• Title/Summary/Keyword: 동적 계면균열 응력장

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Effect of Interface Hole Shape on Dynamic Interface Crack Propagation (계면에 존재하는 구멍의 모양이 동적 계면균열전파에 미치는 영향)

  • Yin, Hai-Long;Lee, Ouk-Sub
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.26 no.7
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    • pp.1217-1222
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    • 2002
  • The dynamic photoelasticity with the aid of Cranz-Shardin type high speed camera system is utilized to record the dynamically propagating behavior of the interface crack. This paper investigates the effects of the hole (existed along the path of the crack propagation) shape on the dynamic interface crack propagation behavior by comparing the experimental isochromatic fringes to the theoretical stress fields.

Propagation behavior of the interface crack through a hole (구멍을 통과하는 계면균열의 전파거동)

  • Lee, O.S.;Yin, H.L.;Hwang, S.W.;Byun, K.H.
    • Proceedings of the KSME Conference
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    • 2000.04a
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    • pp.127-131
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    • 2000
  • The dynamic photoelasticity with the aid of Cranz-Shardin type high speed camera system is utilized to record the dynamically propagating behavior of an interface crack. This paper investigates determined the effects of the hole (existed on the path of the crack propagation) on the crack propagation behavior by comparing the experiment isochromatic fringes to the theoretical stress fields.

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Propagation Behavior of the Interface Crack Through a Hole (구멍을 통과하는 계면균열의 전파거동)

  • Lee, Eok-Seop;Yun, Hae-Ryong;Hwang, Si-Won
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.24 no.11
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    • pp.2823-2827
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    • 2000
  • The dynamic photoelasticity with the aid of Cranz-Shardin type high speed camera system is utilized to record the dynamically propagating behavior of an interface crack. This paper investigates determined the effects of the hole (exited on the path of the crack propagation) on the crack propagation behavior by comparing the experiment isochromatic fringes to the theoretical stress fields.

Development of the Dynamic Photoelastic Hybrid Method for Propagating Interfacial Crack of Isotropic/Orthotropic Bi-materials (등방성/직교이방성 이종재료의 진전 계면균열에 대한 동적 광탄성 실험 하이브리드 법 개발)

  • Hwang, Jae-Seok;Sin, Dong-Cheol;Kim, Tae-Gyu
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.25 no.7
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    • pp.1055-1063
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    • 2001
  • When the interfacial crack of isotropic/orthotropic bi-materials is propagated with constant velocity along the interface, stress and displacement components are derived in this research. The dynamic photoelastic experimental hybrid method for the bimaterial is introduced. It is assured that stress components and dynamic photoelastic hybrid developed in this research are valid. Separating method of stress components is introduced from only dynamic photoelastic fringe patterns. Crack propagating velocity of interfacial crack is 69∼71% of Rayleigh wave velocity of epoxy resin. The near-field stress components of bonded interface of bimaterial are similar with those of pure isotopic material and two dissimilar isotropic bimaterials under static or dynamic loading, but very near-field stress components of bonded interface of bimaterial are different from those.

A Study on the Development of the Dynamic Photoelastic Hybrid Method for Two Dissimilar Isotropic Bi-Materials (두 상이한 등방성 이종재료용 동적 광탄성 하이브리드법 개발에 관한 연구)

  • Sin, Dong-Cheol;Hwang, Jae-Seok;Gwon, O-Seong
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.25 no.3
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    • pp.434-442
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    • 2001
  • When the interfacial crack of two dissimilar isotropic bi-materials is propagated with constant velocity along the interface, stress and displacement components are derived in this research. The dynamic photoelastic experimental hybrid method for bimaterial is introduced. It is assured that stress components and dynamic photoelastic hybrid method developed in this research are valid. Separating method of stress component is introduced from only dynamic photoelastic fringe patterns. Crack propagating velocity of interfacial crack is 80∼85% (in case of aluminum, 24.3∼25.9%) of Rayleigh wave velocity of epoxy resin. The near-field stress components of crack-tip are similar with those of pure isotropic material under static or dynamic loading, but very near-field stress components of crack-tip are different from those.