• Journal of the Korean Society for Nondestructive Testing
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• v.34 no.3
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• pp.226-232
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• 2014

In the present study, the characteristics of laser ultrasound in the ablation regime are investigated using simulations and experiments. The laser ultrasonic technique has been recognized as a noncontact method in the field of nondestructive tests (NDTs). In hostile environments (such as hot temperatures), this method has various advantages over the conventional contact ultrasonic method. In particular, in the ablation regime, the laser ultrasonic technique is suitable for inspecting internal defects because of the high amplitude and directivity of the longitudinal wave. In this paper, a simulation model for laser ultrasound in the ablation regime was developed. This model was subsequently applied to a defective specimen using the B-scan method to locate defects. Finally, we performed an experimental test to verify the simulation results. Consequently, the simulation demonstrated good agreement with the experimental test.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.10a
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• pp.61-61
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• 2003

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.667-668
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• 2006

Usually nanosecond pulsing laser ablation of metal is under thermal effect. Many studies of the theoretical analysis and modeling to predict a result of laser ablation of metal are suggested on the basis of the photothermal mechanism. In this paper, we investigate the etching depth and laser fluence of laser ablation of copper films. We proposed the simplified SSB Model(Srinivasan-Smrtic-Babudp model) to study the photothermal effect of nanosecond pulsing laser ablation of copper thin metal. The experimental results were obtained by using the 355nm DPSS $Nd:YVO_4$ laser.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.75-78
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• 1995

This paper presents the feasibility of laser ablation process in 3-D micro machining of MEMS (micro Electro Mechanical System)parts. The micro machining characteristics of polymer(Energy fluence, pulse repetition rate, number of pulse, ablation rate)are investigated and 3-D micro machined samples are demonstrated.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2002.11a
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• pp.105-108
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• 2002

• Proceedings of the Korean Society of Laser Processing Conference
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• 2004.10a
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• pp.90-94
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• 2004

• Proceedings of the Korean Society of Laser Processing Conference
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• 2004.10a
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• pp.73-77
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• 2004

• Laser Solutions
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• v.15 no.4
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• pp.16-19
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• 2012

Due to the fact that the dimensions of circuit lines of IC substrates have been forecast to reduce rapidly, engraving the circuit line patterns with laser has emerged as a promising alternative. To engrave circuit line patterns in an IC substrate, we used a projection ablation technique in which a metal (INVAR) mask and a DPSS UV laser instead of an excimer laser are used. Results showed that the circuit line patterns engraved in the IC substrate have a width of about 15um and a depth of $13{\mu}m$. This indicates that the projection ablation with a metal mask and a DPSS UV laser could feasibly replace the semi-additive process (SAP).

• Journal of the Korean Society for Precision Engineering
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• v.28 no.12
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• pp.1359-1365
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• 2011

The changes of ablation characteristics with respect to laser parameters and material parameters during pulsed laser ablation of solids were discussed with experimental results. Although laser wavelength, laser pulse width, and laser pulse energy are the primary factors to be considered, it is shown that other parameters such as laser spot size and material properties also critically influence on the ablation results. It is further demonstrated that the microstructural characteristics of the target can lead to completely different ablation rate and surface morphology.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2006.11a
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• pp.118-122
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• 2006