• Tribology and Lubricants
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• v.31 no.3
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• pp.79-85
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• 2015

RC delay is a critical issue for achieving high performance of ULSI devices. In order to minimize the RC delay time, we uses the CMP process to introduce high-conductivity Cu and low-k materials on the damascene. The low-k materials are generally soft and fragile, resulting in structure collapse during the conventional high-pressure CMP process. One troubleshooting method is electrochemical mechanical polishing (ECMP) which has the advantages of high removal rate, and low polishing pressure, resulting in a well-polished surface because of high removal rate, low polishing pressure, and well-polished surface, due to the electrochemical acceleration of the copper dissolution. This study analyzes an electrochemical state (active, passive, transpassive state) on a potentiodynamic curve using a three-electrode cell consisting of a working electrode (WE), counter electrode (CE), and reference electrode (RE) in a potentiostat to verify an electrochemical removal mechanism. This study also tries to find optimum conditions for ECMP through experimentation. Furthermore, during the low-pressure ECMP process, we investigate the effect of current density on surface roughness and removal rate through anodic oxidation, dissolution, and reaction with a chelating agent. In addition, according to the Faraday’s law, as the current density increases, the amount of oxidized and dissolved copper increases. Finally, we confirm that the surface roughness improves with polishing time, and the current decreases in this process.

• Journal of Bio-Environment Control
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• v.7 no.1
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• pp.35-41
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• 1998

This experiment was conducted to find out the effect of artificial light sources(high-pressure sodium lamp, metal halide lamp and fluorescent lamp) on growth of crisphead lettuce(Lactuca sativa L.) in a plant factory. No significant differences in leaf fresh and dry weight were presented among them. Lettuce plants grown under fluorescent lamp showed the lowest growth. Considering the growth of lettuce and efficiency of lamps, it is worth using HPS(high-pressure sodium) lamp in plant factories. The leaves of lettuce plants grown under artificial light sources showed tipburn symptoms at 14th day after transplanting. The beginning of tipburn symptom have been seen on the ninth to tenth leaves from the cotyledons. It is estimated that the occurrence of tipburn was related to rapid growth and K uptake of the lettuce Plants. The Ca, Mg. Cu and Zn elements tended to be accumulated in the nutrient solutions but the T-N, P, Fe and Mn elements keep in balance in them.

• The Korean Journal of Mycology
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• v.22 no.4
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• pp.325-331
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• 1994

White-rot fungus, Schizopora paradoxa did not produce Mn-peroxidase and glucose oxidase without manganese. But, in high concentration of manganese (40 ppm), the activities of both enzymes were higher than those in basal concentration of manganese (11.15 ppm). Unlike the activities of the enzymes, mycelial mass was the same level as the control culture (11.15 ppm manganese) through out the culture period, depending on the concentration of manganese. The same experiments were carried out for the effect of copper and veratryl alcohol added to the culture. The results were not consistent dependent on the concentration of copper and veratryl alcohol, respectively. The involvement of cAMP in the correlative production of MNP and GOX was investigated. In this study, addition of atropine to the culture resulted in a concomitant inhibition of production of MNP and GOX, depending on the concentration of inhibitor added.

• Journal of Korean Society of Forest Science
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• v.96 no.1
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• pp.115-123
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• 2007

We investigated the effects of postfire logging on bird populations and communities through 57 point counts in unburned, burned and logged burned plots of coniferous forests in Samcheok, Korea. We found that lower species richness, abundance, and diversity in logged plots where were controlled by a typical postfire management. As results of guild analysis for nest sites and food resources, postfire logging reduced densities of ground-shrub nesters, primary and secondary cavity nesters, but was also related to reduction in densities of some foraging groups such as timber drillers and foliage searchers. These results suggest that snag-retention is essential for birds in burned forests and that postfire logging is incompatible with the maintenance of bird populations and communities. Consequently we need to develope guidelines of postfire management for snag-retention in burned forests through intensive researches focused on some target species such as Great spotted woodpeckers Dendrocopos major.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.68.2-68.2
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• 2017

인체접촉시 니켈도금의 알러지 반응을 억제하기 위한 대체 도금기술인 비 시안계 Cu-Sn 합금도금을 개발함에 있어서, 황산구리5수화물과 황산제일주석을 금속염으로 하여 황산 및 계면활성제, 유화제 등을 포함한 각종 유기첨가제를 포함하였고 특히 은백색조의 외관 색상과 안정적인 Cu-Sn 합금전착을 위해 2종의 착화제인 EDTP (Ethylenediaminetetrapropanol, $C_{14}H_{32}N_2O_4$)와 TEA (Triethanolamine)를 첨가한 비 시안계 Cu-Sn 합금 도금액을 도출하였다. Cu-Sn 합금도금 피막 조성의 균일화를 도모하기 위해서는 합금 도금액중의 Cu와 Sn 금속이온 농도를 일정하게 유지하는 것이 필요하다. 그러나 합금 도금액 중 2가 주석이온($Sn^{2+}$)은 수용액 중에서 4가 주석이온($Sn^{4+}$)으로 산화됨으로써 도금액 색상이 백탁이 되고 Stannic Hydroxide($Sn(OH)_4$, $SnO_2{\cdot}2H_2O$)이 생성되어 대량의 침전물이 침강하는 문제점이 발생되는 등시간 경과에 따른 도금액의 경시 변화가 발생되었다. 상기 침전물은 연속여과에 의해 제거 가능하나 합금 도금액 중 $Sn^{2+}$ 농도가 지속적으로 감소하게 된다. 이는 합금 도금액 중 금속이온 비율이 변동함으로써 합금도금 피막의 조성비를 일정하게 유지하는 것이 곤란해진다. 이에 $Sn^{4+}$ 침전물 생성을 방지하기 위한 산화방지제를 개발하고 또한 산화방지제의 첨가에 따른 도금 피막 외관에 미치는 영향을 평가하여 외관 개선을 위한 광택제를 개발하고자 한다. 본 연구의 결과를 토대로 니켈도금과 동등 이상의 기능 특성을 갖는 비 시안계 Cu-Sn 합금도금액을 개발하여 실용화하는 것을 목적으로 하였다.

• Environmental Analysis Health and Toxicology
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• v.23 no.2
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• pp.101-112
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• 2008

Effects of various concentrations of copper on growth change of blue-greenalgae Anabaena flos-aquae were studied. There was significant differences among cultures treated with various concentrations of copper in growth of algae with parameters of cell numbers, specific growth rate (SGR) and chlorophyll contents. Algal growth and SGR were inhibited on by effect of various concentrations of copper more than without copper (ANOVA, F=34.69 p<0.001, F=114.89, p<0.001). The SGRs of various concentrations of copper in media were higher than without copper on 8 days after copper treated. The mean of chlorophyll contents was 1.978 ${\mu}g{\cdot}mL^{-1}$ and 1.648 ${\mu}g{\cdot}mL^{-1}$, respectively, while those of algae in culture without copper was 3.179 ${\mu}g{\cdot}mL^{-1}$ (ANOVA, F=153.74, p<0.001). The cellular morphology was different between media of which copper treated and without copper. The colony of algae in media which copper treated was shorter than without copper. Effects of various concentrations of copper on growth change of blue-green-algae Anabaena flos-aquae occured variety changes of parameters of cell numbers, specific growth rate (SGR), chlorophyll contents and cellular morphology on growth of algae.

• Economic and Environmental Geology
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• v.41 no.1
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• pp.151-163
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• 2008

Since the country's opening to the world, China's rapid economic growth has resulted in strong demand for a wide variety of mineral commodities. During the same period, China's mineral production increased sharply. China's increased mineral production and demand affected the worldwide availability of minerals and metals, the market prices, and trade. Ministry of Land and Resources of China (MLR) planned to build as many as 10 strategic mineral reserve, including reserves of aluminium, copper, manganese, uranium, and other mineral that the country urgently needed. In white paper of China's mineral resources, China is planning the mineral resources conservation and its reasonable utilization, domestic supply increase of resources, activation of cooperative development with foreign partners, balance in resources development and environment conservation, and sustainable resources management as the mineral resources policies for the China's economic development.

• Korean Journal of Materials Research
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• v.23 no.12
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• pp.695-701
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• 2013

To understand how reactivity between reinforcing nanoparticles and aqueous solution affects electrodeposited Cu thin films, two types of commercialized cerium oxide (ceria, $CeO_2$) nanoparticles were used with copper sulfate electrolyte to form in-situ nanocomposite films. During this process, we observed variation in colors and pH of the electrolyte depending on the manufacturer. Ceria aqueous solution and nickel sulfate ($NiSO_4$) aqueous solutions were also used for comparison. We checked several parameters which could be key factors contributing to the changes, such as the oxidation number of Cu, chemical impurities of ceria nanoparticles, and so on. Oxidation number was checked by salt formation by chemical reaction between $CuSO_4$ solution and sodium hydroxide (NaOH) solution. We observed that the color changed when $H_2SO_4$ was added to the $CuSO_4$ solution. The same effect was obtained when $H_2SO_4$ was mixed with ceria solution; the color of ceria solution changed from white to yellow. However, the color of $NiSO_4$ solution did not show any significant changes. We did observe slight changes in the pH of the solutions in this study. We did not obtain firm evidence to explain the changes observed in this study, but changes in the color of the electrolyte might be caused by interaction of Cu ion and the by-product of ceria. The mechanical properties of the films were examined by nanoindentation, and reaction between ceria and electrolyte presumably affect the mechanical properties of electrodeposited copper films. We also examined their crystal structures and optical properties by X-ray diffraction (XRD) and UV-Vis spectroscopy.

• Applied Chemistry for Engineering
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• v.20 no.2
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• pp.172-176
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• 2009

In this research, we defined the basic structure of soft etching material as $H_2SO_4/H_2O_2$, and used additives as inhibitor, surfactant, and stabilizer. By analyzing influence to surface roughness and change of etching rate related to type and density of additives, we research to develop soft etching material having the same adhesiveness as existing etching material. As a result of research, it is estimated that after densities of $H_2O_2$ and $H_2SO_4$ are 3%, 4% respectively, 500 ppm of amine type 5-Azol, as inhibitor, and 600 ppm of PEI, as surfactant, and 10 ppm of phosphoric acid, as stabilizer, are added, is the most reasonable surface roughness and etching rate. As result of solder test, it is estimated that solder resist ink did not peel away or curl up and have reliable adhesiveness.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.174-174
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• 2011

최근 전자산업의 발전은 형상 면에서 경박 단소화로 급속하게 진행되고 있으며, 전자소자 내부에서의 배선재료로 사용되고 있는 알루미늄(Al) 박막의 두께 역시 얇아지고 있다. 두께가 20nm 이하로 작은 극박막 범위에서 박막의 두께 증가에 따라 전기가 잘 흐르기 시작하는 박막의 최소두께로 정의 되는 유착두께를 실시간으로 측정하는 방법을 구현하고 임의의 금속박막과 기판의 조합에 있어서 각각의 재료에 대한 유착두께를 제공함으로써 향후 미세전자소자의 제작시 배선 재료의 선택에 대한 기초자료를 축적할 수 있다. 또한 금속박막의 증착공정 직전에 기판을 표면처리 하여 기판을 활성화시킬 때 표면처리가 박막의 유착두께에 미치는 영향에 대해 박막의 미세구조 변화 관점에서 연구함으로써 여러 가지 금속박막에 대한 유착두께를 줄일 수 있는 방법을 도출할 수 있다. 본 연구에서는 유리 기판 위에 사진 식각 공정으로 패턴을 형성하였다. 패턴이 형성된 유리 기판은 Sputter에 연결된 4 point probe에 구리 도선으로 연결한 후 DC 마그네트론 스퍼터법으로 Al과 Sn을 증착하면서 실시간으로 시간에 따른 전기저항을 측정을 하였다. 이때 Sputter 내부 진공도는 $4.6{\times}10^{-2}torr$까지 낮춰준 후 Al을 증착 할 때 진공도는 $1.1{\times}10^{-2}torr$로 맞춰주고 Ar 가스를 20 sccm 넣어준다. 이때 Al 박막의 유착 두께는 29.6 nm 이고 Sn 박막의 유착두께는 20.48 nm 이다. 유착 두께를 정의함으로써 전자소자의 크기를 최소화 할 수 있으며 실시간 전기저항 측정을 통한 금속박막의 전기전도 특성과 미세구조에 대한 기초 자료를 제공함으로써 신기술 발전에 공헌할 것이다.