• 한국건축시공학회지
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• 제14권3호
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• pp.230-236
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• 2014

본 연구는 최근 제주도 지역내 현무암 가공과정에서 발생되는 폐기물인 석분슬러지를 재활용하기 위한 방안으로서, 인공경량골재의 제조가능성에 대해 실험하였다. 또한, 현무암 석분 슬러지로 제조된 인공경량골재의 물성을 개선하기 위해 폐유리분말과 탄산칼슘이 사용되었다. 현무암 석분 슬러지와 폐유리분말 그리고 소성방법의 복합적인 요인을 고려할 때 경량골재 내부의 발포성 향상을 위해서 탄산칼슘의 양은 9 wt.%가 적당하였다. 또한, 제조된 인공경량골재의 흡수율을 저하시키기 위해서는 폐유리 분말은 50 wt.%이내로 사용함과 동시에 직화소성의 방법을 적용하는 것이 더 효과적이다. 좀 더 낮은 비중과 흡수율을 가진 고품질의 인공경량골재를 성형하기 위해서는 성형된 경량골재의 표면에 폐유리분말을 도포한 후 그 시료를 직화소성법으로 소성하는 것이 더 효과적일 것으로 판단된다.

• 비파괴검사학회지
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• 제29권5호
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• pp.473-478
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• 2009

본 연구에서는 비파괴법을 이용하여 압력용기 강 다층용접부에서 채취한 표준 샤르피 시험편의 균열선단에서 형성되는 소성변형 거동을 평가하였다. 모재, 후열처리재 및 용접재를 대상으로 시험편에 기계적인 노치를 가공한 후 예균열(pre-crack)을 낸 다음 4점 굽힘실험과 음향방출(acoustic emission: AE)실험을 동시에 실시하였다. 균열선단은 용접재외 후열처리재의 경우 용융선 근처에 위치하도록 하였다. 하중이 가해짐에 따라 균열선단에서 형성되는 소성영역의 크기는 응력확대계수를 이용하여 구했으며, 각 시험편에 대한 소성역의 크기와 음향방출 특성과의 관계는 축적된 AE 에너지 관점에서 고찰하였다. 시험편에 관계없이 탄성역역에서는 거의 AE신호가 감지되지 않았으며, 대부분의 AE신호는 소성변형 과정에서 발생하였다. 또한, 용접재가 모재와 후열처리재에 비해 AE신호가 훨씬 많이 발생하였다. 모재와 후열처리재 및 용접재의 균열선단에서 소성영역 크기와 축적된 AE에너지와의 관계는 현저히 다르게 나타났으며, 용접재의 AE counts는 모재와 후열처리재에 비해 많이 발생하였다.

• 기계저널
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• 제28권4호
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• pp.401-407
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• 1988

해수 중에 있는 구조용강에 음극방식을 실시했을 때의 피로균열진전 특성을 공기 중에서와 비교 하면서 정리하였으며 또한 몇 가지 영향인자들의 역할에 대해서도 기술하였다. 그러나, 이러한 특성들은 아직까지 그 정확한 메커니즘이 규명되지 못하고 있으며, 특히 균열선단에서의 소성 거동이 부식분위기나 수소분위기에서 어떻게 변화하는가 하는 문제에 대해서는 앞으로도 많은 연구가 이루어져야 할 것이다. 응력조건과 부식조건이 동시에 적용될 때, 재료의 거동을 직접 적으로 해석하기 어려운 경우가 많으며, 따라서 관련되는 많은 영향인자들의 역할에 대한 상세한 정보들이 요구되고 있으며, 또한 관련 정보들을 유기적으로 결합시키는 이론적인 근거를 마련 해야 할 필요가 있다.

• 한국세라믹학회지
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• 제35권3호
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• pp.273-279
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• 1998

Unite cell of soid oxide fuel cell (SOFC) that consists of a dense yttria-stabilized zirconia(YSZ) electrolyte a porous nickel-YSZ cermet anode and a porous strontium- doped lanthanum manganate(LSM) cathod was fabricated from using pore former through co-firing technique. Initial sintering shrinkage rates of each layer were identified for fabricating SOFC. Heterogenous sintering was very effective in tailoring shrinkage rate for three layers. The powder tailoring necessary for shrinkage rate matching are as follows ; electrolyte of 60% TZ8YS/ 40% TZ8Y mixture anode of 51wt% NiO/49 wt% (70wt% TZ8YS/30 wt% UT ZrO2) mixture and cathode of 80% LSM/20% UT ZrO2 mixture . The overall sintering shrinkage rate differences of three layers using these compositions were maintained in a few percent.

• 한국세라믹학회지
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• 제36권6호
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• pp.583-589
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• 1999

In the fabrication of ceramic chip couples for high frequency application such as the mobile communication equipment the formation of electrode lines and Ag diffusion were investigated with heat treatment conditions for removing organic binders. The deformation and densification of the electrode line greatly depended on the binder burnout process due to the overlapped temperature zone near 400$^{\circ}C$ of the binder dissociation and the solid phase sintering of the silver electrode. Ag ions were diffused into the glass ceramic substrate. The Ag diffusion was led by the glassy phase containing Pb ions rather than by the crystalline phase containing Ca ions. The fact suggests that the Ag diffusion could be controlled by managing the composition of the glass ceramic substrate.

• 한국전기전자재료학회논문지
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• 제11권3호
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• pp.208-213
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• 1998

Microwave dielectric properties of $BiNbO_4$ containing CuO and $V_2O_5$(BN ceramics). BN ceramic with 0.07wt% $V_2O_5$ and 0.03wt% CuO (BNC3V7) was sintered at $900^{\circ}C$ where it is possible for these to be co-fired with Ag electrode. The dielectric constant of 44.3, TCF (Temperature Coefficient of resonance Frequency) of 2 ppm/$^{\circ}$ and Q${\times}f_o$ value (product of Quality value and resonance Frequency) of 22,000GHz could be obtained from those ceramics. It is observed that orthorhombic structure was stable $1000^{\circ}C$. As sintering temperature increases, the dielectric properties decreased. The main reasons were abnormal grain growth and the main peak of triclinic moved from the main peak of orthorhombic.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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• pp.574-577
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• 2004

A coupler is a microwave passive component used for power coupling or dividing. Regarding the trend of current telecommunication systems it is highly desirable for monolithic integration of passive components as such LTCC(Low temperature cofired ceramics) technology offers potential advantage in size, cost and performance. Utilizing LTCC technology a 2012 size type dual band coupler for DCS and EGSM band was fabricated. Its characteristics such as coupling, insertion loss, isolation and directivity was measured and compared with simulation results

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.392-395
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• 2004

A coupler is a microwave passive component used for power coupling or dividing. Regarding the trend of current telecommunication systems it is highly desirable for monolithic integration of passive components as such LTCC(Low temperature cofired ceramics) technology offers potential advantage in size, cost and performance. Utilizing LTCC technology a 1608 size type dual band coupler for DCS and EGSM band was fabricated. Its characteristics such as coupling, insertion loss, isolation and directivity was measured and compared with simulation results.

• 한국세라믹학회지
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• 제34권6호
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• pp.601-610
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• 1997

In cofiring of multilayered alumina with tungsten, the change of camber with lamination condition was experimented and the effect of sintering shrinkage of alumina and tungsten was investigated. From the exact measurement of sintering shrinkage of tungsten thick film, as lamination pressure increased, the sintering shrinkage of alumina decreased but that of tungsten thick film was not changed. So it was though that the main factor which induced the sintering shrinkage difference between ceramics and metal with lamination condition was the change of sintering shrinkage of ceramics. In case of high lamination pressure, high green sheet density, the cofired specimen showed low camber due to low shrinkage difference between alumina and tungsten and there was a linear relation between camber and shrinkage difference. It was found that this shrinkage difference could change the thickness of tungsten film and the microstructure within via hole during cofiring.

• 한국세라믹학회지
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• 제36권5호
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• pp.490-496
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• 1999

The sintering behavior of LTCC (low temperature cofired ceramics) chip couplers was investigated in relation with Ag diffusion at the interface of glass ceramic substrate-Ag electrode. Sintering temperature was in the range of 825$^{\circ}C$-975$^{\circ}C$. The commercial green sheet and silver electrode were used. Below 875$^{\circ}C$ the diffusion of the Ag ion into the substrate and the penetration of glassy phases into the electrode occurred due to an increase of fluidity. Thus the lectrode line was severely deformed and damaged. At 975$^{\circ}C$ the transformation of crystalline phases into glassy phases and the melting of the Ag electrode resulted in the diffusion of the considerable amount of Ag ions.