effective and industrially important method of domain refinement. In this work, magnetic domain refinement has been carried out by using a pulsed Nd : YAG laser, and the core losses have been measured and analyzed to and optimal parameters of the laser treatment. The laser hem was focused with a spot size of $100{\mu}m$ and pulse energy of 10${\~}$35mJ and the lines were scribed with a period of ${\~}$5mm. The core loss was improved up to $17\%$ with 30 ns-Nd : YAG laser beam in $3\%$ SiFe.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.18 no.5
• /
• pp.74-81
• /
• 2019

This study reports the CW $CO_2$ laser scribing of soda lime glass. In this study, scribing experiments are carried out at different laser powers, scan speeds, and focal positions to investigate the effect of the process parameters on the interaction characteristics between a laser beam and glass. In particular, the interaction characteristics are analyzed and described with the input laser energy per unit length. According to the experimental results, the damage threshold for the glass surface was found to exist between 0.072 and 0.08 J/mm. The input laser energy in this region induced partial melting of the surface and grain-shaped cracks. These cracks tended to increase as the input laser energy increased. At the laser input energy larger than 1 J/mm, a huge crack propagating along the scan direction was produced, and the volume below the scribed area was fully melted. The growth of this crack finally resulted in the complete cutting of the glass at the input laser energy above 8 J/mm. It was found that both the width and depth of the scribed line increased with increasing input laser energy. For the beam focusing at the rear surface, the width of the scribed line varied irregularly. This could be ascribed to the increased asymmetry of the beam intensity distribution when the laser beam was focused at the rear surface. Under this condition, a large burr was only produced on one side of the scribed line.

• Proceedings of the Optical Society of Korea Conference
• /
• 2000.08a
• /
• pp.48-49
• /
• 2000

최근 몇 년 동안 레이저는 품질과 신뢰성의 계속적인 향상으로 인하여 여러 산업 응용분야에서 폭넓게 사용되어 지고 있다. 재료가공에 있어서 레이저의 적용분야는 금속의 절단, 용접 및 드릴링, 세라믹의 스크라이빙, 플라스틱과 복합재료의 절단 및 여러 가지 재료의 마킹, 등을 포함한다. 이러한 가공 메카니즘은 레이저의 조사에 의하여 재료를 용융, 증발시키는 열적 메카니즘이다. 특히 요즘에는 자외선 영역의 조사와 높은 빔의 세기에 의해 다른 종류의 에너지 전달 메카니즘이 가능한 UV 영역의 엑사이머 레이저의 사용이 증가하고 있다.$^{(1)}$ 이러한 엑사이머 레이저가 기존의 다른 레이저에 비해서 갖는 이점은 다음과 같다. 첫째, 모든 금속이 엑사이머 레이저에 대해서는 높은 흡수율을 가지므로 레이저 에너지가 가공 에너지로 효율적으로 변환되기 때문에 얇은 표면층에서 완전히 흡수하게 된다. (중략)

• Journal of the Korean Society for Precision Engineering
• /
• v.27 no.6
• /
• pp.32-38
• /
• 2010

Laser material processing technology is adopted in several industry as alternative process which could overcome weakness and problems of present adopted process, especially semiconductor and display industry. In semiconductor industry, laser photo lithography is doing at front-end level, and cutting, drilling, and marking technology for both wafer and EMC mold package is adopted. Laser cleaning and de-flashing are new rising technology. There are 3 kinds of main display industry which use laser technology - TFT LCD, AMOLED, Touch screen. Laser glass cutting, laser marking, laser direct patterning, laser annealing, laser repairing, laser frit sealing are major application in display industry.

• The Transactions of The Korean Institute of Electrical Engineers
• /
• v.66 no.5
• /
• pp.851-856
• /
• 2017

Research on the edge isolation process of typical polycrystalline silicon solar cells was carried out using laser scribing equipment. The voltage-current characteristics of the solar cell before and after laser scribing were analyzed using a solar simulator. Current density and efficiency increased as the fill factor of the solar cell remained constant after the laser scribing process. The efficiency of the solar cell can be increased in a short time by the edge isolation process performed via a laser scribing process. The polycrystalline silicon solar cell was made into a series electrode, and the efficiency of the solar cell increased because the width of the solar cell was narrowed and the active region was widened by the laser scribing process.