• Clean Technology
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• v.10 no.2
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• pp.61-72
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• 2004

In this study, aqueous/semi-aqueous cleaning agents which consist of organic solvent, surfactant, cosurfactant, and water were developed by changing formulation parameters such as organic solvent type and contents, surfactant type and contents, and cosurfactant/surfactant(A/S) ratio, etc.. And physical properties and flux removal of the formulated cleaning agents have been evaluated. Also, the performance of oil-water separation from the rinse water contaminated during the cleaning process was evaluated for its recycling. The formulated cleaning agents in this work expected to have good penetration because of their low viscosity and low surface tension values of 30.2~32.5 dyne/cm. The flux removal with the terpene type cleaning agent was higher than that with hydrocarbon type cleaning agent and two commercial products (CPA(commercial product A), CPB(commercial product B)). And the performance of oil-water separation by gravity settling from the rinse water contaminated with formulated cleaning agent and soils was shown to be very good. The cleaning agents developed in this work were applied to surface mounting technology(SMT) cleaning process for manufacturing electronic parts at L electronic company. As a result, the newly developed cleaning agents showed two times better cleaning speed for removal of solder cream than the conventional ond containing ethanol and IPA(isopropyl alcohol). In addition, malodor and VOC problems generated by the previous organic cleaning agents have been solved in the manufacturing field through introduction of the non-volatile and environmental-friendly cleaning agents to the field.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2000.11a
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• pp.60-61
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• 2000

• Clean Technology
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• v.15 no.2
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• pp.81-90
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• 2009

In this study various cleaning evaluation methods were tested and comparatively evaluated to help cleaning industry. In order to select alternative cleaning agents objectively and systematically, various cleaning evaluation methods such as gravimetric, optically simulated electron emission (OSEE), contact angle, and analytical instrument methods were employed for cleaning contaminants such as flux, solder and grease. The analytical instruments used in this work were Fourier transform infrared spectroscopy (FTIR), ultraviolet visible spectroscopy (UV-VIS) and high performance liquid chromatography (HPLC). The gravimetric method was able to measure cleaning efficiencies easily and simply, but it was not easy to analyze them precisely because of its limitation in the gravimetric measurement. However, the OSEE technique was able to measure quickly and precisely the clean ability of cleaning agents in comparison with the gravimetric method. The contact angle method was found to be necessary for taking special precaution in its application to the cleaning evaluation due to possible formation of tiny organic film on the substrate surface which might be generated from contaminants and cleaning agents. In case of precision analysis that cannot be done by gravimetric method, fine analytical instruments such as UV-VIS, FTIR and HPLC could be used in analyzing trace amount of flux, solder and grease quantitatively, which were extracted from the surface by special solvents.

• Clean Technology
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• v.18 no.3
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• pp.287-294
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• 2012

In this study, performances of two cleaning methods were analyzed and a cleaning system was designed to develop a cleaning process of electronic components to remanufacture old laser copy machine. First, plasma cleaning as a dry cleaning method was executed to test cleaning ability. In cleaning of printed circuit board (PCB) by plasma, some damages were found near the metal parts, and considering the productivity, this method was not adequate for the cleaning of electronic components. With 4 different cleaning agents, ultrasonic cleaning tests were executed to select an optimal cleaning agent, aqueous agents showed superior cleaning performance compared to semi-aqueous and non-aqueous agents. Cleaning with aqueous cleaning agent A and 28 kHz ultrasonic frequency can be completed in 30 sec to 1 min. Finally, an ultrasonic cleaning system was constructed based on the pre-test results. Optimal cleaning conditions of 40 kHz and $50^{\circ}C$ were found in the field test. The productivity and economic efficiency in remanufacturing of laser copy machine are expected to increase by adapting developed ultrasonic cleaning system.

• Clean Technology
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• v.16 no.2
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• pp.103-116
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• 2010

It has been reported that the LCD panel market in the FPD industry is become growing and its panel size and production capacity are increasing, and its manufacturing technique is improved every year. FPD manufacturing process requires high cleanliness in its overall process. Especially, FPD cleaning process which accounts for 30~40% of total manufacturing process is very important in its technological and productivity aspects. It is difficult to remove residual liquid-crystal in the fine gap after liquid-crystal injection process in the cell. In this study, aqueous cleaning agents with excellent cleaning, rinsing, and penetrating abilities, but minimum ion content for LCD panel were formulated through mixing glycol ether-type and glycol dimethyl ether-type solvents and nonionic surfactants which are widely used as raw materials for alternative cleaning agents because of environmental regulation at home and abroad. And the formulated cleaning agents were applied to clean FPD liquid crystal after its injection in the cell. Physical properties, cleaning efficiencies, and rinsabilities of the formulated cleaning agents with different combination ratios of solvents, surfactants and additives were measured. As experimental results, the formulated cleaning agents showed higher wetting indices and cloud point than the traditional commercial cleaning agent. And it was found that cleaning efficiencies of the formulated cleaning agents were influenced by the structure of main solvents in them and the types of liquid crystal as soil for cleaning. The best cleaning agents among the formulated cleaning agents showed similar cleaning efficiencies and better rinsabilities compared to the conventional cleaning agent.

• Clean Technology
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• v.12 no.1
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• pp.1-9
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• 2006

Aqueous cleaning agents which are considered to be environmental-friendly and promising alternative ones among various industrial cleaning agents were evaluated in this words. In order to formulate aqueous cleaning agents, primary alcohol ethoxylates with 3, 5 and 7 moles of ethylene oxides among nonionic surfactants were selected as main surfactants. And anionic surfactants and alcohols were chosen as their cosurfactants. Builders such as NaOH, KOH, $Na_2CO_3$ and $NaHCO_3$ were also evaluated as additives for improvement of cleaning efficiency of aqueous cleaning agents. The experimental results of cleaning ability tests show that introduction of anionic surfactant TLS as cosurfactant in alcohol ethoxylate-based aqueous solution gives the best cleaning efficiency for removing mixed soil of cutting oil and grease. NaOH and $Na_2CO_3$ are also shown to play an important role for improvement of cleaning efficiency in a aqueous cleaning agent.

• Korean Chemical Engineering Research
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• v.47 no.6
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• pp.688-694
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• 2009

A spray-type cleaning agent in utilizing dust-remover on PCB was chosen to study the cleanliness test and efficiency. In order to choose alternative environmental-friendly cleaning agents, it is important that the systematic selection procedures should be introduced and applied through the evaluation of their cleaning ability, environmental characteristics, and economical factors, and that the objective and effective evaluation methods of cleanliness should be established for the industry. A novel cleaning evaluation method with scanning electron microscopy/energy-dispersive X-ray analysis of surface observation evaluation method and an infra-red thermography camera(THERMOVISION A20 model) was studied in this work. The sound card(CT-2770 model) cut by $2{\times}2cm$ size was used as a part, and before and after the spray cleaning, the cleanliness was observed by the image analyzer of SEM and further the removal efficiency of dust was quantitatively evaluated by the component analysis of EDX. For the parts of P4TE model motherboard and IPC-A-36 PCB plate, before and after the spray cleaning, temperature differences were measured and compared at room temperature and 50 oven temperature by an infra-red thermography camera in the contaminants of dust and iron powder.

• Clean Technology
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• v.14 no.2
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• pp.95-102
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• 2008

In order to choose alternative environmental-friendly cleaning agents, it is very important in the present point that the systematic selection procedures should be introduced and applied to the industry through the evaluation of their cleaning ability, environmental characteristics, and economical factors, and that the objective and effective evaluation methods of cleanliness should be established for the industry. Thus, a novel cleaning evaluation method utilizing optically stimulated electron emission (OSEE) among various methods of cleaning ability was studied in this study. The contaminants used in this cleaning experiments were flux, solder, grease, cutting oil, and mixed soil of 35% grease and 65% cutting oil. The cleaning agents developed or prepared in our laboratory were employed and their cleaning ability were comparatively evaluated by the OSEE, gravimetry and contact angle methods. The experimental results in this work showed that flux cleaning efficiency measured by the OSEE method was similar to that of the gravimetric method, but that the OSEE method could not be compared with gravimetric method for the case of solder or grease cleaning because the contaminants radiate or absorb ultra-violet light. In case of cutting oil cleaning, the gravimetric method indicated its limitation of cleaning efficiency of cutting oil since it showed cleaning efficiency of 100%, even though residual soil remaining on the substrate surface a little after its cleaning. The comparative experimental results of cleaning ability evaluated by the OSEE- and contact angle measurement methods showed that they were similar in case of cleaning of flux, mixed soil and cutting oil. It was judged that the contact angle measurement method could evaluate the cleaning ability more precisely than the OSEE method for cleaning solder and grease.

• Clean Technology
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• v.7 no.4
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• pp.225-242
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• 2001

Cleaning process is necessary for machining parts or manufacturing finished products in the industry. Most of domestic and foreign companies are now trying to adopt environment-friendly aqueous cleaning agents instead of CFC-113 and 1,1,1-TCE which are ozone-depleting substances. However, the aqueous cleaning system has a disadvantage due to its generation of lots of waste water since the system utilizes water in cleaning and rinsing processes. Thus, it is very important that monitoring and recycling technologies of the cleaning solution and the rinse water should be introduced in the aqueous cleaning system in order to minimize generation of waste water and to maintain its cleaning performance for a quite long time. In this paper, the cleaning agents utilized in the aqueous cleaning system and cutting oils which are main contaminants were examined and analyzed. And the monitoring and recycling technologies of the aqueous cleaning system which can be employed in the industrial fields were also reviewed and evaluated.

• Journal of the Korean Graphic Arts Communication Society
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• v.15 no.2
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• pp.117-130
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• 1997

Studies have been conducted to explore thermal imidization of polyamic acid. Aromatic polyimides are well recognized as high temperature linear polymers, and polyimide are used as structural materials, fibers, and adhesive. Two different kinds of polyimide were prepared by theimidization of polyamic acid which were synthesized from 2,2-bis[4-(4-aminophenoxy)phenyl]- hexafluoropropane, 2,2-bis [4-(4-aminophenxy)phenyl] - hexamethylpropane and caprolactam and pyromelliti dianhydride under N-Methly-pyrrolidinone solvent. Polyamic acids were converted to polyimides containing imide bond by thermal imidization. The weight 50% loss temperatures of polyimide by TGA thermogram were recorded in the range of 700 ~ 720$^{\circ}$C in nitrogen gas. According, as a results, we conclued polyamic acid were cycliation after H2O molecule separationed, and this polyimide film could be used for Printed Circuit Boand.