• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.729-730
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• 2010

• 한국정밀공학회지
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• 제28권1호
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• pp.24-30
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• 2011

PC-TEMs (Polycarbonate Track-Etched membranes) were micro-drilled for biomedical applications by ultrafast pulsed laser. The ablation and damage characteristics were studied on PE-TEMs by assuming porous thin membranes. The experiments were conducted in the range of 2.02 $J/cm^2$ and 8.07$J/cm^2$. The ablation threshold and damage threshold were found to be 2.56$J/cm^2$ and 1.14$J/cm^2$, respectively. While a conical shaped drilled holes was made in lower fluence region, straight shaped holes were drilled in higher fluence region. Nanoholes made the membrane as porous material and ablation characteristics for both bulk and thin film membranes were compared.

• 한국레이저가공학회지
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• 제14권4호
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• pp.14-20
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• 2011

The advantage of using lasers for through silicon via (TSV) drilling is that they allow higher flexibility during manufacturing because vacuums, lithography, and masks are not required; furthermore, the lasers can be applied to metal and dielectric layers other than silicon. However, conventional nanosecond lasers have disadvantages including that they can cause heat affection around the target area. In contrast, the use of a picosecond laser enables the precise generation of TSVs with a smaller heat affected zone. In this study, a comparison of the thermal and crystallographic defect around laser-drilled holes when using a picosecond laser beam with varing a fluence and repetition rate was conducted. Notably, the higher fluence and repetition rate picosecond laser process increased the experimentally recast layer, surface debris, and dislocation around the hole better than the high fluence and repetition rate. These findings suggest that even the picosecond laser has a heat accumulation effect under high fluence and short pulse interval conditions. To eliminate these defects under the high speed process, the CDE (chemical downstream etching) process was employed and it can prove the possibility to applicate to the TSV industry.

• 한국레이저가공학회지
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• 제13권4호
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• pp.7-13
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• 2010

Today, the most common process for generating Through Silicon Vias (TSVs) for 3D ICs is Deep Reactive Ion Etching (DRIE), which allows for high aspect ratio blind holes with low surface roughness. However, the DRIE process requires a vacuum environment and the use of expensive masks. The advantage of using lasers for TSV drilling is the higher flexibility they allow during manufacturing, because neither vacuum nor lithography or masks arc required and because lasers can be applied even to metal and to dielectric layers other than silicon. However, conventional nanosecond lasers have the disadvantage of causing heat affection around the target area. By contrast, the use of a picosecond laser enables the precise generation of TSVs with less heat affected zone. In this study, we conducted a comparison of thermalization effects around laser-drilled holes when using a picosecond laser set for a high pulse energy range and a low pulse energy range. Notably, the low pulse energy picosecond laser process reduced the experimentally recast layer, surface debris and melts around the hole better than the high pulse energy process.

• 한국정보통신설비학회:학술대회논문집
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• 한국정보통신설비학회 2005년도 하계학술대회
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• pp.229-237
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• 2005

통신용 지하 관로는 대부분 내경 100mm인 PVC 재질로 되어 있으며, 지하에 매설한 후 또는 관로를 사용하기 전에 관로 상태의 정상 유무를 확인할 목적으로 맨드릴(직경 90mm)을 이용한 선통 검사로 정상 관로와 불량 관로를 판단 하였다. 그러나 이러한 방법으로는 조사 대상 관로의 불량 원인을 밝힐 수 없을 뿐 아니라, 복수 개소의 불량 지점을 확인하는 것이 불가능하여 관로 보수나 사용을 위한 기본적인 관로 정보를 제공할 수 없었다. 이러한 문제를 해결하기 위해 디지털 관로 조사장비를 개발하였으며, 관로 내부를 따라 관로 카메라를 이동시키면서 관로 내부의 변형 상태를 실시간으로 확인하거나, 관로 벽에 조사된 레이저 빔 영상을 검출하여 관로 단면의 최소 직경을 측정할 수도 있다. 또한, 디지털 맨드릴은 1mm 간격으로 관로의 내경을 측정할 수 있는 게이지가 설치되어 있어, 실시간으로 관로 단면의 최소 직경을 측정할 수 있어 조사 관로의 전반적인 변형 정도를 모니터링 할 수 있다. 이러한 디지털 관로 조사장비를 이용하여 신설 관로의 시공품질을 측정하거나, 기존 관로의 상태를 객관적이고 정확하게 파악하여 관로 상태에 따른 케이블 포설 계획을 수립할 수 있으며, 불량 관로 보수를 위한 정확한 자료를 제공하여 유지관리의 효율성을 높일 수 있다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 추계학술대회 논문집
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• pp.873-877
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• 2005

The burr of micro drilling and micro cutting on thin metal film is a major obstacle to mass production for micro PCB boards in micro technologies of personal computing and telecom explosion. As the burr affects on the assembling process, it is necessary to study continuously on control or elimination of the burr. In order to get higher valued products, it is also needed to competitive techniques with the high resolution. In this paper, we studied experimentally the burr generation that when it is processed on the copper foil by laser in micro-hole machining. Unlike mechanical machining the burr produced on substrate is a resultants of melt and re-solidification of a melten metal which was heated and treated by laser. And higher laser energy increases the size of burr. Therefor in micro-drilling with laser, it is difficult to reduce the effects of burr for very thin metal sheets. We investigated the stale of the burr and analyzed the laser ablation Cu micro machining with respect to laser intensity and processing time.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1996년도 추계학술대회 논문집
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• pp.479-484
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• 1996

This paper describes a method of measuring tilt motion. This method measures the tilt motion of drilling machines using a laser interferometer, a simple sliding linear bearing, measurement of the probe and the LSC(least square center) method. The next order of business is discussing the procedure of measurement. First, The measured position is considered to be the point of contact between the drill shank and the probe. The revolution of the drill axis delivers the point of contact to the probe. Second, because the laser interferometer is attached on the sliding linear bearing, any movement of probe influences laser reflector. Thus, the laser program displays the moving factor of laser reflector. Namely, this is tilt factor. Third. the points of measurement are a full circle which has 8 points (each are 45$^{\circ}$), After it is finished measuring the 8 points, let the spindle of the drilling machine move down about 5 cm. Repeating this procedure three times, we can get tilt motion's values which are calculated by LSC method. Many error factors affect the accurate measurement of tilt motion. However in this paper we ignore some error factors because they are less significant than tilt motion.

• Design & Manufacturing
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• 제14권3호
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• pp.44-49
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• 2020

One of display trends today is development of high pixel density. To get high PPI, a small size of pixel must be developed. RGB pixel is arranged by evaporation process which determines pixel size. Normally, a fine metal mask (FMM; Invar alloy) has been used for evaporation process and it has advantages such as good strength, and low thermal expansion coefficient at low temperature. A FMM has been manufactured by chemical etching which has limitation to controlling the pattern shape and size. One of alternative method for patterning FMM is laser micromachining. Femtosecond laser is normally considered to improve those disadvantages for laser micromachining process due to such short pulse duration. In this paper, a femtosecond laser drilling for thickness of 16 ㎛ FMM is examined. Additionally, we introduce experimental results for controlling taper angle of hole by vibration module adapted in laser system. We used Ti:Sapphire based femtosecond laser with attenuating optics, co-axial illumination, vision system, 3-axis linear stage and vibration module. By controlling vibration amplitude, entrance and exit diameters are controllable. Using vibrating objective lens, we can control taper angle when femtosecond laser hole drilling by moving focusing point. The larger amplitude of vibration we control, the smaller taper angle will be carried out.

• 한국기계가공학회지
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• 제11권6호
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• pp.130-138
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• 2012

There are increasing demands from the industry for intelligent robot-calibration solutions, which can be tightly integrated to the manufacturing process. A proposed solution can simplify conventional robot-calibration and teaching methods without tedious procedures and lengthy training time. iGPS(Indoor GPS) system is a laser based real-time dynamic tracking/measurement system. The key element is acquiring and reporting three-dimensional(3D) information, which can be accomplished as an integrated system or as manual contact based measurements by a user. A 3D probe is introduced as the user holds the probe in his hand and moves the probe tip over the object. The X, Y, and Z coordinates of the probe tip are measured in real-time with high accuracy. In this paper, a new approach of robot-calibration and teaching system is introduced by implementing a 3D measurement system for measuring and tracking an object with motions in up to six degrees of freedom. The general concept and kinematics of the metrology system as well as the derivations of an error budget for the general device are described. Several experimental results of geometry and its related error identification for an easy compensation / teaching method on an industrial robot will also be included.

• 실천공학교육논문지
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• 제15권1호
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• pp.127-132
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• 2023

Roll to Roll (이하 RTR)로 연결된 유연회로기판(이하 FPCB)에서 일정한 장력을 유지하여 안정적인 홀 가공이 가능하게 하는 Dancer Roll System를 경량화하고 서보모터를 활용한 토크 제어를 통해 기존 방식 FPCB RTR에서는 대응 불가능하였던 중력가속도의 2배가 되는(이하 2.0G) 가속도의 고속 가공이 가능하도록 요소기술과 성능 지표를 제시한다. 기존 마그넷 클러치 방식 RTR에서는 달성이 불가능하였던 높은 회전수와 발열 문제, 낮은 토크 문제등을 마그네슘 소재를 이용한 Roll의 경량 가공법 개발과 서보모터의 토크 제어 알고리즘 개발을 통하여 해결하여 FPCB에 균일한 장력을 제공하고 토크 안정성을 높인다. 본 연구에서 개발한 요소 기술로 인해 Dancer Roll의 반응속도가 개선되어 목표한 고속화를 달성하였다.