• Title/Summary/Keyword: 나노 캐비티

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3-dimensional Nano Structures for Semiconductor Light Source (반도체 광원 적용을 위한 3차원 나노 구조 개발)

  • Kim, Je Won
    • Journal of Convergence for Information Technology
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    • v.10 no.2
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    • pp.96-101
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    • 2020
  • In micro-sized light emitting diodes, which are increasingly attentions as the light sources of displays and semiconductor lighting, increasing the amount of light and improving the luminous efficiency are very important and various development directions and methods have been proposed. In this study, the design of 3-dimensional nano structures through nano frame formation and the application of a nano pattern and a reactive etching method were proposed. And it will also be discussed that nano pillar arrays with nano cavities having improved verticality can be applied to semiconductor light sources through the development of nano frame structures.

Development of simulation method for heating line optimization of E-Mold by using commercial CAE softwares (전산모사 프로그램을 이용한 E-MOLD의 Heating Line 배치의 최적화 설계에 관한 연구)

  • Chung, Jae-Youp;Kim, Dong-Hak
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.9 no.6
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    • pp.1754-1759
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    • 2008
  • To produce plastic parts that have fine pattern through conventional injection molding, a lot of difficulties follow. Therefore, rapid heating and cooling methods are good candidates for manufacturing injection-molded parts with micro/nano patterns. In this study, we adopted the E-Mold patent technology. The mold for E-Mold technology has a separate heated core with micro heaters. It is very important to optimize the lay-out of the heaters in heated core because it influences both control and distribution of mold temperature. We developed a optimization method of heating line lay-out by using commercial softwares and compared the output with the experimental results. We used Pro-Engineer Wildfire 2.0 for the mold design, ICEMCFD for mesh generation, and FLUENT for heat transfer simulation. The simulation results showed the temperature profile from $60^{\circ}C$ to $120^{\circ}C$ or $180^{\circ}C$ during heating and cooling process which were compared with the injection molding experiments. We concluded that the simulation could well explain the experimental results. It was shown that the E-Mold optimization design for heater lay-out could be available through the simulation.