• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.99-99
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• 2008

To grow the large diameter GaN with high structure and optical quality has been obtained by hydride vapor phase epitaxy(HVPE) method. In addition to the nitridation of $Al_2O_3$ substrate, we also developed a "step-growth process" to reduce or to eliminate the bowing of the GaN substrate caused by thermal mismatch during cool down after growth. The as-grown 380um thickness and 75mm diameter GaN layer was separated from the sapphire substrate by laser-induced lift-off process at $600^{\circ}C$. A problem with the free-standing wafer is the typically large bowing of such a wafer, due to the built in the defect concentration near GaN-sapphire interface. A polished G-surface of the GaN substrate were characterized by room temperature Double crystal X-ray diffraction (DCXRD), photoluminescence(PL) measurement, giving rise to the full-width at half maximum(FWHM) of the rocking curve of about 107 arcsec and dislocation density of $6.2\times10^6/cm^2$.

• Korean Journal of Materials Research
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• v.11 no.3
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• pp.221-226
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• 2001

The basal slip (0001)1/3<1120 > dislocation velocity in sapphire ($\alpha$-$Al_2$$O_3$) single crystals was measured by four-point bending test. The bending experiment was carried out in the temperature range from 120$0^{\circ}C$ to $1400^{\circ}C$ at various engineering stresses 90MPa, 120MPa, and 150MPa. The velocity of such dislocations was estimated from the bending displacement rate of the four-point bend sample. The dependence of temperature and stress in dislocation velocity was investigated. The activation energy for dislocation velocity was determined to be about 2.2$\pm$0.4eV. In addition, the stress exponent (m) describing the stress dependence of dislocation velocities was in the range of 2.0$\pm$0.2.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.14 no.4
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• pp.155-159
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• 2004

Numerical analysis which is based on finite element techniques, implicit Euler method and frontal solving algorithm was performed to study the effects of the crucible shape on the temperature of sapphire crystal and the shape of the melt/crystal interface in heat exchanger method. The computer simulation described here and effective to solving the heat transport phenomena with the transition of the interface shape from hemispherical to planar. In the work, various crucibles with differently shaped corners at their bottom are considered to improve the deflection of the melt/crystal interface. The shape of the crucible should be considered as one of the variables for the process optimization.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.113-113
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• 1999

최근의 고품질 III-N 화합물 반도체 박막성장과 더불어 청색계열의 LED 및 LD의 성공적인 실현은 본 연구분야에 대한 새롭고 헌신적인 상업적, 학문적/ 기술적 투자환경을 유도해 나가고 있다. 특히, c-축 배향 단결정 사파이어를 기판재료로 사용하고 얇은 GaN buffer의 사용은 고온에서 그 위에 성장되는 성장박막의 특성을 크게 향상시키는 것으로 알려져 있다. 그러나 절연체를 기판으로 사용함에 따른 소자구조 및 제작공정의 복잡성과 기판과 GaN 박막사이의 큰 격자 부정합에 따른 결함센터 등은 소자의 전기, 광학적, 구조적 특성에 부정적인 영향을 미치고 있다. 이러한 문제점을 해결하고 양질의 박막을 성장하기 위한 GaN 혹은 그 대체 기판의 개발에 많은 연구투자가 이루어지고 있는 현실 속에서 Si을 기판으로 이용한 GaN 성장의 가능성이 조심스럽게 점쳐지고 있다. 현재까지의 연구결과를 참조할 때 대체로 복잡한 interlayer를 사용하여 박막성장이 일부 이루어졌으나 그 재현성이나 성장의 중요인자에 대한 해석은 아직 분명하게 밝혀져 있지 않다. 본 연구에서는 원자적 관점에서 Si의 표면에 일부 변화를 유도하고, MOCVD 방법으로 그 위에 성장되는 GaN 박막의 광학적 및 표면 morphology 등에 미치는 영향을 분석하여 핵심적인 성장인자를 추출하고자 시도하였다. 성장된 GaN/Si 박막의 물성은 SEM(AFM), PL, XRD, Auger depth profile 장비등을 이용하여 조사하였으며 사파이어 기판 위에 성장된 GaN 박막의 특성들과 비교 검토하였다.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.8 no.1
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• pp.1-9
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• 1998

In this study, we have investigated the preparation conditions of 45$\times$45$\times$20(mm) square cross-section sapphire single crystal by the modified heat exchanger method using water as a coolant. Melting and solidification processes were optimized by the systematic change of the chamber pressure with the heater temperature. As a results, solidification temperature was between 1960 and $1970^{\circ}C$. The crucible was formed by handling. Therefore its shape should had the 'spiral type' ear at edge of its side. Heat exchanger affected to the temperature distribution and gradient of molten alumina. Heat flux and unmelted seed were controlled by volume of heat exchanger. Voids were controlled by the cooling rate of the heater below $0.2^{\circ}C$/min.

• Journal of the Korean Chemical Society
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• v.39 no.1
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• pp.1-6
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• 1995

The surface of a sapphire substrate used for hetero-epitaxy was chemically polished in a mixture of $H_3PO_4\;and\;H_2SO_4$ solution. The extent of etching for various crystal orientations was found to be dependent on the etching time at $315{\pm}2^{\circ}C$ and at the composition of $H_2SO_4 : H_3PO_4$=3 : 1. In addition, the etching rates of the substrates were investigated in the mixture of $H_2SO_4 : H_3PO_4$=3 : 1 by volume and in the temperature range of 280~320$^{\circ}C$. From the plot of log R against 1/T, the activation penergy ($(E_a)$) was found to be in the order of $({\bar1}012) > (10{\bar1}0) > (11{\bar2}0) > (0001)$ plane. After removing the surface layers of the sapphire with (0001), $({\bar1}012),\;(10{\bar1}0)\;and\;(11{\bar2}0)$ plane by a thickness of 64.6, 46.5, 16.2 and 5.1 ${\mu}m$, respectively, the morphology of the resulting surface was observed by SEM.

• Journal of the Korean Vacuum Society
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• v.14 no.4
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• pp.222-228
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• 2005

Undoped GaN epitaxial layer was grown on c-plane sapphire substrate by a two-step growth with metalorganic chemical vapor deposition(MOCVD). We have investigated the effects of the variation of final growth temperature on surface morphology, roughness, crystal quality, optical property, and electrical property In a horizontal MOCVD reactor, the film was grown at 300 Tow low-pressure with a fixed nucleation temperature of $500^{\circ}C$, varing the final growth temperature from $850\~1050^{\circ}C$ . The undoped GaN epilayers were characterized by atomic force microscopy, high-resolution x-ray diffractometer, photoluminescence, and Hall effect measurement.

• Korean Journal of Materials Research
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• v.4 no.5
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• pp.590-599
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• 1994

A work on the brittle to ductile transition (BDT) in single crystal alumina has been performed to understand and assess the dynamics of dislocation mobility around crack tip of brittle material. The critical stress intensity factor and yield strengths were obtained from bending test using precracked specimens at elevated temperatures. It was found that the BDT temperature was dependent on strain rate and orientation of specimen : for (1120) fracture surface, $1034^{\circ}C$, $1150^{\circ}C$ for $4.2 \times 10^{-6}$, $4.2 \times 10^{-7}s^{-1}$ respectively. Under a 4 point bending test, the moving distance of dislocation generated near crack front in ductile range is determined by an etch pits method. The velocity of dislocation in sapphire obtained from the double etching method was applied to modelling study.

• Journal of the Korean Chemical Society
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• v.40 no.3
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• pp.167-172
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• 1996

For the preparation of single-crystalline GaN film, heteroepitaxial growth on a sapphire substrate was carried out by halide vapor phase epitaxy(HVPE) method. The resulting GaN films showed n-type conductivity. The insulator type GaN film was made by doping with Zn(acceptor dopant), which showed emission peaks around 2.64 and 2.43 eV. The result of this study indicates that GaN can be obtained in an epitaxial structure of MIS(metal-insulator-semiconductor) junction. The observed data are regarded as fundamental in developing GaN epitaxial films for light emitting devices of hetero-structure type.

• Journal of Sensor Science and Technology
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• v.10 no.1
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• pp.24-32
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• 2001

High temperature platinum resistance thermometers(HTPRTs) were designed and fabricated using a synthetic sapphire single crystal as sensor former, insulation and protection tube, and its characteristics was investigated. Several fixed points measurement showed that the sapphire HTPRTs were satisfied with the ITS-90 criteria as the interpolating thermometer. The temperature-resistance characteristics of HTPRT was fitted to the quadratic relationship in the temperature range from $500^{\circ}C$ to $1500^{\circ}C$. The reproducibility of Cu freezing point realized using the sapphire HTPRT was ${\pm}19.2\;mK$. The insulation resistance of the HTPRT exponentially decreased as temperature increased, and showed to $63\;k{\Omega}({\sim}31.5\;mK)$ at $1500^{\circ}C$.