• Applied Chemistry for Engineering
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• v.35 no.1
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• pp.61-65
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• 2024

The effectiveness of CuSCN as a hole injection layer in large-area organic light-emitting diodes, organic solar cells, and thin-film transistors has been well demonstrated. Therefore, in this study, the surface, optical, and electrical analyses of CuSCN were carried out according to the solution process conditions in order to propose optimized film conditions. Various CuSCN solution concentrations were prepared to determine the film surface characteristics and to determine whether the film surface affects the electrical performance of the device. When the CuSCN solution concentration was low, the CuSCN film was not formed and coated in the form of islands, and when the solution concentration was increased, the CuSCN film was formed uniformly, which contributed to improving the conductivity of the device. In addition, a hole-only device was fabricated to demonstrate the role of CuSCN as a hole transport layer.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.5
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• pp.23-29
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• 2013

Recent advances in printing technology have increased the productivity of the roll-to-roll (R2R) printing process for printed circuitry. In the R2R printed electronics, characteristics of printed and coated layers are one of the most important issues that determine the functional quality of final products. The slot-die technology can coat a large area with high uniformity using low-viscosity materials; determining the process parameters is important to obtain excellent coating qualities. In this study, a viscocapillary model was used to predict qualities of coated layers and patterns. On the basis of analysis results, a novel meta model was derived using design of experiment methodology to improve accuracy. Sensitivity analysis was performed to define major parameters in R2R slot-die coating process. The coating speed was found to most significantly affect the coated layer thickness and was easily controlled. The performance of the proposed model is verified through experimental studies. Based on the statistical analysis results, R2R slot die process can be optimized to guarantee a desired thickness.

• The Journal of the Convergence on Culture Technology
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• v.9 no.5
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• pp.529-534
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• 2023

Although line printing technology is capable of high-speed and large area printing, residual stresses generated during the manufacturing process can deform the feedhole, causing nozzle plate crack or ink leaks. Therefore, in this paper, we propose a new thermal inkjet print head that is robust, reliable and more suitable for line-printing. The amount of deformation of the conventional line printing head measured through the experiment was converted into an equivalent load, and the validity of the load estimation method was verified through FEA analysis. In addition, in order to minimize deformation without increasing the head size, the head structure was designed to increase internal rigidity by reinforcing the unit nozzle with a pillar or support wall or by adding a support beam or dry/wet etched bridge. The FEA analysis results show that the feedhole deformation was reduced by up to 90%, and it is confirmed that the suggested print head with dry etched feedhole bridge operates normally without nozzle plate cracks and ink leakage through fabrication.