• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.59-59
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• 2004

최근의 전자통신 및 정밀의료 부품들은 제품의 경량화 및 집적화로 인해 크기는 작으면서도 많은 기능이 요구되어지는 다기능ㆍ소형화 추세에 있다. 따라서, 부품들은 복잡한 형상에 초고기능과 초정밀도가 요구되어 고강도의 재료와 MEMS 및 Nano-technology로 성형ㆍ가공된다. 이러한 방법은 고비용을 요하며 실용화에 많은 문제점을 내포하고 있다. 반면에 이러한 부품들을 생산단가가 저렴한 전통적인 소성가공기술로 생산할 경우에는 부품의 강도 및 정밀도에 한계를 갖게 된다.(중략)

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1757-1760
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• 2005

This paper is concerned with spring back after sheet forming of bulk amorphous alloys in the super cooled liquid state. The temperature-dependence and strain-rate dependence of Newtonian/non-Newtonian viscosities as well as the stress overshoot/undershoot behavior of amorphous alloys are reflected in the thermo-mechanical Finite Element simulations. Hemispherical deep drawing operations are simulated for various forming conditions such as punch velocity, die corner radius, friction, blank holder force, clearance and initial forming temperature. Here, spring back by an instantaneous elastic unloading was followed by thermal deformation during cooling and two modes of spring backs are examined in detail. It could be concluded that the superior sheet formability of an amorphous alloy can be obtained by taking the proper forming conditions for loading/unloading.