• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.65-68
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• 1995

A slicing method by thin diamond blade is widely usd slicing of hard and brittle materials such as ceramics,glass and ferrite etc.. In this study, a new slicing system which realizes highly efficient and mirror surface slicing was developed by applying ELID-grinding with metallic bond diamond blades and its performance was evaluated. Hard and brittle materials such as ceramics,glass and ferrite were used as workpiece. Metallic bond diamond blades with grit sizes #325 and #2000 were used. Experimental results show that highly efficient slicing and good mirror surface can be successfully obtained using the developed slicing system with ELID features.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.914-917
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• 2000

Application of ceramics, carbide, ferrite has grown considerably due to significant improvement in their mechanical properties such as light weight, chemical stability , super wear resistance and electronical. Despite these character, the me of advanced material has not increased because of poor machinability. The method of using of metal bond wheel was proposed. But it is difficult that metal bond wheel can be dressed. Recently, the technology of in-process electrolytic dressing is developed to solve this problem. This method need wheel for electrolytic dressing, power supply and electrolyte. But development of wheel for electrolytic dressing is the most need. The aim of this study is development of wheel for electrolytic and appraisement of CIB-diamond lapping wheel

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.04a
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• pp.29-33
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• 1996

This paper aims to clatify the potimum grinding condition for the electroplated diamond wheel in form grinding of Sr-ferrite. The main conclusions obtained were as follows. (1) The flexural strength and surface roughness of ferrite became the highest at the peripheral wheel speed of 1700m/min. (2) In the case of depth of cut larger than 0.4mm, crack layers is induced in the ground surface, the fracture type of chips exhibits slight ductile mode in the depth of cut smaller than 0.2mm. (3) When the depth of cut exceed 0.6mm, the tool life becomes extermely short due to large chipping and brackage. However, at the depth of cut .geq. 0.05mm, the diamond grain shows abrasive wear. (4) The flexural strength and surface roughness increases in proportion to the feed rate.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.858-861
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• 2000

Application of ceramics, carbide, ferrite has grown considerably due to significant improvement in their mechanical properties such as light weight chemical stability super wear resistance and electronical. Despite these character, the use of hi-tech material has not increased because of poor machinability. The method of using of metal bond wheel was proposed. But it is difficult that metal bond wheel can be dressed. Recently, the technology of in-process electrolytic dressing is developed to solve this problem. This method need wheel for electrolytic dressing, power supply and electrolyte. But development of wheel for electrolytic dressing is the most need. The aim of this study is development of wheel for electrolytic and appraisement of CIB-diamond lapping wheel

• Transactions of the Korean Society of Mechanical Engineers A
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• v.23 no.6 s.165
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• pp.1011-1017
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• 1999

Electrolytic in-process dressing grinding technique which enables application of metal bond wheels with fine superabrasives in mirror surface grinding operations has developed. It is possible to make efficient precision machining of hard and brittle material such as ceramic and hard metal by the employment of this technique. However, in order to ensure the success of performances such as efficient machining, surface finish, and surface quality, it is important to sustain the insulating layer that has sharply exposed abrasives in wheel surface. Using AE(Acoustic Emission) sensor, this paper will show whether the insulating layer sustains stably or not in real grinding time. And by comparing AErms value and surface roughness their thresholds for stable electrolytic in-process dressing grinding will be determined.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.6 no.3
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• pp.17-25
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• 1997

This paper aims to clarify the effects of grinding conditions on the grinding force, ground surface and chipping size of workpiece in surface grinding of various ferrites with the resin bond diamond wheel. The main conclusions obtained were as follows: In a constant peripheral wheel speed, the specific grinding energy is fitted by straight lines with grinding depth coefficient($\delta$) in a logarithmic graph. The effect of both depth of cut and workpiece speed on grinding energy becomes larger in the order of Mn-Zn, Cu-Ni-Zn and Sr. When using the diamond grain of the lower toughness, the roughness of the ground surface becomes lower. The ground surfaces show that the fracture process during grinding becomes more brittle in the order of Sr, Mn-Zn and Cu-Ni-Zn. The chipping size at the corner of workpiece in grinding increases with the the increases of the depth of cut and workpiece speed, and the decrease of peripheral wheel speed. The effect of both depth of cut and workpiece speed on chipping size becomes more larger in the order of Sr, Mn-Zn and Cu-Ni-Zn.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.19 no.2
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• pp.275-281
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• 2010

This research's goal is to process directly aspherics with big sagment and thin center thickness. If we can process directly aspherics with big sagment and thin center thickness, we think it greatly helps to reduce the time of developing optical system. We made very thin glass using diamond grinding whetstone regarding the trace of tool and the detailed drawing of tool super precisive aspherics that has 0.46mm center thickness and over $30^{\circ}$ segment, $0.1{\mu}m$ machining accuracy, 15nm surface accuracy. We think this research's result will be effective to open new market because it is applied not only cell phone optical system but also CCTV robot optical system, internet phone optical system. Also we expect to enhance the super strong brittle precisive process's possibility with super precisive processing technique that achieves 0.46mm glass center thickness as first in the world.

• Journal of the Korean Society for Precision Engineering
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• v.13 no.6
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• pp.52-58
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• 1996

This paper described on the effect of residual stocks in internal grinding of tungsten carbide materials in order to improve the grinding efficiency as well as grinding accuracy. Through the fundamental investigation is carried out for tungsten carbide materials using electroplated diamond wheel, the residual stock after grinding process is effective to the grinding efficiency. The obtained results are as follows: (1) Under the depth of cut(t) is constant and decreasing the workpiece velocity(Vw), the residual stock after grinding is increased, but the difference is little less than the difference by table speed. (2) Increasing the wheel velocity, the residual stock after grinding is decreased. Therefore in order to minimize the residual stock, the wheel velocity should be increased as far as possible. (3) The surface roughness and out-of roundness increased with depth of cut and table speed, and decreased with wheel velocity, but it may as well adopt as much as possible under the dimensional tolerance which is required for high efficiency grinding. (4) In order to remove residual stock, the spark-out grinding shoule be done, and it also can be improved about 20~25% throughout spark-out grinding, and the number of optimal spark-out times were within 10 times.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.12
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• pp.1267-1271
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• 2012

Demand for optical glass device used for lighting could increase rapidly because of LED lighting market growth. The optical glass devices that have been formed by hot press molding process the desired optical performance without being subjected to mechanical processing such as curve generation or grinding. EL-Max material has been used for many engineering applications because of their high wear resistance, high compressive strength, corrosion resistant and very good dimensional stability. EL-Max is very useful for a glass lens mold especially at high temperature and pressure. The performance and reliability of optical components are strongly influenced by the surface damage of EL-Max during grinding process. Therefore, the severe process condition optimization shall be necessary for the highly qualified EL-Max glass lens mold. To get the required qualified surface of EL-Max, the selection of type of the diamond wheel is also important. In this paper, we report best grinding conditions of ultra-precision grinding machining. The grinding machining results of the form accuracy and surface roughness have been analyzed by using Form Talysurf and NanoScan.

• Journal of the Korean Ceramic Society
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• v.40 no.8
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• pp.770-776
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• 2003

#140 mesh and #600 mesh wheels were adopted to grind (111) and (100) oriented single crystalline silicon wafer and the grinding induced change of the surface integrity was investigated. For this purpose, microroughness, residual stress and phase transformation were analyzed for the ground surface. Microroughness was analyzed using AFM (Atomic Force Microscope) and crystal structure was analyzed using micro-Raman spectroscopy. The residual stress and phase transformation were also analyzed after thermal annealing in the air. As a result, microroughness of (111) wafer was larger than that of (100) wafer after grinding. It was observed using Raman spectrum that the silicon was transformed from diamond cubic Si-I to Si-III(body centered tetragonal) or Si-XII(rhombohedral). Residual stress relaxation was also shown in cavities which were produced after grinding. The thermal annealing was effective for the recovery of the silicon phase to the original phase and the residual stress relaxation.