• Title/Summary/Keyword: 금속선재

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An experimental study on diameter increase of orthodontic wire by electroplating (전기도금을 이용한 스테인레스 스틸 선재의 직경 증가에 관한 실험적 연구)

  • Cho, Jin-Hyoung;Sung, Young-Eun;Lee, Ki-Heon;Hwang, Hyeon-Shik
    • The korean journal of orthodontics
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    • v.33 no.2 s.97
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    • pp.121-130
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    • 2003
  • The purpose of this study was to evaluate the possibile clinical application of electroplating to increase diameter of an orthodontic wire, through examining the change of physical properties. The diameter of stainless steel orthodontic wire was increased from 0.016 inch to 0.018 inch by electroplating in a bath of nickel sulfate 100g/L, nickel chloride 60g/L, boric acid 30g/L, and sodium chloride 50g/L, under the conditions of 1.7V, $25\~29^{\circ}C\;and\;3.1\~3.3pH$. During the electroplating, the rate of diameter increase was measured every minute. To investigate uniformity, the diameter was measured at three different locations of each wire specimen aster electroplating. An X-ray diffraction test was performed to analyze the nature of the electroplated metal. Following heat treatment to improve adhesion between the wire and electroplated metal, a three-point bending test was conducted to compare stiffness, field strength, and ultimate strength among four wire groups; 0.016 inch, electroplated 016, electroplated and heat-treated 016, and 0.018 inch wires. Through the comparison of each wire group, following results were obtained. 1. In the load-deflection graph, the curve of the electroplated group was Placed between that of the 0.016 inch group and the 0.018 inch group, and the owe was closer to the 0.018 inch group by heat treatment. 2. In the electroplated and heat-treated 016 wire group, the values of stiffness, yield strength and ultimate strength showed higher tendency than in the original 0.016 Inch group. Stiffness and ultimate strength showed statistically significant differences between two groups. 3. Stiffness, yield strength, and ultimate strength of electroplated wire presented lower values than those of 0.018 inch wire group. 4. Stiffness, yield strength, and ultimate strength of electroplated and heat-treated wire showed higher tendency than those of electroplated wire group, and ultimate strength showed statistically significant difference between two groups. 5. After electroplating, the difference in diameter between the three locations was within $0.1\~0.3\%$ variation, and showed no statistical significance.

The effet of cooling rate on the residual stresses in the veneer ceramics of zirconia-ceramic restorations: a literature review (냉각속도가 지르코니아-도재 수복물의 전장도재 내 잔류응력에 미치는 효과에 관한 문헌고찰)

  • Chang, Jea-Seung;Kim, Sunjai
    • The Journal of Korean Academy of Prosthodontics
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    • v.52 no.2
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    • pp.136-142
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    • 2014
  • Nowadays, dental zirconia is widely used as a framework material for a fixed dental prosthesis as well as a single restoration. However, clinical studies have reported high incidence of veneer chipping of zirconia-ceramic restorations compared to that of metal-ceramics. Several factors were raised as the possible causes of veneer ceramic chipping, however, it is still in debate. Recently, residual stresses in the veneer ceramics after cooling process gathers attention as one possible cause of chipping and many studies reported that the rate of cooling significantly influenced the types and the amount of residual stress. The purpose of current review was to briefly describe the effect of cooling rate on the residual stress in zirconia-ceramics. It was also described that the different behavior of residual stress between zirconia-ceramics and metal-ceramics following different cooling rate.

A Study on the Comparison of Chloride Ion Quantification Methods for Magnesium-Aluminum (Mg-Al) Alloy Powder (마그네슘-알루미늄(Mg-Al) 합금 분말의 염소이온 정량법의 비교에 관한 연구)

  • Yunhwan, Kim;Youngson Choe
    • Applied Chemistry for Engineering
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    • v.34 no.4
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    • pp.450-454
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    • 2023
  • Chloride ions in the alloy powder used as flux in Flux Cored Arc Welding (FCAW) can cause pores on the bead surface of the welding metal to cause defects, or chloride remaining in the alloy powder can cause corrosion of the metal. Combustion-ion chromatography is mainly used to quantify the chloride ions in alloy powder, but there is a limitation in that the equipment is expensive and requires a high degree of expertise. Therefore, this study aims to find an easy and accurate quantification method in the field by comparing combustion-ion chromatography (C-IC), which is mainly used for chloride ion quantification of alloy powder, X-ray fluorescence analysis (XRF), and potentiometric titration. In this article, magnesium-aluminum alloy powder is applied to the quantification of chloride ions because it is most commonly used as flux. This study confirmed that potentiometric titration can be applied to the quantification of chloride ions in the alloy powder in the industry field.

Photocatalytic Behaviors of Transition Metal Ions Doped TiO2 Synthesized by Mechanical Alloying (기계적 합금화법을 이용한 전이금속 도핑에 따른 TiO2분말의 광촉매 특성)

  • Woo S.H.;Kim W.W.;Kim S.J.;Rhee C.K.
    • Journal of Powder Materials
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    • v.12 no.4 s.51
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    • pp.266-272
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    • 2005
  • Transition metal ions($Ni^{2+}$, $Cr^{3+}$ and $V^{5+}$) doped $TiO_2$ nanostructured powders were synthesized by mechanical alloying(MA) to shift the adsorption threshold into the visible light region. The synthesized powders were characterized by XRD, SEM, TEM and BET for structural analysis, UV-Vis and photoluminescence spectrum for the optical study. Also, photocatalytic abilities were evaluated by decomposition of 4-chlorophenol(4CP) under ultraviolet and visible light irradiations. Optical studies showed that the absorption wavelength of transition metal ions doped $TiO_2$ powders moved to visible light range, which was believed to be induced by the energy level change due to the doping. Among the prepared $TiO_2$ powders, $NiO^{2+}$ doped $TiO_2$ powders, showed excellent photooxidative ability in 4CP decomposition.

Metallurgical Study of Bronze Artifacts Excavated from Miruksa Temple (미륵사지 출토 청동유물의 금속학적 연구)

  • Chung, K.R.;Kim, Y.C.;Maeng, S.C.
    • Journal of Conservation Science
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    • v.1 no.1 s.1
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    • pp.27-39
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    • 1992
  • Metallurgical studies of the bronze artifacts excavated from Miruksa Temple were performed by chemical analysis and metallographic observation. Alloy systems of the bronze artifacts were classified into two groups of Cu-Sn and Cu-Sn-Pb, according to the items. The contents of impurities such as Sb, As, Ni and Fe in bronze artifacts are within the limiting range of the mod ern standard bronze castings. Chemical compositions of the kitchen utensils such as bronze vessels and dishes in the Unified Silla dynasty, are in the follow ing range, Cu : 74.8-79.4% and Sn : 18.6-21.1%. Chemical composition of the Buddha-image in Koryo dynasty are 820Cu-7.0Sn-10.3Pb, showing increased Pb content and decreased Sn content. The results of chemical analysis suggest that the chemical compositions were good controlled. Any casting defects such as voids and shrinkage holes are not found microscopically, indicating high casting skill. Zinc atoms are not contained in the all bronze artifacts of Miruksa Temple site. This is the common facts founded in the east asian bronze artifacts of Korea, China and Japan. It is comparable with the European bronze of Cu-Sn-Pb-Zn system, after the Middle Age.

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A study on the bonding properties of YBCO coated conductors with stabilizer tape (안정화 선재의 YBCO 초전도 접합 특성)

  • Kim Tae-Hyung;Oh Sang-Soo;Ha Dong-Woo;Kim Ho-Sup;Ko Rock-Kil;Shin Hyung-Seop;Park Kyung-Chae
    • Progress in Superconductivity and Cryogenics
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    • v.8 no.3
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    • pp.23-26
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    • 2006
  • For mechanical and electrical stability and environment protection. Cu and stainless steel stabilizers are laminated to a Ag layer to produce a composite neutral-axis(N-A) architecture in which the YBCO layer is centered between the oxide buffered metallic substrate and stabilizer strip lamination. This architecture allows the wire to meet operational requirements including stresses at cryogenic temperature. winding tensions as well as mechanical bending requirements including thermal and electrical stability under fault current conditions. We have experimentally studied mechanical properties of the laminated stainless steel and Cu stabilizers on YBCO coated conductors. We have laminated YBCO coated conductors by continuous dipping soldering process. We have investigated lamination interface between solder and stabilizer of the YBCO coated conductor. We evaluated bonding properties. tensile / shear bonding strength. and peeling strength laminated YBCO coated conductors.

Fabrication of $MgB_2$ tape with metal powder addition (금속분말이 첨가된 $MgB_2$ 선재의 제조 및 특성)

  • Ko, Jae-Woong;Yoo, Jai-Moo;Kim, Young-Kuk;Chung, Kook-Chae;Yoo, Sang-Im;Wang, Xio Lin;Dou, Shi Xue
    • Progress in Superconductivity and Cryogenics
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    • v.8 no.1
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    • pp.1-4
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    • 2006
  • The $MgB_2$ tapes with several metal powder addition were fabricated by PIT method with or without heat treatment. The $J_c$ value of $5.600A/cm^2$ and $16.000A/cm^2$ at 4.2 K and 5 T were obtained for the $MgB_2$ tape and 10 vol % of Cu added $MgB_2$ tape without heat treatment respectively. The $J_c$ value of $8.000A/cm^2$ and $35,000A/cm^2$ at 4.2 K and 5 T were obtained for the $MgB_2$ tape and 10 vol. % of Al added $MgB_2$ tape with heat treatment, respectively. The $J_c-B$ curve shows enhancement in $J_c$ under magnetic field. which suggests enhancement in workability and grain connectivity with several metal powder addition.

A study on the properties of SmBCO coated conductors with stabilizer tape (SmBCO 고온 초전도 선재의 안정화재 특성)

  • Kim, Tae-Hyung;Oh, Sang-Soo;Kim, Ho-Sup;Ko, Rock-Kil;Song, Kyu-Jeong;Ha, Hong-Soo;Lee, Nam-Jin;Park, Kyung-Chae;Ha, Dong-Woo
    • Progress in Superconductivity and Cryogenics
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    • v.9 no.3
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    • pp.9-12
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    • 2007
  • In this study. we searched for the mechanical and electrical properties of laminated coated conductors with stabilizer tape. Stabilizer tape plays a role for mechanical and electrical stability and environmental protection. Cu material stabilizer was laminated to Ag capping layer on SmBCO conductor layer. This architecture allows the wire to meet operational requirements including the stressless at cryogenic temperature and winding tension as well as mechanical bending requirements including thermal and electrical stability under fault current conditions. First, we have experimentally studied mechanical bonding properties of the laminated Cu stabilizers on SmBCO coated conductors. We have laminated SmBCO coated conductors by continuous dipping soldering process, Second, we have investigated electrical properties of the SmBCO coated conductors with stabilizer lamination. We evaluated bonding properties, peeling strength and critical current for laminated SmBCO coated conductors with Cu stabilizers.

A Study on the Mechanical Method of Observing Winding Behavior by Charging and Discharging of Type II High Pressure Hydrogen Storage Tank (Type II 고압수소저장용기의 충전과 방출에 의한 권선 거동 관찰의 기계적 방법에 관한 연구)

  • KIM, SEUNGHWAN;HAN, JINMOOK;LEE, SUNGHEE;JUNG, YOUNGGUAN
    • Transactions of the Korean hydrogen and new energy society
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    • v.33 no.2
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    • pp.158-163
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    • 2022
  • The test method on the Type II high-pressure hydrogen storage tanks made of the metal wire hoop winding is a complex and high risk. Also closeup on the tank being test is difficult. In this study, we studied a mechanical test method for a high-pressure hydrogen tanks. This method must be simple, risk-free and possible to observe the change in microscopic behavior of a metal wire on a liner. As the results, it was possible to observe the microscopic behavior on the metal wire by the mechanical test method. Also, a simple and risk-free test was possible compared to the conventional test method for high pressure hydrogen tanks.

Effect of Shear Deformation During Drawing on Inhomogeneous Microstructures and Textures in High Purity Copper Wires After Annealing (고순도 구리 선재의 어닐링 후 불균질 미세조직과 집합조직에 미치는 신선 시 전단 변형의 영향)

  • Park, Hyun;Kim, Sang-Hyeok;Kim, Se-Jong;Lee, Hyo-Jong
    • Korean Journal of Metals and Materials
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    • v.56 no.12
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    • pp.861-869
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    • 2018
  • To determine the origin of the inhomogeneous microstructure and texture observed in drawn and annealed high purity copper wires, two kinds of drawing process conditions and their influence was investigated. The regular condition, based on a symmetric die, and a condition designed intentionally to produce an inhomogeneous shear deformation using an asymmetric die were employed. The difference in intensity of <111>-<100> distributed texture between the two wires confirmed that the wire drawn under the asymmetric die condition experienced a higher amount of shear deformation. The extensive shear strain in the wire drawn under the asymmetric die condition gave rise to inhomogeneous primary and secondary recrystallization behavior. After annealing at $200^{\circ}C$, grains with <100> texture, which were larger than the surrounding recrystallized grains, were extensively present on one half circle of the wire drawn under the asymmetric die condition, while larger grains with <100> were sparsely observed around the middle region of the wire drawn under the regular condition. Interestingly, the area where the larger grains with <100> texture existed was identical to the area where the high shear strain occurred during drawing in both wires. During annealing at $400^{\circ}C$, grains with <112> texture started to grow abnormally at the center of both wires as a result of secondary recrystallization. After annealing at $900^{\circ}C$ grains with <112> due to secondary recrystallization occupied the entire region of the wire drawn under the regular condition. On the other hand, in the wire drawn under the asymmetric die condition and then annealed at $900^{\circ}C$, the <100> oriented grains as a result of the normal grain growth of the larger <100> grains which were observed after annealing at $200^{\circ}C$, coexisted with the abnormally grown <112> grains. These results indicate that dynamic recrystallization induced by the shear strain during drawing plays an important role in the inhomogeneity of the microstructure and texture of wires after annealing.