• Title/Summary/Keyword: 굽힘변형

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Lightweight Design and Structural Stability of Wide Impeller for Lage-area Surface Treatment (대면적 표면처리용 광폭 임펠러의 경량 설계 및 구조적 안정성)

  • Kim, Taehyung;Jeong, Junhyeong;Cha, Joonmyung;Seok, Taehyeon;Lee, Sechang
    • Journal of Energy Engineering
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    • v.29 no.3
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    • pp.18-24
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    • 2020
  • In this study, a lightweight wide impeller for large-area surface treatment was designed and structural stability was confirmed based on finite element(FE) analysis. A lightweight bracket FE model was established through topology optimization, and the optimal FE model was selected after structural analysis. The bending deformation FE analysis was performed, and bending deformation was included in the allowable deformation range. In addition, FE modal analysis was performed, and the range of safe speed(RPM) by rotation was suggested. Ultimately, it was confirmed that this analytical technique is effective for design the lightweight wide impeller.

Degumming Characteristics and Fabric Properties by Papain Degumming (파파인효소의 정련특성과 정련견의 성질)

  • 김정희;남중희
    • Journal of Sericultural and Entomological Science
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    • v.29 no.2
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    • pp.58-66
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    • 1987
  • This study was investigated on the effect of degumming of cocoon shell, raw silk yarn and grey silk crepe by use of Papain, comparing with soap, soda and soap-soda. The obtained results may be summarized as follows : 1. Degumming loss, when the pretreatment was done, was completed by Papain more than by alkali. 2. Lousiness result of Papain degummed silk yarn was apt to be improved more than that of alkali degummed one. 3. As a result of tensile property test, elasticity and resilience of Papain degummed crepe were good compared to those of alkali degummed one. 4. Not only bending rigidity of Papain degummed crepe was reduced more than that of alkali degummed one but also hysteresis of bending moment was decreased in papain degummed crepe. 5. Handle of Papain degummed crepe was superior to that of alkali degummed one.

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Warpage Improvement of PCB with Material Properties Variation of Core (코어 물성 변화에 따른 인쇄회로기판의 warpage 개선)

  • Yoon Il-Soung
    • Journal of the Microelectronics and Packaging Society
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    • v.13 no.2 s.39
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    • pp.1-7
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    • 2006
  • In this paper, warpage magnitude and shape of printed-circuit board in case that properties of core and thickness of solder resist are varied are investigated. The cause of warpage is coefficient of thermal expansion differences of stacked materials. Therefore, we need small difference of coefficient of thermal expansion that laminated material, and need to decrease asymmetric of top side and bottom side in structure shape. Also, we can control occurrence of warpage heightening hardness of core in laminated material. Composite material that make core are exploited in connection with the structural bending twisting coupling resulting from directional properties of fiber reinforced composite materials and from ply stacking sequence. If we use such characteristic, we can control warpage with change of material properties. In this paper, warpage of two layer stacked chip scale package is investigated, and evaluate improvement result using an experiment and finite element method tool.

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Packaging Substrate Bending Prediction due to Residual Stress (잔류응력으로 인한 패키지 기판 굽힘 변형량 예측)

  • Kim, Cheolgyu;Choi, Hyeseon;Kim, Minsung;Kim, Taek-Soo
    • Journal of the Microelectronics and Packaging Society
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    • v.20 no.1
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    • pp.21-26
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    • 2013
  • This study presents new analysis method to predict bending behavior of packaging substrate structure by comparing finite element method simulation and measured curvature using 3D scanner. Packaging substrate is easily bent and deflected while undergoing various processes such as curing of prepreg and copper pattern plating. We prepare specimens with various conditions and measure contours of each specimen and compute the residual stresses on deposited films using analytical solution to find the principle of bending. Core and prepreg in packaging substrate are made up of resin and bundles of fiber which exist orthogonally each other. Anisotropic material properties cause peculiar bending behavior of packaging substrate. We simulate the bending deflection with finite element method and verify the simulated deflection with measured data. The plating stress of electrodeposited copper is about 58 MPa. The curing stresses of solder resist and prepreg are about 13 MPa and 6.4 MPa respectively in room temperature.

Simplified Collision Analysis Method for Submerged Floating Railway Using the Theory of a Beam with an Elastic Foundation (탄성지지 보이론을 이용한 해중철도 간이 충돌해석법)

  • Seo, Sung-Il;Kim, Jin Sung
    • Journal of the Korean Society for Railway
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    • v.16 no.3
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    • pp.202-206
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    • 2013
  • A submerged floating railway is an innovative tunnel infrastructure passing through the deep sea independent of wave and wind so that high speed trains can run on it. It doesn't depend on water depth and is cost effective due to modular construction on land. The construction period can be reduced drastically. This paper introduces the concept design of a submerged floating railway, and for securing safety, proposes a method to analyze the structural behavior of the body in case of collision with a submarine. The theory of a beam with an elastic foundation was used to calculate the equivalent mass of the body so that the perfect elastic collision could be applied to calculate the collision velocity. The maximum deformation and bending moment was analyzed based on energy conservation. To verify the results, a collision analysis using a finite element analysis code was made. Comparing the results confirmed that this simplified collision analysis method gives enough accurate deformation and bending moment to be used for actual estimation in the initial design stage.

Quantitative Interpretation of Holographic Fringe by Using Phase Shifting Method and Digital Image Processing (위상변이법과 디지탈 영상처리를 이용한 홀로그래피 간섭무늬의 정량적 해석)

  • 고영욱;권영하;강대임;박승옥
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.16 no.9
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    • pp.1728-1735
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    • 1992
  • Holographic interferometry technique has been used for the measurement of whole-field deformation with high sensitivity. However there are some difficulties in quantitatively analyzing the holographic fringes. Recently, quantitative and automatic fringe analysis by using phase shifting method in interferometry has been studied in many fields. In this paper, a real time holographic interferometry system and a phase shifting method combined with digital image processing technique are employed to record and quantitatively analyze holographic fringe patterns. To evaluate our system and analyze errors, comparison of measured deformation with theoretical deformation of cantilever beam was carried out. The accuracy of 4.5% in our system was verified We have tried to apply this method to quantitatively measure the deformation of turbine blade under the bending force.

Out-of-Plane Vibration Analysis of Curved Beams Considering Shear Deformation Using DQM (전단변형이론 및 미분구적법을 이용한 곡선보의 면외 진동해석)

  • Kang, Ki-Jun;Kim, Jang-Woo
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.20 no.4
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    • pp.417-425
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    • 2007
  • The differential quadrature method(DQM) is applied to computation of eigenvalues of the equations of motion governing the free out-of-plane vibration for circular curved beams including the effects of rotatory inertia and transverse shearing deformation. Fundamental frequencies are calculated for the members with clamped-clamped end conditions and various opening angles. The results are compared with exact solutions or numerical solutions by other methods for cases in which they are available. The DQM provides good accuracy even when only a limited number of grid points is used.

Analytical and Experimental Study on the Damping of Vibrating Layered Plates Including the Effects of Shear and Thickness Deformation of the Adhesive Layer (접착제층의 전단과 법선변형 효과를 고려한 적층판의 진동감쇠특성 연구)

  • 김재호;박태학
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.16 no.7
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    • pp.1244-1254
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    • 1992
  • This paper investigates the vibrational damping characteristics of laminated plates composed of elastic, viscoelastic and elastic layers by theoretical and experimental methods. Laminated plates are in cylindrical bending and visco-elastic adhesive layer is assumed as the visco-elastic spring which takes damping effect through both shear and normal deformations. Governing equations oof laminated plates are derived in the form of simultaneous first order differential equations, which account for the longitudinal displacements, rotary inertia and shear deformations of elastic base plate and elastic constraining plate. The numerical calculations of the equations are illustrated by the applications to the cantilever beam in transverse vibration. The results of the solutions agree well with the experimental measurements in general. The damping effects due to the shear and thickness deformations in the adhesives are analyzed and it is shown that for thicker adhesives, the damping effect due to thickness deformation becomes significant and for thinner adhesives, due to shear deformation.

Numerical Analysis of Deformation Mode of Flexible Plate-Type Piezoelectric Module for Evaluating Characteristics of Electrical-Energy Generation (판형 압전 진동자의 굽힘변형 모드에 따른 전압발생 특성에 관한 해석적 연구)

  • Park, Jeong-Hyun;Park, Sang-Hu
    • Journal of the Korean Society for Precision Engineering
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    • v.32 no.8
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    • pp.735-741
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    • 2015
  • Piezoelectric materials are well-utilized for transforming mechanical vibrations into electrical energy that can be stored and used to power a diversity of devices. In this work, these materials have been studied to improve the efficiency of a piezoelectric system, whereby the shape and vibration mode of a piezoelectric module was changed. The basic shape of the piezoelectric module used in this work comprises a width of 10 mm, a length of 30 mm, and a thickness of 0.2 mm. The structural design of the piezoelectric module is optimized using a Taguchi method to increase the corresponding electrical-energy generation. The maximum terminal voltage was defined as a characteristic value to evaluate the optimal design parameters. Through this work, we propose an optimal structure with an eccentric and centric mass; furthermore, the voltage increase of approximately 26% was obtained by comparing a general plate-vibrating piezosystem with an optimal plate-vibrating piezosystem.

Bending Analysis of Reinforced Tube Beams (굽힘하중을 받는 보강 사각관 보의 좌굴변형거동 해석)

  • Choi, Nak-Sam;Lee, Sung-Hyuk
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.60-65
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    • 2007
  • Local buckling behaviors of aluminum square tube beams reinforced by aluminum plates under three point bending loads have been analyzed using experimental tests combined with theoretical and finite element analyses. For this analysis true stresses were determined from applied loads and cross-sectional area records of a tensile specimen with a rectangular cross-section by real-time photographing. True strains were also obtained from in-situ local elongation measurements of the specimen gage portion by the multi-point scanning laser extensometer. Six kinds of aluminum tube beam specimens reinforced by aluminum plates were employed for the bending test. The bending deformation behaviors up to the maximum load analyzed by the numerical simulation agreed well with experimental ones. After passing the maximum load, reinforcing plate hindering the local buckling of the tube beam was debonded from the aluminum tube beam. An aluminum tube beam strengthened by aluminum plate on the upper web showed the most excellent bending capacity, which could be explained on the basis of the neutral axis shift and the local buckling deformation range.

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