• Title/Summary/Keyword: 다아아몬드 기구

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MICROLEAKAGE OF 2-STEP ADHESIVE SYSTEMS IN DIAMOND-PREPARED CAVITY (다이아몬드 기구로 삭제한 와동에서 2단계 접착제의 미세누출 비교)

  • Lee, Myung-Goo;Cho, Kwon-Hwan;Cho, Young-Gon
    • Restorative Dentistry and Endodontics
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    • v.32 no.5
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    • pp.437-444
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    • 2007
  • The purpose of this study was to compare the marginal microleakage of different 2-step adhesive systems in Class V cavities prepared with different diamond points. Forty Class V cavities were prepared with two different (coarse or fine) diamond points on cervical third of extracted molars. The occlusal and gingival margin of cavities was located in enamel and dentin, respectively. They were divided into one of four equal groups (n = 10) and ; Group 1-prepared with coarse diamond point (EX-41), restored with Single Bond and Z 250, Group 2-prepared with fine diamond piont (TF-21F), restored with Sing)e Bond and Z 250, Group 3-prepared with coarse diamond point (EX-41), restored with Clearfil SE Bond and Clearfil AP-X, Group 4-prepared with fine diamond point (TF-21F), restored with Clearfil SE Bond and Clearfil AP-X. Specimens were thermocycled, immersed in a 2% methylene blue solution for 24 hours, and bisected longitudinally. They were observed leakages at enamel and dentinal margins. Data were analyzed using Mann-Whitney and Wilcoxon signed ranked test. In this study, marginal microleakage or Single Bond was not affected by type of diamond points. But Clearfil SE Bond showed higher marginal microleakage at both enamel and dentinal margin when Class V cavity was prepared with coarse diamond point.