• Title/Summary/Keyword: 다층 금속판

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Ag/Ta/glass 다층박막의 Ta seeding이 전기적 광학적 특성에 미치는 효과

  • Park, Seon-Ho;Jo, Hyeon-Cheol;Lee, Gi-Seon
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.08a
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    • pp.69-69
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    • 2010
  • 현대 건축물에서 건물에너지의 손실은 대부분은 창호를 통하여 유출되어지고 있으며 에너지 절감을 위해서는 창호의 단열성을 향상시켜야한다. 저방사(Low Emissivity) 코팅유리는 건축물의 냉난방비용을 절약할 수 있는 대표적인 건축재료로써 외부에서 유입되는 태양광의 가시광선 영역은 높은 투과율을 가지면서 적외선 영역과 겨울철 실내 난방열을 반사하는 특징을 지니는 박막코팅기술이다. 이 코팅유리는 일반적으로 유전체/금속/유전체 다층박막 구조로 되어있으며, 유전체층은 내구성 증진과 금속층의 반사를 낮추어 투과율이 향상된다. 금속층은 적외선영역의 복사에너지를 반사하는 역할을 하며 전도성이 우수한 Ag 또는 Au, Pt 등을 이용하고 있다. Ag의 경우 산화물기판 위에 증착하였을 경우 island 성장을 하고 이들의 합체는 전기적, 광학적 특성에 큰 영향을 미치게 된다. 본 연구에서는 DC-sputtering법으로 제조된 Ag/glass, Ag/Ta/glass 박막을 제조하고 Ta seeding이 Ag의 전기적, 광학적 성질에 미치는 영향을 관찰하였다. 박막의 표면 미세구조는 FE-SEM(Field Emission Scanning Electron Microscope)과 AFM(Atomic Force Microscope)으로, 표면저항은 4 point probe로 분석하였다. 광투과율은 UV-Vis spectroscopy와 FT-IR로 측정하였으며 측정파장범위는 각각 200~1100nm와 1400~2400nm 이다.

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Design of Metamaterial-Inspired FSS Sub-Reflector for a Dual-Band Offset Cassegrain Reflector Antenna (이중대역 오프셋 카세그레인 반사판 안테나용 메타재질구조 모사 주파수 선택표면 부반사판 설계)

  • Kim, Hyeonsu;Kahng, Sungtek;Khattak, M. Kamran;Jeon, Jinsu;Park, Jeong-hoon
    • Journal of Satellite, Information and Communications
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    • v.10 no.2
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    • pp.34-39
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    • 2015
  • In this paper, a design of an offset Cassegrain antenna is proposed for Ku and Ka dual-band without increasing the antenna size. For Efficiency of computation and implementation, the frequency selectivity surface (FSS) of reflecting the Ka-band signal and passing the Ku-band is provided for the sub-reflector instead of the main reflector. The proposed FSS hyperboloid sub-reflector is the periodic structure of a unit cell comprising octagon metal rings embedded in the multiple layers. The proposed design is verified for 19 GHz and 45 GHz bands by the use of precise electromagneitc-field simulations.

Welding Strength in the Ultrasonic Welding of Multi-layer Metal Sheets for Lithium-Ion Batteries (리튬이온 배터리용 다층박판 금속의 초음파 용착시 용착강도)

  • Kim, Jin-Bom;Seo, Ji-Won;Park, Dong-Sam
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.20 no.6
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    • pp.100-107
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    • 2021
  • As a significant technology in the smartization era promoted by the Fourth Industrial Revolution, the secondary battery industry has recently attracted significant attention. The demand for lithium-ion batteries (LIBs), which exhibit excellent performance, is considerably increasing in different industrial fields. During the manufacturing process of LIBs, it is necessary to join the cathode and anode sheets with thicknesses of several tens of micrometers to lead taps of the cathode and anode with thicknesses of several hundreds of micrometers. Ultrasonic welding exhibits excellent bonding when bonded with very thin plates, such as negative and positive electrodes of LIBs, and dissimilar and highly conductive materials. In addition, ultrasonic welding has a small heat-affected zone. In LIBs, Cu is mainly used as the negative electrode sheet, whereas Cu or Ni is used as the negative electrode tab. In this study, one or two electrode sheets (t0.025 mm Cu) were welded to one lead tab (t0.1 mm Cu). The welding energy and pressure were used as welding parameters to determine the welding strength of the interface between two or three welded materials. Finally, the effects of these welding parameters on the welding strength were investigated.

Investigation on Guided Wave Dispersion Characteristics for Metal Thin Films (금속 박막의 유도초음파 분산 특성 연구)

  • Kim, Miso;Cho, Seung Hyun;Jang, Gang-Won;Lee, Seung-Seok;Park, Ik-Keun
    • Journal of the Korean Society for Nondestructive Testing
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    • v.34 no.3
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    • pp.233-240
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    • 2014
  • In this study, we investigated the dispersion characteristics of guided waves in thin films. Dispersion curves are essential for understanding not only the behavior of ultrasonic waves, but also the mechanical properties of thin films. Matrix techniques are presented for modeling ultrasonic waves in multilayered structures before being used to calculate the dispersion curves for Al-steel and Al-composite specimens. When compared with the dispersion curves obtained using the commercial program (Disperse), the dispersion curves generated from the transfer matrix method show its validity. These developed methods are used to obtain dispersion curves for Al thin films deposited on a Si substrate. The resulting dispersion curves enable observation of both dispersive and non-dispersive behavior for the guided waves, depending on the thickness of the thin films.

Research Activities of Transpiration Cooling for High-Performance Flight Engines (고성능 비행체 엔진을 위한 분출냉각의 연구동향)

  • Hwang, Ki-Young;Kim, You-Il
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.39 no.10
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    • pp.966-978
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    • 2011
  • Transpiration cooling is the most effective cooling technique for the high-performance liquid rockets and air-breathing engines operating in aggressive environments with higher pressures and temperatures. When applying transpiration cooling, combustor liners and turbine blades/vanes are cooled by the coolant(air or fuel) passing through their porous walls and also the exit coolant acting as an insulating film. Practical implementation of the cooling technique has been hampered by the limitations of available porous materials. But advances in metal-joining techniques have led to the development of multi-laminate porous structures such as Lamilloy$^{(R)}$ fabricated from several diffusion-bonded, etched metal thin sheets. And also with the availability of lightweight, ceramic matrix composites(CMC), transpiration cooling now seems to be a promising technique for high-performance engine cooling. This paper reviews recent research activities of transpiration cooling and its applications to gas turbines, liquid rockets, and the engines for hypersonic vehicles.

Dielectric Waveguide Filters Design Embedded in PCB Substrates using Via Fence at Millimeter-Wave (밀리미터파 대역에서 Via Fence를 이용한 PCB 기판용 유전체 도파관 필터 설계)

  • 김봉수;이재욱;김광선;강민수;송명선
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.15 no.1
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    • pp.73-80
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    • 2004
  • In this paper, the implementation and embedding method of the existing air-filled waveguide-filters at millimeter-wave on general PCB substrate is introduced by systematically inserting the vias inside waveguide and mathematically manipulating the simple equations obtained ken the classical circular-post waveguide filter design. All the metal structures placed vertically such as side wall fur perfect ground plane and circular-post for signal control in the air-filled WR-22 waveguide are replaced with several types of via for constructing the bandpass-filter. Side wall and poles inside waveguide are realized by placing a series array of via and tuning the via diameter. The lengths of x, y, z axis are reduced in proportion to root square of employed substrate dielectric constant and especially the length of z axis can be more reduced due to the characteristics of the wave propagation. Because the mass production on PCB is possible without fabricating a large-scaled metal waveguide of WR-22 as input/output ports at millimeter-wave regime, the manufacturing cost is reduced considerably. Finally, when using multilayer process like LTCC for small-sized module, it is one of advantages to use only one layer f3r the filter fabrication. To evaluate the validity of this novel technique, order-3 Chebyshev BPF(Bandpass-Filter) centered at 40 GHz-band with a 2.5 % FBW (Fractional Bandwidth) were used. The employed substrate has relative dielectric constant of 2.2 and thickness of 10 mil of Rogers RT/Duroid 5880. Accroding to design and measurement results, a good performance of insertion loss of 2 ㏈ and return loss of -30 ㏈ is achieved at full input/output ports.