• Title/Summary/Keyword: 대체 CFC

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Comparison of Cleaning Performance of CFC 113 and the Alternatives (CFC 113과 대체세정제의 세정성능 비교)

  • Row, Kyung Ho;Choi, Dai-Ki;Lee, Youn Yong
    • Analytical Science and Technology
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    • v.6 no.5
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    • pp.521-530
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    • 1993
  • According to the Montreal Protocol, CFC 113, one of the ozone-depleting substances, will be prohibited to use as a cleaning solvent essentially in the electronic industry. Therefore, the development of the alternative cleaning solvents to CFC 113 is being accelerated. A number of the alternative cleaning solvents are avialable on the market. The alternatives of Axarel 32(DuPont), Cleanthru 750H(KAO Chemical), and EC-Ultra(Petroferm) are chosen for the comparison of cleaning performance with CFC 113. The test methods for measuring the cleaning performance were composed of the measurement of the physical properties, the experiments on the material compatibility with cleaning solvents, the measurement of the evaporation rate, and finally the experiments of the removal efficiency. Normally the basic physical properties of the alternatives had higher boiling points, viscosity and surface tension, which were quite different to those of CFC 113. In terms of solubility of rosin-based flux, the solubilities of abietic acid (nonpolar organic) were similar, but those of the activator (polar organic) in the alternatives were better than CFC 113. The evaporation of the alternatives was very slow, compared to CFC 113, which had much lower boiling point. All the cleaning solvents showed the good material compatibility with FR4 and Cu-coated PCB. The better removal efficiencies of abietic acid were obtained when using the ultrasonic mechanical energy over the dipping method. The experiments also indicated the very slow-eavaporating solvent was not desirable with the dipping cleaning method, and the differences in the removal efficiency of the alternatives with the ultrasonic cleaning method were negligible. Among the alternatives, the overall cleaning performances were obsorved as almost similar. Before selecting the ultimate cleaning solvent, the application of cleaning machine, environmental issues, and economics are simultaneously considered with the cleaning performance.

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Comparison of Physical Properties of CFC Alternative Cleaning Solvents (CFC 대체세정제의 물성 비교)

  • Row, Kyung Ho;Lee, Youn Yong
    • Analytical Science and Technology
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    • v.6 no.1
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    • pp.65-75
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    • 1993
  • A number of alternative cleaning solvents to CFC 113 which was identified as a ozone-depleting meterial were collected to measure their experimental physecal properties of density, surface tension, Refractive Index, boiling point, pH, viscosity, flash point, and soltbility. They might be classified as aqueous, simi-aqeous, alcohol ketone, and halogen cleaning solvents. The solubilities of abietic acid, a major component of flux used in PCB (Printed Circuit Board) of the electronic indystry, into the cleaning solvents including CFC 113 were determined for comparison. The assorted cleaning solvents have their own advantages and disadvantages. Therefore a end-user carefully needs to choose the best-fit cleaning solvent after the safety, stability, and economics as well as the effectiveness by physical properties of the alternative cleaning solvents are integratedly considered.

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Analysis of Trifluoroacetic acid by GC/FID (GC/FID를 이용한 Trifluoroacetic acid의 분석)

  • 노경록;홍영민;김만구
    • Proceedings of the Korea Air Pollution Research Association Conference
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    • 2001.11a
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    • pp.331-332
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    • 2001
  • CFCs는 가정 제품과 공업적 과정에서 발포제와 냉매제로 오랜 기간 사용되었다. 1974년, CFCs는 Molina와 Rowland에 의해 성층권 오존의 고갈 요인으로 인식되었고, 최근에는 지구 온난화의 기여물질로써 관련되어 지고 있다. CFCs의 세계적인 생산은 Montreal 의정서와 그 개정안에 의해 점차 폐지되었고, 대체 물질로 HCFCs와 HFCs가 과도하게 사용되고 있다. 수소의 존재는 대체 물질의 대류권 산화를 가능하게 했고, 대체로 성층권에 영향을 미치지 않는다. (중략)

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Condensation heat transfer characteristics of alternative refrigerants for CFC-11, CFC-12 for enhanced tubes (열전달 촉진관에서 CFC-11 및 CFC-12 대체냉매의 응축 열전달 특성 연구)

  • 조성준;황수민;정동수;김종보
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.10 no.5
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    • pp.569-580
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    • 1998
  • In this study, condensation heat transfer coefficients(HTCs) of a plain tube, low fin tube, and Turbo-C enhanced tube for CFC-11, HCFC-123, CFC-12, HFC-l34a are measured and compared against each other. All data are taken at the vapor temperature of 39$^{\circ}C$ with a wall subcooling temperature 3~8$^{\circ}C$. Test results show that HTCs of a low vapor pressure refrigerant, HFC-123, for a plain, low fin, and Turbo-C tubes are 10.5~20.5%, 8.2~12.2%, 16.5~19.2% lower than those of CFC-11, respectively. On the other hand, HTCs of a medium vapor refrigerant, HFC-l34a, for a plain, low fin, and Turbo-C tubes are 20.6~31.8%, 0.0~8.0%, 13.2~20.9% higher than those of CFC-12, respectively. For all refrigerants tested, HTCs of Turbo-C tube are the highest among the three tubes showing almost 8 times increase in HTCs as compared to those of a plain tube. Nusselt's prediction equation for a plain tube yielded 12% deviation for all plain tube data while Realty and Katz's prediction equation for a low fin tube yielded 20% deviation for all low tube data.

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Laser-induced etching of GaAs with CFC alternatives (CFC 대체물질을 이용한 GaAs의 레이저 유도 에칭)

  • Park, Se-Ki;Lee, Cheon;Kim, Moo-Sung
    • Electrical & Electronic Materials
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    • v.9 no.3
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    • pp.240-245
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    • 1996
  • Non-ozone layer destructive Chlorofluorocarbon(CFC) altematives(CHCIF$_{2}$ and $C_{2}$H$_{2}$F$_{4}$) have been initially used for laser-induced thenrmochemical etching of GaAs. High etching rate up to 188.mu.m/sec and an aspect ratio of 2.7 have been achieved by a single scan of laser beam, respectively. The etching rate at constant ambient gas pressure was found to saturate for beam power. The chemical compositions of the reaction products deposited on the etched groove were measured by Auger electron microscopy(AES). Etched profile, depth and width were observed by scanning electron microscope(SEM).

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Condensation heat transfer coefficients of alternative refrigerants for CFC11, CFC12 and HCFC22 (CFC11, CFC12, HCFC22 대체냉매의 응축 열전달계수)

  • 정동수
    • The Magazine of the Society of Air-Conditioning and Refrigerating Engineers of Korea
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    • v.28 no.5
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    • pp.389-395
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    • 1999
  • 냉동공조설비, 발전설비, 화학플랜트설비 등에 사용되는 응축기는 주로 증기가 관의 외부에서 응축을 하고 냉각수가 관 내부로 흐르는 쉘-튜브(shell and tube)형 태를 취하고 있다. 초기투자비용 및 운전비용을 줄이기 위해서는 응축기의 열교환 성능을 향상시키는 일이 필수적이며 이를 위해 코팅 표면(coated surfaces), 거친 표면(rough surfaces), 코일 튜브(coiled tubes), 선회 흐름장치(swirl flow), 전열면적을 넓힌 낮은 핀관과 3차원 형상을 갖는 열전달 촉진관의 사용이 제시되고 있다.

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