• Journal of the Korean Society for Precision Engineering
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• v.21 no.7
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• pp.171-178
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• 2004

Techniques and procedures are presented for measuring mechanical properties on thin-film Polysilicon. Narrow platinum lines are deposited 250 ${\mu}{\textrm}{m}$ apart on tensile specimens that are 3.5 ${\mu}{\textrm}{m}$ thick and 600 ${\mu}{\textrm}{m}$ wide. Load is applied by a piezo-actuator and by hanging weights. Strain is measured by an ISDC at temperatures up to 500 $^{\circ}C$. Measurements of the elastic modulus with jig modifications, loading speed and temperature change are presented first. And then, the preliminary data for the coefficient of thermal expansion and creep behavior are presented as a reference.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.1 no.1
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• pp.23-26
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• 2000

In spot welded joint. Electronic Speckle Pattern Interferometry(ESPI) method using the Model 95 Ar laser a video system and an image processor was applied to measure the stress Unlike traditional strain gauges or Moire method, ESPI method has no special surface preparation or attachments and can be measured in-plane displacement with non-contact and real time. In this experiment, specimens are loaded in parallel with a load cell. The specimens are made of the cold rolled steel sheet with 1mm thickness, are attached strain. gauges. This study Provides an example of how ESPI has been used to measure stress and strain inspecimen. The results measured by ESPI are compared with the data which was measured by strain gauge method under tensile testing.