• Journal of the Microelectronics and Packaging Society
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• v.11 no.3 s.32
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• pp.23-30
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• 2004

Interfacial reaction of Pb-free $Sn0.7wt{\%}Cu$ and $Sn3.8wt{\%}Ag0.7wt{\%}Cu$ solders and Pt during aging has been investigated. After the $Sn3.8wt{\%}Ag0.7wt{\%}Cu/Pt$ specimens were reflowed at $250^{\circ}C$ for 30s and the $Sn0.7wt{\%}Cu/Pt$ specimens were reflowed at $260^{\circ}C$, the specimens were aged at $125^{\circ}C,\;150^{\circ}C$ and $170^{\circ}C$ for 25-121 hours. The intermetallic thitkness and morphology change during aging were characterized using SEM, EDS and XRD. $PtSn_4$ and $PtSn_2$ were observed in the solder/pt interface and the intermetallic formation was governed by diffusion. The activation energy of intermetallic formation was 145.3 kJ/mol for$Sn3.8wt{\%}Ag0.7wt{\%}Cu/Pt$ specimens for $Sn0.7wt{\%}Cu/Pt$ specimens from the measurement of the intermetallic thickness with aging temperature and time.

• The Journal of Korean Academy of Prosthodontics
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• v.49 no.1
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• pp.65-72
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• 2011

Purpose: The purpose of this study was to evaluate the level of electro-chemical corrosion and surface roughness change for the cases of Ti abutment connected to restoration made of base metal alloys. Materials and methods: It was hypothesized that Ni-Cr alloys in different compositions possess different corrosion resistances, and thus the specimens ($13{\times}13{\times}1.5\;mm$) in this study were fabricated with 3 different types of metal alloys, commonly used for metal ceramic restorations. The electrochemical characteristics were evaluated with potentiostat (Parstat 2273A) and the level of surface roughness change was observed with surface roughness tester. Paired t-test was used to compare mean average surface roughness (Ra) changes of each specimen group. Results: All specimens made of nickel-chromium based alloys, average surface roughness was increased significantly (P < .05). Among them, the Ni-Cr-Be alloy ($0.016{\pm}.007\;{\mu}m$) had the largest change of roughness followed by Ni-Cr ($0.012{\pm}.003\;{\mu}m$) and Ni-Cr-Ti ($0.012{\pm}.002\;{\mu}m$) alloy. There was no significant changes in surface roughness between each metal alloys after corrosion. Conclusion: In the case of galvanic couples of Ti in contact with all specimens made of nickel-chromium based alloys, average surface roughness was increased.

• Journal of Conservation Science
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• v.31 no.3
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• pp.243-254
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• 2015

In this study, the stability of the adhesive was determined through the Oddy Test that is Verification Test for potential damage by various materials. And to find the factor causing the corrosion of the metal samples, the adhesives and coatings those are usually used in the metal preservation process were selected and treated on the samples. Six kinds of adhesives and four kinds of metal specimens Fe, Pb, Cu, Ag were used. As results, the weight change showed high increasement in the rate of weight change 29.87% of Fe sample. The chromaticity measurement showed the high change value of the Cellulose-based adhesive. In case of the VOCs test from adhesive by using GC-MS, Acetic acid was detected from all six kinds of the adhesives. Compared to cellulose-based adhesives and the other adhesives, the amount of VOCs per 1mg concentration is higher than 900 times and was detected small amount of Formic acid. This is assumed to be facilitated by acid impurities and the light. This reaction was considered as the result of reducing a large amount of molecular and of generating a large amount of Nox. And thus the reacted sulfur changes was considered as the factor for causing corrosion.

• Korean Journal of Materials Research
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• v.4 no.6
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• pp.669-680
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• 1994

Oxidation behaviour of TiAl intermetallic compounds with the addition of Cr, V, Si, Mo, or Nb was investigated at 900~$1100^{\circ}C$ under the atmospheric environment. The reaction products were examined by XRD, SEM equipped with WDX. The weight gain by continuous oxidation increased with the addition of Cr or V, but there was less weight gain when Mo, Si or Nb was added individually. he oxidation rate of Cr- or V-added TiAl was always larger than that of TiAI. However, oxidation rate of Si-, Mo- or Nb-added TiAl was almost same or smaller than that of TiAI. Thus, it is concluded that the addition of Cr or V did not improve the oxidation resistance, whereas the addition of Si, Mo or Nb improved the oxidation resistance. Oxides formed on TiAl with Mo, Si, and Nb were found to be more protective, resulting from the decrease in diffusion rate of the alloying elements and oxygen. Nb strengthened the tendency to form $AI_{2}O_{3}$ in the early stage of oxidation, due to the continuous $AI_{2}O_{3}$ layer formation and dense $Tio_{2}+AI_{2}O_{3}$ layer. According to the Pt-marker test of TiAI- 5wt%Nb, oxygen diffused mainly inward while oxides were formed on the substrate surface. Upon thermal cyclic oxidation at $900^{\circ}C$, it is shown that the addition of Cr or Nb improved the adherence of oxide scale to the substrate.

• ETRI Journal
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• v.10 no.3
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• pp.212-220
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• 1988

투과전자현미경(TEM)의 관찰을 위한 반도체 시료의 박편제작기술에 대하여 언급하였다. 전자선을 투과할 수 있는 얇은 두께의 시편을 제작하는 일은 금속이나 생물학적인 재료에 비하여 반도체의 경우 많은 어려움이 따르며 특히 잘 부서지기 쉬운 특성 때문에 취급에 많은 주의를 요한다. 반도체를 대상으로 하여 일반적으로 사용되는 박편 제작기술에 대해 그 특성과 장단점 등을 조사하였다.

• Proceedings of the KWS Conference
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• 2000.04a
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• pp.71-74
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• 2000

자기 구속 균열 시험법인 Tapered 시편 균열 시험법을 이용하여 Al-Mg 합금의 CW $CO_2$ 레이저 용접시 Mg 함량 변화에 따른 고온균열감수성 변화를 조사하였다. Mg 함량 1.9wt.%에서 최대균열감수성을 나타내고 있으며 이보다 Mg 함량이 증가하거나 감소하면 고온균열 감수성이 감소한다. 용접금속 결정립 크기 또한 고온균열감수성과 관련이 있으며 Mg 함량이 증가할수록 결정립이 미세화되며, 1.9wt.%Mg 이상에서 결정립이 미세화될수륵 고온균열 감수성 이 감소한다.

• Transactions of the Korean Society of Mechanical Engineers
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• v.15 no.5
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• pp.1479-1485
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• 1991

본 연구에서는 고차판이론(higher order shear deformable plate theory)을 사용하여 DCB시편을 보형상이 아닌 실제의 얇은 판으로 해석하여 새로운 에너지해방률 식을 제시하고자 한다.한편, 이의 타당성을 입증하기 위하여 Gr/Ep 및 APC-2 복합 재료로 ASTM D30.02 round robin의 제안 방법에 의해 층간파괴인성치를 구하고, 또 이 강용이 제안한 Ae법에 의한 금속의 파괴인성치 결정법을 참고로 하여 미세파괴 초창기 의 층간파괴인성치를 결정하여 이론결과와 비교 검토한다.

• Journal of the Korean institute of surface engineering
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• v.21 no.4
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• pp.183-192
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• 1988

양극산화피막의 조성은 현대 장비의 정밀도가 nano 영역까지의 성분 분석이 이루어 짐의로서, 최근에 와서 금속한 진전을 나타내고 있다. 특히 TEM. EDC System을 이용한 Ultramicrotomed 시편의 정밀분석 기술은 이제 한계를 나타내고 있는 것 같다. 본고에서는 반응 Mechanism을 연구하는데 가장 필수적인 분야인 양극산화피막의 조성에 관해 1950 연대 이후 어떻게 연구되고 설명되었는가를 조명하므로 해서, 그 응용의 기반을 확고히 하고자 한다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.278-278
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• 2014

저가형 고전도성/고내식 연료전지용 금속분리판 제작을 위해 다양한 조성 및 온도에서 표면개질을 시행하였다. 본 연구에 의해 제작된 시편의 표면분석 결과 Fe 선택적 용출 및 Cr-rich layer 형성이 이루어졌음을 확인하였으며, 성능 평가 결과 2015 DOE 목표를 만족시키는 것을 확인하였다.

• Journal of the Korean Vacuum Society
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• v.4 no.4
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• pp.402-406
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• 1995

MOS(금속 산화막 반도체 접합) 소자가 방사선에 노출되면, 산화막재에 양의 공간전하가 생성되고 Si-SiO2 계면에 계면준위가 생성된다. MOS 커패시터의 방사선 조사효과를 방사선 피폭량과 산화막의 두께를 달리하는 시편에서 정전용량과 전류변화를 측정하여 고찰하였다. 정전용량-바이어스 전압 특성 실험결과로부터 플렛밴드 전압 및 계면상태밀도를 계산하였다. 또한 전압-전류 특성은 방사선 조사로 산화막내에 생성된 양의 공간전하와 Si-SiO2 계면에 포획된 전하에 의해서 설명이 가능하였다.