• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.38-47
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• 2023

Three dimensional (3D) packaging is a next-generation packaging technology that vertically stacks chips such as memory devices. The necessity of 3D packaging is driven by the increasing demand for smaller, high-performance electronic devices (HPC, AI, HBM). Also, it facilitates innovative applications across another fields. With growing demand for high-performance devices, companies of semiconductor fields are trying advanced packaging techniques, including 2.5D and 3D packaging, MR-MUF, and hybrid bonding. These techniques are essential for achieving higher chip integration, but challenges in mass production and fine-pitch bump connectivity persist. Advanced bonding technologies are important for advancing the semiconductor industry. In this review, it was described 3D packaging technologies for chip integration including mass reflow, thermal compression bonding, laser assisted bonding, hybrid bonding.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.23 no.12
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• pp.23-30
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• 2009

LEDs are increasingly used for many applications including automotive, aviation, display, transportation and special lighting applications. Generally, the RGB multichip LED luminaire applied to signboard, emotional lighting system and display device and the white LED luminaire applied to general lighting system. white LED spectra for general lighting should be designed for high luminous efficacy as well as good color rendering. This paper describes characteristics of LED luminaire white LED and RGB multichip LED. Two type of LED luminaire prototype used experiment physical, electrical and optic test and performance analyzed. RGB multi-chip and phosphor-type white LED luminaire were analyzed by experiment on their color characteristics and luminous efficacy of radiation, distribution curve, and electrical characteristics. Research work is in progress to develop an improved performance for optic and electrical works well for two type of LED luminaires.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.2
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• pp.34-43
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• 2008

An OpenLDI receiver circuit for flat-panel display systems was designed and fabricated using $1.8-{\mu}m$ high-voltage CMOS technology. Designed circuit roughly consists of DLL circuit and parallelizers, which recovers clock and parallelize data bits, respectably. It has one clock input and four data inputs. Measurement results showed that it successfully recovers clock signal from input whose frequency is $10Mhz{\sim}65Mhz$, which corresponds data rate of $70Mbps{\sim}455Mbps$ per channel, or $280Mbps{\sim}1.82Gbps$ when all of the four data channels were utilized. A commercial LCD monitor was modified into a test-bench and used for video data transmission at clock frequency of 49Mhz. In the experiment, power consumption was 19mW for core block and 82.5mW for output buffer.

• Journal of IKEEE
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• v.9 no.2 s.17
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• pp.101-107
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• 2005

This paper presents an one-chip controller for an electronic dispenser. The electronic dispenser is composed of electronic part and mechanical part. The electronic part is consisted of input keypad, micro-controller, display module, and pump module. In this paper we designed micro-controller for the electronic part. The micro-controller controls display module and pump module. The display module is composed by LCD device, and the pump module is composed by motor device . The micro-controller for an electronic dispenser is designed by VHDL. We used WX12864AP1 for the LCD device and SPS20 for the stepping motor. Also, the micro-controller is designed by Altera Quartus tool and verified with Agent 2000 Design-kit using APEX20K Device. In this paper, we present possibility to adopt of the biomedical device through the one-chip controller for the electronic dispenser.

• Journal of IKEEE
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• v.14 no.1
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• pp.33-39
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• 2010

In this paper, a 5Gb/s receiver with an adaptive equalizer for serial link interfaces is proposed. For effective gain control, a least-mean-square (LMS) algorithm was implemented with two internal signals of slicers instead of output node of an equalizing filter. The scheme does not affect on a bandwidth of the equalizing filter. It also can be implemented without passive filter and it saves chip area and power consumption since two internal signals of slicers have a similar DC magnitude. The proposed adaptive equalizer can compensate up to 25dB and operate in various environments, which are 15m shield-twisted pair (STP) cable for DisplayPort and FR-4 traces for backplane. This work is implemented in $0.18-{\mu}m$ 1-poly 4-metal CMOS technology and occupies $200{\times}300{\mu}m^2$. Measurement results show only 6mW small power consumption and 2Gbps operating range with fabricated chip. The equalizer is expected to satisfy up to 5Gbps operating range if stable varactor(RF) is supported by foundry process.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.6
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• pp.563-569
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• 2023

Micro light-emitting diodes (LEDs), with a chip size of 100 micrometers or less, have attracted significant attention in flexible displays, augmented reality/virtual reality (AR/VR), and bio-medical applications as next-generation light sources due to their outstanding electrical, optical, and mechanical performance. In the realm of bio-medical devices, it is crucial to transfer tiny micro LED chips onto desired flexible substrates with low precision errors, high speed, and high yield for practical applications on various parts of the human body, including someone's face and organs. This paper aims to introduce a fabrication process for flexible micro LED devices and propose micro LED transfer techniques for cosmetic and medical applications. Flexible micro LED technology holds promise for treating skin disorders, cancers, and neurological diseases.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.246-246
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• 2012

최근의 디스플레이 시장에서는 고효율 저전력, 자발광 소자인 OLED가 차세대 디스플레이 시장의 블루칩으로써 연구되고 개선되어 왔다. 고효율, 고휘도 구현이 가능한 OLED 소자는 초기 발광 시 수명감소, 저전류 구동 효율 개선 및 소자의 유기 재료 개선의 문제점에 직면해 있기 때문에 많은 가능성을 아직 현실화 하지 못하고 있다. 본 연구에서는 전기적 스트레스를 가한 OLED 소자의 전기적, 광학적 성질을 측정함으로써 열화에 따른 소자의 특성 변화를 확인하여 문제점을 개선하는데 기여하고자 한다. $2{\times}2$ inch Glass에 $2{\times}2$ mm 크기의 발광면적을 갖는 Red OLED 소자를 제작한 후 Source Measure Unit을 이용, 8 V의 과전압을 72시간 동안 인가하여 소자의 열화현상을 가속시켰다. 이후 I-V-L 장비를 이용하여 전기적 특성 및 휘도 특성을 측정하였다. 측정된 결과는 휘도가 8 V에서 10,620 cd/$m^2$ ＞ 9,849 cd/$m^2$ (약 7.2% 감소)로 변화한 것을 확인 하였으며, 휘도 효율과 전력 효율을 측정해본 결과 8 V 에서의 소비전력 효율 역시 16%에서 ＞ 15%로(약 1%감소) 변화하였으나 안정적으로 발광이 유지되는 3 V~6 V 구간에서는 효율이 약 13%가 감소하였다. 또한 휘도 효율은 8 V 기준으로 1% , 3 V~6 V 구간에서는 약 8% 감소하였다. 본 연구 결과를 통하여 OLED 소자의 열화 현상은 소자의 휘도 감소뿐만 아니라 소비전력증가, 열화현상의 촉진으로 이어지는 것으로 확인 되었다.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2444-2448
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• 2007

The multi channel of DDI which is the core part of the LCD-TV has been propelled. When multi channel in DDI is introduced, it brings a thermal problem because of the increased power. To solve the thermal problem of the DDI it needs to be investigated each at the package level and module level. It is important to extract the junction temperature(Tj) of DDI clearly from the system level. The objective of this research is to construct a compact model. The compact model is to reduce LCD module including DDI. When the compact model is used, it will be able to easily handle the boundary condition and accurately predict the temperature. Consequently, the temperature of DDI can be calculated easily at the system level. Through this research,we also proposed the cooling plan of DDI for a protection of overheating. The cooling plan was utilized in DDI design.

• Electronics and Telecommunications Trends
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• v.25 no.5
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• pp.33-46
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• 2010

인쇄전자회로 기술은 인쇄(graphic art printing) 공정을 활용한 다양한 광/전자 기기 개발을 위한 핵심요소 기술이다. 기능성 전자 잉크 소재와 초저가격의 프린팅 공정을 통해서 유비쿼터스 시대의 차세대 모바일 IT 기기의 생명력을 불어넣게 된다. 현재 기술 수준이 일부 요소 부품들을 제작하고 기본 단위의 정보처리를 가능케 하는 수준에 머무르고 있으나, 여러 가지 잉크 소재 및 다양한 초미세 인쇄 공정 기술의 개발이 진행됨에 따라 향후 폭넓은 분양에 적용될 것으로 기대된다. 궁극적으로 인쇄전자회로의 성능이 향상되고 고집적화 됨으로써 기존의 Si 기반 CPU나 IC 칩을 대체하는 공정으로 자리매김을 할 것으로 예상된다. 본 기고문에서는 이러한 인쇄전자회로 기술 및 동향에 대해 기술하였다. 특히, 현재 폭넓게 연구가 진행중인 차세대 디스플레이 백플레인이나 개별물품단위 트래킹을 위한 플라스틱 RFID 태그 적용을 위해 필요한 요건들을 인쇄전자회로 기술관점에서 조망하였다.

• Electronics and Telecommunications Trends
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• v.25 no.5
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• pp.84-96
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• 2010

국내 휴대폰 시장은 최근 급격한 변화의 시기를 맞고 있다. 음성정보 송 수신과 단순한 개인정보관리, 또는 멀티미디어 데이터 처리에 주력하던 피처폰 시장은 고사양의 운영체제, HD급 비디오, 수십만 가지의 앱(App.; Application), 고성능 디스플레이로 대표되는 스마트폰 시장으로 급격히 전환되고 있다. 이러한 스마트폰의 고사양화는 모바일프로세서, 베이스밴드 칩, 다양한 센서를 포함하는 스마트폰 하드웨어와 데스크톱 수준에 근접하는 고사양의 운영체제가 견인하고 있다. 특히, 모바일 프로세서는 스마트폰 기술 발전을 견인하는 핵심 부품으로서 다수의 프로세서와 외부인터페이스 장치를 포함하는 고성능, 저전력의 시스템온칩(SoC)이며 모바일프로세서의 동작속도, 전력소모량 등은 스마트폰의 성능을 가늠하는 척도로 인식되고 있다. 최근, 모바일프로세서는 스마트폰 시장을 넘어서 넷북, MID, 스마트 TV 등 다양한 산업영역에서 채용되고 있으며 2018년에 100억 개의 제품이 생산될 것으로 전망되어 모바일 시장의 폭발적인 성장을 견인하는 핵심 부품이다.