• 한국재료학회:학술대회논문집
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• 한국재료학회 2001년도 추계 학술발표강연 및 논문개요집
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• pp.37-37
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• 2001

• 동력기계공학회지
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• 제7권3호
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• pp.18-22
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• 2003

A Study has been made to investigate the effects of hot isostatic press(HIP) and post-HIP heat treatment on microstructures and mechanical properties of Ni-based single crystal superalloy CMSX-4. HIP process was found to heal and close micropores significantly, but did not affect the morphologies of. The elimination of as-cast micropores obtained by HIP process resulted in improved stress-rupture lives of Ni-base single crystal superalloy by 185%.

• 대한기계학회논문집A
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• 제34권12호
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• pp.1909-1915
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• 2010

고온의 연소가스에서 운전되는 국내 가스터빈 부품들은 매일 기동정지를 반복함으로써 열사이클에 의해 재료특성에 변화가 발생한다. 최근 많은 가스터빈 고온부품들이 단결정 초내열 합금으로 제작되어 지지만 재료열화 예측을 통한 부품 교체와 정비에 대한 기준이 없어서 대부분 제작사에 의존하고 있는 실정이다. 본 연구에서는 향후 수명평가와 손상분석의 기초자료로 활용하기 위해 실제 운전된 가스터빈 1 단 블레이드의 열화상태를 조사하였다. 사용한 블레이드는 25,000 및 52,000 의 등가운전시간(EOH : Equivalent Operating Hour)을 가졌으며, 재질은 단결정 초내열합금인 CMSX-4 이다. 사용된 블레이드에서 직접 시험편을 채취하여 기계적특성 시험 및 미세조직을 관찰하였다.

• 한국재료학회지
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• 제18권11호
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• pp.577-582
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• 2008

Directional solidification experiments were carried out at $1-300\;{\mu}m/sec$ solidification rates in the single crystal superalloy, CMSX 10. The solid/liquid interface morphology changed from planar to dendritic, and the dendrite spacing became finer as the solidification rate increased. The pool size of the ${\gamma}/{\gamma}'$ eutectic, formed between dendrites, reduced as the solidification rate increased. The phase formation temperatures, such as the solidus, liquidus and eutectic, were estimated by differential scanning calorimetry (DSC) analysis. The morphology of the ${\gamma}/{\gamma}'$ phase, known to be eutectic, showed ${\gamma}'$ cells with a $\gamma$ intercellular network, and this ${\gamma}/{\gamma}'$ was composed of coarse and fine ${\gamma}/{\gamma}'$ regions. In this study, it is suggested that the ${\gamma}/{\gamma}'$ phase was a coupled peritectic.The solidification procedure of the ${\gamma}/{\gamma}'$ between dendrites is also discussed.

• Journal of Welding and Joining
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• 제19권1호
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• pp.82-87
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• 2001

The creep-rupture and low cycle fatigue properties of transient liquid phase bonded joints of Ni-base single crystal superalloy, CMSX-2 was investigated using MBF-80 insert metal. The (100) orientation of bonded specimen was aligned perpendicular to the joint interface. CMSX-2 was bonded at 1523K for 1.8ks in vacuum, optimum bonding condition. The creep rupture strength and rupture lives of the joints were the almost identical to ones of the base metal. SEM observation of the fracture surfaces of joints after creep rupture test revealed that the fracture surfaces classified three types of region, ductile fracture surface, cleavage fracture surface and interfacial fracture surface. The low cycle fatigue properties of the joints were also the same level as those of base metal. The elongation and reduction of area values of joints were comparable to those of base metal while fell down on creep rupture condition of high temperature.

• Journal of Welding and Joining
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• 제19권4호
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• pp.423-428
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• 2001

The bonding phenomena of Ni base single crystal superalloy. CMSX-4 during transient liquid phase(TLP) bonding was investigated using MBF-80 insert metal. Bonding of CMSX-4 was carried out at 1,373∼1,548K for 0∼19.6ks in vacuum. The (001) orientation of each test specimen was aligned perpendicular to the bonding interface. The dissolution width of base metal was increased when the bonding temperature and holding time were increased. The eutectic width diminished linearly with the square root of holding time during isothermal solidification process. Borides were formed in the bonded layer during TLP bonding operation. The solid phase grew epitaxially into the liquid phase from substrates and single crystallization could be readily achieved during the isothermal solidification.

• Journal of Welding and Joining
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• 제20권5호
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• pp.93-98
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• 2002

The effect of bonding misfit on single crystallization of transient liquid phase (TLP) bonded joints of single crystal superalloy CMSX-2 was investigated using MBF-80 insert metal. The bonding misfit was defined by (100) twist angle (rotating angle) at bonded interface. TLP bonding of specimens was carried out at 1523K for 1.8ks in vacuum. The post-bond heat treatment consisted of the solution and sequential two step aging treatment was conducted in the Ar atmosphere. The crystallographic orientation analysis across the TLP bonded joints was conducted three dimensionally using the electron back scattering pattern (EBSP) method. EBSP analyses f3r the bonded and post bonded heat treated specimens were conducted. All bonded joints had misorientation centering around the bonded interface for as-bonded and post-bond heat treated specimens with rotating angle. The average misorientation angle between both solid phases in bonded interlayer was almost identical to the rotating angle at bonded interface. HRTEM observation revealed that the atom arrangement of both solid phases in bonded interlayer was quite different across the bonded interface. It followed that grain boundary was formed in bonded interface. It was confirmed that epitaxial growth of the solid phase occurred from the base metal substrates during TLP bonding and single crystallization could not be achieved in joints with rotating angle.

• 대한기계학회논문집A
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• 제35권5호
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• pp.549-554
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• 2011

최근 고온부품의 기술발전으로 고효율 가스터빈 발전설비들이 운전되고 있으나 국내의 가스터빈설비는 일일 기동정지를 반복 운전하므로써 열싸이클에 의한 블레이드와 베인의 재료물성은 급격히 나빠지고 있다. 현재 가스터빈 부품 교체와 정비는 제작사에 의존하고 있는 실정으로 이에 본 연구에서 독자적인 교체 및 정비 관리 기준을 위해 수명평가와 손상분석의 기초자료로 활용하고자 실제 운전된 가스터빈 고압 1단 블레이드와 베인의 사용시간별 손상거동을 분석하였다. 사용재의 블레이드는 등가운전시간(EOH)이 23,686, 27,909 및 52,859 이고 베인은 28,714 및 52,859 으로 운전시간이 증가함에 따라 ${\gamma}$'의 크기는 증가하고 형상은 구형 또는 판상으로 변형되었다. 블레이드는 leading edge영역, 베인은 center영역에서 가장 큰 미세조직의 열화가 관찰되었으며 이는 경도의 감소경향과 일치하였다. 열차폐 코팅층내 bond코팅층에서는 운전시간이 증가함에 따라 표면산화층의 두께가 증가하였다.

• Journal of Welding and Joining
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• 제18권3호
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• pp.106-113
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• 2000

Single crystallization behavior ad high temperature tensile properties of TLP bonded joints of Ni-base single crystal superalloy, CMSX-2 were investigated using MBF-80 and F-24 insert metals. CMSX-2 was bonded at 1523~1548K for 1.5~1.8ks in vacuum. The (100) orientation of bonded specimen was aligned perpendicular to the joint interface. Crystallographic orientation analyzed points over the bonded region possessed the almost same orientation across the joint interface and misorientation $\Delta^{\theta}$ was negligibly small in as-bonded and post-bond heat-treated situations. It was confirmed that single crystallization could be readily achieved during TLP bonding. The tensile strengths of all joints at elevated temperatures were equal to or greater than those of base metal the range of testing temperature between 923K and 1173K. The elongation and reduction of area in values were almost the same as those of base metal. SEM observation of the fracture surfaces of joints after tensile test revealed that the fracture surface indicated the similar morphologies each other, and that the fracture of joints occurred in the base metal in any cases.

• Journal of Welding and Joining
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• 제19권2호
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• pp.191-199
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• 2001

The oxidation and recrystallization behaviors of Ni-base single crystal superalloy, CMSX-2 were investigated to determine the condition of the preparation for transient liquid phase (TLP) bonding operations. The faying surfaces of CMSX-2 were worked by the shot peening, fine cutting and mechanical polishing treatments and the degree of working of treated surfaces was evaluated by the hardness test and X-ray diffraction method CMSX-2 was heat-treated at 1,173∼1.589k for 3.6ks in vacuum of 4mPa. The mechanically polished surface was slightly oxidized after heat treatment even in the vacuum atmosphere of 4mPa. The thickness of an oxide film increased with increasing the heating temperature and the surface roughness of the faying surface. Recrystallization occurred at the surface after heat treatment at above 1,423K when the hardness was increased more than Hv600 by the shot peening treatment while the mechanically polished or fine cut surfaces didn't recrystallized. Based on these results, it was clearfied that the mechanically polishing with fine abrasive grit could be used for the preparation of faying surface of CMSX-2 before bonding operation.